JP4590994B2 - 発光装置およびその製造方法 - Google Patents

発光装置およびその製造方法 Download PDF

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Publication number
JP4590994B2
JP4590994B2 JP2004262906A JP2004262906A JP4590994B2 JP 4590994 B2 JP4590994 B2 JP 4590994B2 JP 2004262906 A JP2004262906 A JP 2004262906A JP 2004262906 A JP2004262906 A JP 2004262906A JP 4590994 B2 JP4590994 B2 JP 4590994B2
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JP
Japan
Prior art keywords
light
light emitting
ceramic substrate
emitting device
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004262906A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006080312A (ja
JP2006080312A5 (enExample
Inventor
邦博 甚目
好伸 末広
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2004262906A priority Critical patent/JP4590994B2/ja
Priority to US11/220,903 priority patent/US7842526B2/en
Publication of JP2006080312A publication Critical patent/JP2006080312A/ja
Publication of JP2006080312A5 publication Critical patent/JP2006080312A5/ja
Application granted granted Critical
Publication of JP4590994B2 publication Critical patent/JP4590994B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Led Device Packages (AREA)
JP2004262906A 2004-09-09 2004-09-09 発光装置およびその製造方法 Expired - Fee Related JP4590994B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004262906A JP4590994B2 (ja) 2004-09-09 2004-09-09 発光装置およびその製造方法
US11/220,903 US7842526B2 (en) 2004-09-09 2005-09-08 Light emitting device and method of producing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004262906A JP4590994B2 (ja) 2004-09-09 2004-09-09 発光装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2006080312A JP2006080312A (ja) 2006-03-23
JP2006080312A5 JP2006080312A5 (enExample) 2008-08-21
JP4590994B2 true JP4590994B2 (ja) 2010-12-01

Family

ID=36159522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004262906A Expired - Fee Related JP4590994B2 (ja) 2004-09-09 2004-09-09 発光装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP4590994B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9985187B2 (en) 2015-10-22 2018-05-29 Toyoda Gosei Co., Ltd. Method of manufacturing light emitting device

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7905635B2 (en) * 2006-04-25 2011-03-15 Koninklijke Phillips Electronics N.V. Immersed LEDs
CN101106856B (zh) * 2006-07-10 2012-01-25 东芝照明技术株式会社 照明装置
EP2087563B1 (en) * 2006-11-15 2014-09-24 The Regents of The University of California Textured phosphor conversion layer light emitting diode
JP5186800B2 (ja) * 2007-04-28 2013-04-24 日亜化学工業株式会社 窒化物半導体発光素子、これを備える発光装置及び窒化物半導体発光素子の製造方法
KR100904178B1 (ko) 2007-07-27 2009-06-23 삼성전기주식회사 조명 기구
JP5109620B2 (ja) * 2007-11-26 2012-12-26 豊田合成株式会社 発光装置、基板装置及び発光装置の製造方法
JP5204585B2 (ja) * 2007-12-13 2013-06-05 パナソニック株式会社 発光装置および照明器具
DE102008035255B4 (de) 2008-07-29 2021-10-07 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
JP2011222751A (ja) * 2010-04-09 2011-11-04 Nippon Electric Glass Co Ltd 波長変換部材およびそれを用いてなる半導体発光素子デバイス
JP5810302B2 (ja) * 2010-06-28 2015-11-11 パナソニックＩｐマネジメント株式会社 発光装置、バックライトユニット、液晶表示装置及び照明装置
JP2012033823A (ja) * 2010-08-02 2012-02-16 Stanley Electric Co Ltd 発光装置およびその製造方法
JP5312556B2 (ja) * 2011-11-07 2013-10-09 京セラ株式会社 発光装置および照明装置
KR101299563B1 (ko) * 2012-08-24 2013-08-23 주식회사 씨티랩 반도체 소자 구조물을 제조하는 방법
JP2014011415A (ja) * 2012-07-03 2014-01-20 Mitsubishi Electric Corp 発光装置及び照明装置及び表示装置
JP5738257B2 (ja) * 2012-10-16 2015-06-17 株式会社エルム 発光装置
JP6152801B2 (ja) * 2014-01-21 2017-06-28 豊田合成株式会社 発光装置及びその製造方法
JP6582754B2 (ja) * 2015-08-31 2019-10-02 日亜化学工業株式会社 複合基板、発光装置、及び発光装置の製造方法
JP7054005B2 (ja) * 2018-09-28 2022-04-13 日亜化学工業株式会社 発光装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5655725Y2 (enExample) * 1976-11-19 1981-12-25
JPH118414A (ja) * 1997-06-18 1999-01-12 Sony Corp 半導体装置および半導体発光装置
JPH11177129A (ja) * 1997-12-16 1999-07-02 Rohm Co Ltd チップ型ｌｅｄ、ｌｅｄランプおよびｌｅｄディスプレイ
JP4789350B2 (ja) * 2001-06-11 2011-10-12 シチズン電子株式会社 発光ダイオードの製造方法
JP2003101077A (ja) * 2001-09-25 2003-04-04 Pentax Corp 発光ダイオード
JP2004207367A (ja) * 2002-12-24 2004-07-22 Toyoda Gosei Co Ltd 発光ダイオード及び発光ダイオード配列板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9985187B2 (en) 2015-10-22 2018-05-29 Toyoda Gosei Co., Ltd. Method of manufacturing light emitting device

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Publication number Publication date
JP2006080312A (ja) 2006-03-23

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