JP4568440B2 - フリップチップ型半導体素子および半導体装置 - Google Patents

フリップチップ型半導体素子および半導体装置 Download PDF

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Publication number
JP4568440B2
JP4568440B2 JP2001020002A JP2001020002A JP4568440B2 JP 4568440 B2 JP4568440 B2 JP 4568440B2 JP 2001020002 A JP2001020002 A JP 2001020002A JP 2001020002 A JP2001020002 A JP 2001020002A JP 4568440 B2 JP4568440 B2 JP 4568440B2
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JP
Japan
Prior art keywords
semiconductor device
substrate
chip type
type semiconductor
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001020002A
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English (en)
Japanese (ja)
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JP2002222831A (ja
JP2002222831A5 (https=
Inventor
実 一色
君男 山川
淳二 中西
智子 加藤
勝利 峰
恒雄 花田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Priority to JP2001020002A priority Critical patent/JP4568440B2/ja
Publication of JP2002222831A publication Critical patent/JP2002222831A/ja
Publication of JP2002222831A5 publication Critical patent/JP2002222831A5/ja
Application granted granted Critical
Publication of JP4568440B2 publication Critical patent/JP4568440B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Wire Bonding (AREA)
JP2001020002A 2001-01-29 2001-01-29 フリップチップ型半導体素子および半導体装置 Expired - Fee Related JP4568440B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001020002A JP4568440B2 (ja) 2001-01-29 2001-01-29 フリップチップ型半導体素子および半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001020002A JP4568440B2 (ja) 2001-01-29 2001-01-29 フリップチップ型半導体素子および半導体装置

Publications (3)

Publication Number Publication Date
JP2002222831A JP2002222831A (ja) 2002-08-09
JP2002222831A5 JP2002222831A5 (https=) 2008-01-17
JP4568440B2 true JP4568440B2 (ja) 2010-10-27

Family

ID=18885782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001020002A Expired - Fee Related JP4568440B2 (ja) 2001-01-29 2001-01-29 フリップチップ型半導体素子および半導体装置

Country Status (1)

Country Link
JP (1) JP4568440B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5321270B2 (ja) * 2009-06-17 2013-10-23 信越化学工業株式会社 フリップチップ型半導体装置用シリコーンアンダーフィル材およびそれを使用するフリップチップ型半導体装置
WO2024014314A1 (ja) * 2022-07-13 2024-01-18 ソニーセミコンダクタソリューションズ株式会社 半導体装置、実装基板及び電子機器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6273731A (ja) * 1985-09-27 1987-04-04 Sumitomo Electric Ind Ltd 半導体装置の封止方法
JP2845022B2 (ja) * 1992-04-06 1999-01-13 日本電気株式会社 半導体装置
JPH05275489A (ja) * 1992-03-26 1993-10-22 Hitachi Ltd 電極間の接続構造
JPH10261735A (ja) * 1997-03-18 1998-09-29 Hitachi Ltd 半導体装置およびその製造方法
JP3714444B2 (ja) * 1997-07-23 2005-11-09 新光電気工業株式会社 半導体装置とその製造方法
US5969461A (en) * 1998-04-08 1999-10-19 Cts Corporation Surface acoustic wave device package and method
JP2000031194A (ja) * 1998-07-10 2000-01-28 Fuji Electric Co Ltd ボンディングワイヤおよび半導体装置

Also Published As

Publication number Publication date
JP2002222831A (ja) 2002-08-09

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