WO2006027953A1 - Applicateur de bande, dispositif de fixation de bande et procede de fixation de bande - Google Patents

Applicateur de bande, dispositif de fixation de bande et procede de fixation de bande Download PDF

Info

Publication number
WO2006027953A1
WO2006027953A1 PCT/JP2005/015317 JP2005015317W WO2006027953A1 WO 2006027953 A1 WO2006027953 A1 WO 2006027953A1 JP 2005015317 W JP2005015317 W JP 2005015317W WO 2006027953 A1 WO2006027953 A1 WO 2006027953A1
Authority
WO
WIPO (PCT)
Prior art keywords
tape
device
ring frame
dicing tape
base material
Prior art date
Application number
PCT/JP2005/015317
Other languages
English (en)
Japanese (ja)
Inventor
Masaki Tsujimoto
Takahisa Yoshioka
Kenji Kobayashi
Original Assignee
Lintec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2004258078A priority Critical patent/JP4723216B2/ja
Priority to JP2004-258078 priority
Application filed by Lintec Corporation filed Critical Lintec Corporation
Publication of WO2006027953A1 publication Critical patent/WO2006027953A1/fr

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386Separation by peeling
    • H01L2221/6839Separation by peeling using peeling wedge or knife or bar
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Abstract

Applicateur de bande, dispositif de fixation de bande (10) capable de fixer une tranche à semi-conducteur (W) sur un cadre annulaire (RF) en enlevant une bande en dé (DT) formée en réalisant des fentes fermées en boucle (C) dans un matériau de base en bande (TB) dans un processus destiné à produire un tissu en bande (L) et procédé de fixation de bande. Le tissu (L) est contrôlé par un dispositif d’inspection (14) pour vérifier si oui ou non le matériau de base en bande provoque des défauts tels qu’un endommagement, avant que les fentes (C) ne soient formées. Si un défaut est détecté par le dispositif d'inspection, les fentes (C) sont formées en dehors de la partie défectueuse du matériau de base en bande.
PCT/JP2005/015317 2004-09-06 2005-08-24 Applicateur de bande, dispositif de fixation de bande et procede de fixation de bande WO2006027953A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004258078A JP4723216B2 (ja) 2004-09-06 2004-09-06 テープ貼付装置、マウント装置及びマウント方法
JP2004-258078 2004-09-06

Publications (1)

Publication Number Publication Date
WO2006027953A1 true WO2006027953A1 (fr) 2006-03-16

Family

ID=36036241

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2005/015317 WO2006027953A1 (fr) 2004-09-06 2005-08-24 Applicateur de bande, dispositif de fixation de bande et procede de fixation de bande

Country Status (3)

Country Link
JP (1) JP4723216B2 (fr)
TW (1) TW200618087A (fr)
WO (1) WO2006027953A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007317886A (ja) * 2006-05-25 2007-12-06 Lintec Corp シート貼付装置及び貼付方法
JP2009033074A (ja) * 2007-07-31 2009-02-12 Lintec Corp シート貼付装置

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4884075B2 (ja) * 2006-05-22 2012-02-22 株式会社東京精密 テープ貼付方法およびテープ貼付装置
JP2007313765A (ja) * 2006-05-26 2007-12-06 Lintec Corp 積層シート製造装置および積層シート製造方法
JP4787713B2 (ja) * 2006-10-10 2011-10-05 リンテック株式会社 シート貼付装置及び貼付方法
JP4616231B2 (ja) * 2006-10-30 2011-01-19 リンテック株式会社 シート貼付装置及び貼付方法
JP4913550B2 (ja) * 2006-11-07 2012-04-11 リンテック株式会社 シート貼付装置及び貼付方法
JP5002267B2 (ja) 2007-01-15 2012-08-15 株式会社新川 ダイボンダとダイボンダの熱圧着テープ片切り出し及び貼り付け方法及びプログラム
JP4713541B2 (ja) * 2007-06-04 2011-06-29 リンテック株式会社 シート貼付装置
JP5139004B2 (ja) * 2007-08-21 2013-02-06 リンテック株式会社 シート切断装置
JP4922140B2 (ja) * 2007-12-03 2012-04-25 リンテック株式会社 シート貼付装置及び貼付方法
JP5412260B2 (ja) * 2009-12-10 2014-02-12 日東電工株式会社 粘着テープ貼付け方法およびこれを用いた装置
US8574398B2 (en) * 2010-05-27 2013-11-05 Suss Microtec Lithography, Gmbh Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers
JP2014017357A (ja) * 2012-07-09 2014-01-30 Nitto Denko Corp 粘着テープ、粘着テープの貼付け方法および粘着テープ貼付け装置
JP5981822B2 (ja) * 2012-09-27 2016-08-31 リンテック株式会社 シート貼付装置およびシート貼付方法
JP6054466B2 (ja) * 2015-05-15 2016-12-27 リンテック株式会社 シート製造装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151528A (ja) * 2000-11-14 2002-05-24 Lintec Corp ダイボンディングシート貼着装置およびダイボンディングシートの貼着方法
JP2003062906A (ja) * 2001-08-27 2003-03-05 Hitachi Industries Co Ltd フィルムラミネート方法とその装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57138151A (en) * 1981-02-20 1982-08-26 Shinkawa Ltd Bonding method for tape
EP1115152A4 (fr) * 1997-07-18 2001-08-29 Hitachi Chemical Co Ltd Ruban adhesif perfore pour semi-conducteur, fabrication d'araignee de connexions avec le ruban adhesif, araignee de connexions avec le ruban adhesif, et dispositif a semi-conducteurs comportant cette araignee de connexions

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151528A (ja) * 2000-11-14 2002-05-24 Lintec Corp ダイボンディングシート貼着装置およびダイボンディングシートの貼着方法
JP2003062906A (ja) * 2001-08-27 2003-03-05 Hitachi Industries Co Ltd フィルムラミネート方法とその装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007317886A (ja) * 2006-05-25 2007-12-06 Lintec Corp シート貼付装置及び貼付方法
JP2009033074A (ja) * 2007-07-31 2009-02-12 Lintec Corp シート貼付装置

Also Published As

Publication number Publication date
JP4723216B2 (ja) 2011-07-13
TW200618087A (en) 2006-06-01
JP2006073920A (ja) 2006-03-16

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