JP4570384B2 - 樹脂接着剤および電子部品収納用パッケージ - Google Patents
樹脂接着剤および電子部品収納用パッケージ Download PDFInfo
- Publication number
- JP4570384B2 JP4570384B2 JP2004095509A JP2004095509A JP4570384B2 JP 4570384 B2 JP4570384 B2 JP 4570384B2 JP 2004095509 A JP2004095509 A JP 2004095509A JP 2004095509 A JP2004095509 A JP 2004095509A JP 4570384 B2 JP4570384 B2 JP 4570384B2
- Authority
- JP
- Japan
- Prior art keywords
- resin adhesive
- electronic component
- resin
- epoxy resin
- quartz particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920005989 resin Polymers 0.000 title claims description 64
- 239000011347 resin Substances 0.000 title claims description 64
- 239000000853 adhesive Substances 0.000 title claims description 63
- 230000001070 adhesive effect Effects 0.000 title claims description 63
- 238000003860 storage Methods 0.000 title claims description 25
- 239000002245 particle Substances 0.000 claims description 54
- 229920000647 polyepoxide Polymers 0.000 claims description 47
- 239000003822 epoxy resin Substances 0.000 claims description 43
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 37
- 239000000945 filler Substances 0.000 claims description 31
- 239000010453 quartz Substances 0.000 claims description 31
- 239000003795 chemical substances by application Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 11
- 150000008065 acid anhydrides Chemical class 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 5
- 238000001723 curing Methods 0.000 description 20
- 239000000463 material Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 11
- 239000000919 ceramic Substances 0.000 description 9
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 9
- 229920002050 silicone resin Polymers 0.000 description 9
- 239000001307 helium Substances 0.000 description 8
- 229910052734 helium Inorganic materials 0.000 description 8
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 239000007789 gas Substances 0.000 description 7
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000011163 secondary particle Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002605 large molecules Chemical class 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Images
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Description
記合成石英粒子全量の18乃至22質量%含むことを特徴とする。
体充填材とを含んでおり、その無機紛体充填材は、平均粒径5〜6μmの球状の合成石英粒子および平均粒径0.5〜0.9μmの破砕石英粒子からなり、合成石英粒子は、粒径12〜24μmのものを合成石英粒子全量の6〜10質量%、粒径1.5〜3μmのものを合成石英粒子
全量の18〜22質量%含むことにより、基体上面に樹脂接着剤を塗布した基体および枠体下面に樹脂接着剤を塗布した枠体を加熱乾燥することにより、半硬化状態で粘着性のない樹脂接着剤が塗布された擬似Bステージの基体および枠体が得られ、基体および枠体の取り扱いが容易となる。その結果、リード端子を挟んで基体と枠体とを重ね合わせて樹脂接着剤を介して接着することにより電子部品収納用パッケージを作製するのが作業性良く行なえ、生産性が向上する。
mのものを合成石英粒子全量の18〜22質量%含む必要がある。
比率が増加することにより、樹脂接着剤4が流れすぎることで、隙間を埋めにくくなり気密不良が発生する点で不都合があり、22質量%を超えると、小粒径のフィラーが多くなることにより樹脂接着剤4の流動性が悪化する不都合がある。
なお、図1において、リード端子2は、基体1の一対の辺の外側で下方に向かって折り曲げられているが、まっすぐ水平に突き出すように設けられていてもよい。
2・・・・・・リード端子
3・・・・・・枠体
4・・・・・・樹脂接着剤
Claims (3)
- 常温で液状のエポキシ樹脂と酸無水物系硬化剤と無機粉体充填材とを含んでおり、該無機紛体充填材は、平均粒径5乃至6μmの球状の合成石英粒子および平均粒径0.5乃至0.9μmの破砕石英粒子からなり、前記合成石英粒子は、粒径12乃至24μmのものを前記合成石英粒子全量の6乃至10質量%、粒径1.5乃至3μmのものを前記合成石英粒子全量の18乃至22質量%含むことを特徴とする樹脂接着剤。
- 前記無機紛体充填材は比表面積が1.8乃至2.2m2/gであることを特徴とする請求項1記載の樹脂接着剤。
- 上面に電子部品の搭載部が形成された基体と、該基体の上面に前記搭載部を囲むとともに間にリード端子を挟んで樹脂接着剤によって接合された枠体とを具備しており、前記樹脂接着剤が請求項1または請求項2記載の樹脂接着剤であることを特徴とする電子部品収納用パッケージ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004095509A JP4570384B2 (ja) | 2004-03-29 | 2004-03-29 | 樹脂接着剤および電子部品収納用パッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004095509A JP4570384B2 (ja) | 2004-03-29 | 2004-03-29 | 樹脂接着剤および電子部品収納用パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005281422A JP2005281422A (ja) | 2005-10-13 |
JP4570384B2 true JP4570384B2 (ja) | 2010-10-27 |
Family
ID=35180175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004095509A Expired - Fee Related JP4570384B2 (ja) | 2004-03-29 | 2004-03-29 | 樹脂接着剤および電子部品収納用パッケージ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4570384B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007077752A1 (ja) * | 2005-12-27 | 2007-07-12 | Sumitomo Electric Industries, Ltd. | 半導体素子搭載部材、その製造方法、及び半導体装置 |
JP5664624B2 (ja) * | 2012-10-03 | 2015-02-04 | Tdk株式会社 | 圧電素子 |
CN106893542A (zh) * | 2017-01-21 | 2017-06-27 | 合肥工业大学 | 一种用于gis电气设备密封的新型环氧纳米复合绝缘材料及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002501956A (ja) * | 1998-01-29 | 2002-01-22 | アルファ・メタルズ・インコーポレーテッド | 無水物/エポキシ樹脂に基づくスナップ硬化性接着剤 |
JP2002129125A (ja) * | 2000-10-20 | 2002-05-09 | Kyocera Corp | 接着材およびこれを用いた電子部品モジュール |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3308381B2 (ja) * | 1994-04-04 | 2002-07-29 | 住友ベークライト株式会社 | エポキシ樹脂組成物 |
JPH08148599A (ja) * | 1994-11-25 | 1996-06-07 | Kyocera Corp | 半導体素子収納用パッケージ |
JP3238340B2 (ja) * | 1996-12-04 | 2001-12-10 | 住友ベークライト株式会社 | 液状エポキシ樹脂封止材料 |
-
2004
- 2004-03-29 JP JP2004095509A patent/JP4570384B2/ja not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002501956A (ja) * | 1998-01-29 | 2002-01-22 | アルファ・メタルズ・インコーポレーテッド | 無水物/エポキシ樹脂に基づくスナップ硬化性接着剤 |
JP2002129125A (ja) * | 2000-10-20 | 2002-05-09 | Kyocera Corp | 接着材およびこれを用いた電子部品モジュール |
Also Published As
Publication number | Publication date |
---|---|
JP2005281422A (ja) | 2005-10-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100467897B1 (ko) | 반도체 장치 및 이의 제조방법 | |
JP5133598B2 (ja) | 封止用熱硬化型接着シート | |
JP3853979B2 (ja) | 半導体装置の製法 | |
JP4537555B2 (ja) | 半導体パッケージの製造方法及び半導体パッケージ | |
JP4206631B2 (ja) | 熱硬化性液状封止樹脂組成物、半導体素子の組立方法及び半導体装置 | |
JPH11150135A (ja) | 熱伝導性が良好な導電性ペースト及び電子部品 | |
JP3999840B2 (ja) | 封止用樹脂シート | |
JPH1030050A (ja) | 半導体封止用熱硬化性樹脂組成物、それを用いた半導体装置およびその製法 | |
JP4570384B2 (ja) | 樹脂接着剤および電子部品収納用パッケージ | |
AU695142B2 (en) | Semiconductor unit package, semiconductor unit packaging method and encapsulant for use in semiconductor unit packaging | |
JPS60189229A (ja) | 半導体素子 | |
JP2002284849A (ja) | 液状樹脂組成物および半導体装置 | |
JP3957244B2 (ja) | 半導体装置の製法 | |
JPH02173073A (ja) | 絶縁ペースト | |
JPH10242211A (ja) | 半導体装置の製法 | |
JP3826745B2 (ja) | コンデンサ封止用エポキシ樹脂組成物及びコンデンサ装置 | |
JP3422446B2 (ja) | 半導体装置の製法 | |
JPH11233560A (ja) | 半導体装置の製法 | |
JP2000174044A (ja) | 半導体素子の組立方法 | |
JP3939849B2 (ja) | 半導体装置の製法 | |
JP2001527112A (ja) | エポキシ型用配合物及び方法 | |
US7041237B2 (en) | Adhesive and electric device | |
JPH0430122B2 (ja) | ||
JPH10150128A (ja) | 半導体装置およびその製法 | |
JPH08316374A (ja) | 半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070213 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100518 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100624 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100713 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100810 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130820 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4570384 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |