JP4568374B1 - 貼付装置及び貼付方法 - Google Patents

貼付装置及び貼付方法 Download PDF

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Publication number
JP4568374B1
JP4568374B1 JP2010058530A JP2010058530A JP4568374B1 JP 4568374 B1 JP4568374 B1 JP 4568374B1 JP 2010058530 A JP2010058530 A JP 2010058530A JP 2010058530 A JP2010058530 A JP 2010058530A JP 4568374 B1 JP4568374 B1 JP 4568374B1
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sheet
roller
sticking
blade
shaped material
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JP2010058530A
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Japanese (ja)
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JP2011192850A (ja
Inventor
健次 宮地
和宏 柿本
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OHMIYA INDUSTRY COMPANY LIMITED
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OHMIYA INDUSTRY COMPANY LIMITED
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Priority to JP2010058530A priority Critical patent/JP4568374B1/ja
Application granted granted Critical
Publication of JP4568374B1 publication Critical patent/JP4568374B1/ja
Priority to KR1020127026024A priority patent/KR101371081B1/ko
Priority to PCT/JP2011/055843 priority patent/WO2011115022A1/fr
Publication of JP2011192850A publication Critical patent/JP2011192850A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
JP2010058530A 2010-03-15 2010-03-15 貼付装置及び貼付方法 Active JP4568374B1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010058530A JP4568374B1 (ja) 2010-03-15 2010-03-15 貼付装置及び貼付方法
KR1020127026024A KR101371081B1 (ko) 2010-03-15 2011-03-11 본딩 장치 및 본딩 방법
PCT/JP2011/055843 WO2011115022A1 (fr) 2010-03-15 2011-03-11 Appareil de collage et procédé de collage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010058530A JP4568374B1 (ja) 2010-03-15 2010-03-15 貼付装置及び貼付方法

Publications (2)

Publication Number Publication Date
JP4568374B1 true JP4568374B1 (ja) 2010-10-27
JP2011192850A JP2011192850A (ja) 2011-09-29

Family

ID=43098840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010058530A Active JP4568374B1 (ja) 2010-03-15 2010-03-15 貼付装置及び貼付方法

Country Status (3)

Country Link
JP (1) JP4568374B1 (fr)
KR (1) KR101371081B1 (fr)
WO (1) WO2011115022A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011115022A1 (fr) * 2010-03-15 2011-09-22 大宮工業株式会社 Appareil de collage et procédé de collage
CN103545168A (zh) * 2012-07-09 2014-01-29 日东电工株式会社 粘合带、粘合带的粘贴方法及粘合带粘贴装置
CN118144300A (zh) * 2024-03-25 2024-06-07 苏州康丽达精密电子有限公司 一种自动上板成型机及其产品

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6088187B2 (ja) * 2012-09-26 2017-03-01 日東電工株式会社 光学表示パネルの連続製造方法及び光学表示パネルの連続製造システム
JP5508508B1 (ja) * 2012-12-04 2014-06-04 大宮工業株式会社 シートの貼付装置
JP6216583B2 (ja) * 2013-09-13 2017-10-18 リンテック株式会社 シート貼付装置および貼付方法
JP6234161B2 (ja) * 2013-10-24 2017-11-22 株式会社ディスコ 粘着テープ貼着装置
JP6373076B2 (ja) * 2014-06-10 2018-08-15 東京応化工業株式会社 貼付装置および貼付方法
CN106151195A (zh) * 2015-04-10 2016-11-23 福耀玻璃(湖北)有限公司 一种用于汽车玻璃生产线的防爆带安装工装
JP6779579B2 (ja) * 2017-01-31 2020-11-04 株式会社ディスコ 判定方法、測定装置、及び粘着テープ貼着装置
JP2018133446A (ja) * 2017-02-15 2018-08-23 株式会社ディスコ テープ貼着装置
KR102393037B1 (ko) * 2021-09-23 2022-05-09 박성호 Dfr 필름 커팅 장치 및 이를 구비한 dfr 필름 제조 시스템

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06278099A (ja) * 1993-03-26 1994-10-04 Dainippon Printing Co Ltd 包装袋裁断装置及び該装置のロータリーダイロール
JP2004291127A (ja) * 2003-03-26 2004-10-21 Mitsubishi Materials Corp ロータリーダイ
JP2005116928A (ja) * 2003-10-10 2005-04-28 Lintec Corp マウント装置及びマウント方法
JP2007165363A (ja) * 2005-12-09 2007-06-28 Lintec Corp テープ貼付装置、マウント装置及びマウント方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006044152A (ja) 2004-08-06 2006-02-16 Nitto Denko Corp 粘着フィルム貼着装置
JP4568374B1 (ja) * 2010-03-15 2010-10-27 大宮工業株式会社 貼付装置及び貼付方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06278099A (ja) * 1993-03-26 1994-10-04 Dainippon Printing Co Ltd 包装袋裁断装置及び該装置のロータリーダイロール
JP2004291127A (ja) * 2003-03-26 2004-10-21 Mitsubishi Materials Corp ロータリーダイ
JP2005116928A (ja) * 2003-10-10 2005-04-28 Lintec Corp マウント装置及びマウント方法
JP2007165363A (ja) * 2005-12-09 2007-06-28 Lintec Corp テープ貼付装置、マウント装置及びマウント方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011115022A1 (fr) * 2010-03-15 2011-09-22 大宮工業株式会社 Appareil de collage et procédé de collage
CN103545168A (zh) * 2012-07-09 2014-01-29 日东电工株式会社 粘合带、粘合带的粘贴方法及粘合带粘贴装置
JP2014017357A (ja) * 2012-07-09 2014-01-30 Nitto Denko Corp 粘着テープ、粘着テープの貼付け方法および粘着テープ貼付け装置
TWI614826B (zh) * 2012-07-09 2018-02-11 日東電工股份有限公司 黏著帶、黏著帶貼附方法及黏著帶貼附裝置
CN118144300A (zh) * 2024-03-25 2024-06-07 苏州康丽达精密电子有限公司 一种自动上板成型机及其产品

Also Published As

Publication number Publication date
KR101371081B1 (ko) 2014-03-10
JP2011192850A (ja) 2011-09-29
KR20120128706A (ko) 2012-11-27
WO2011115022A1 (fr) 2011-09-22

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