JP4563170B2 - 電気回路パターンの製造方法及びシステム - Google Patents
電気回路パターンの製造方法及びシステム Download PDFInfo
- Publication number
- JP4563170B2 JP4563170B2 JP2004502684A JP2004502684A JP4563170B2 JP 4563170 B2 JP4563170 B2 JP 4563170B2 JP 2004502684 A JP2004502684 A JP 2004502684A JP 2004502684 A JP2004502684 A JP 2004502684A JP 4563170 B2 JP4563170 B2 JP 4563170B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electrical circuit
- pattern
- image
- alignment target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B15/00—Systems controlled by a computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Treatment Of Fiber Materials (AREA)
Description
40 画像
46 画像の不均一に変更されたバージョン
80 電気回路パターン
82 アライメントターゲット
Claims (4)
- 複数の個別の多層プリント回路が形成される多層プリント回路ボードにおいて、電気回路パターンをレーザダイレクトイメージングシステムを用いて製造する方法であって、以下の(a)〜(e)の工程を有する電気回路パターンの製造方法。
(a)第1の絶縁性基板上における、複数の多層プリント回路形成領域毎に、第1の電気回路パターン部及び第1のアライメントターゲットを製造する工程。
(b)前記第1の電気回路パターン部及び第1のアライメントターゲットが製造された第1の絶縁性基板上に、第2の絶縁性基板、金属箔、及び、感光性のフォトレジストを形成する工程。
(c)前記複数の多層プリント回路形成領域毎に前記第1のアライメントターゲットを認識し、認識された前記第1のアライメントターゲットと、予定バージョンCAM画像におけるアライメントターゲットとの間の位置の差を求める工程。
(d)予め作成された参照テーブルと、前記位置の差とを対応させることで、前記複数の多層プリント回路形成領域毎に不均一に変更された露光を行うための制御ファイルを、前記参照テーブルから生成する工程。
(e)前記予定バージョンCAM画像と、前記制御ファイルに基づき、レーザダイレクトイメージングシステムによりレーザ走査条件を変更しながらレーザを走査することで、前記予定バージョンCAM画像におけるアライメントターゲットが前記第1のアライメントターゲットに対応する場所上に走査された電気回路パターンを露光する工程。 - 走査方向に前記レーザを走査するための前記レーザ走査条件の変更は、
クロック信号をクロック変更器に入力する工程と、
前記参照テーブルから生成された制御ファイルに基づき前記クロック信号を変更して、変更されたクロック信号を生成する工程と、
前記変更されたクロック信号と、前記予定バージョンCAM画像とを変調器に入力して、変調データ信号を生成する工程と、
前記変更されたクロック信号を用いてクロックされる前記変調データ信号を用いて前記レーザを走査する工程と、を有することを特徴とする請求項1に記載の電気回路パターンの製造方法。 - 交差走査方向に前記レーザを走査するための前記レーザ走査条件は、前記参照テーブルの内容に基づいた速度で前記交差走査方向に前記多層プリント回路ボードを動かすことにより変更されることを特徴とする請求項1に記載の電気回路パターンの製造方法。
- 複数の個別の多層プリント回路が形成される多層プリント回路ボードにおいて、電気回路パターンを製造する装置を含み、以下の(a)〜(e)の手段を有する電気回路パターンの製造システム。
(a)第1の絶縁性基板上における、複数の多層プリント回路形成領域毎に、第1の電気回路パターン部及び第1のアライメントターゲットを製造する手段。
(b)前記第1の電気回路パターン部及び第1のアライメントターゲットが製造された第1の絶縁性基板上に、第2の絶縁性基板、金属箔、及び、感光性のフォトレジストを形成する手段。
(c)前記複数の多層プリント回路形成領域毎に前記第1のアライメントターゲットを認識し、認識された前記第1のアライメントターゲットと、予定バージョンCAM画像におけるアライメントターゲットとの間の位置の差を求める手段。
(d)予め作成された参照テーブルと、前記位置の差とを対応させることで、前記複数の多層プリント回路形成領域毎に不均一に変更された露光を行うための制御ファイルを、前記参照テーブルから生成する手段。
(e)前記予定バージョンCAM画像と、前記制御ファイルに基づき、レーザダイレクトイメージングシステムによりレーザ走査条件を変更しながらレーザを走査することで、前記予定バージョンCAM画像におけるアライメントターゲットが前記第1のアライメントターゲットに対応する場所上に走査された電気回路パターンを露光する手段。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37687402P | 2002-05-02 | 2002-05-02 | |
PCT/IL2003/000356 WO2003094582A2 (en) | 2002-05-02 | 2003-05-01 | A system and method for manufacturing printed circuit boards employing non-uniformly modified images |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005524982A JP2005524982A (ja) | 2005-08-18 |
JP4563170B2 true JP4563170B2 (ja) | 2010-10-13 |
Family
ID=29401417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004502684A Expired - Lifetime JP4563170B2 (ja) | 2002-05-02 | 2003-05-01 | 電気回路パターンの製造方法及びシステム |
Country Status (7)
Country | Link |
---|---|
US (1) | US7508515B2 (ja) |
JP (1) | JP4563170B2 (ja) |
KR (1) | KR100983748B1 (ja) |
CN (1) | CN100480620C (ja) |
AU (1) | AU2003224400A1 (ja) |
DE (1) | DE10392578T5 (ja) |
WO (1) | WO2003094582A2 (ja) |
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TW200704146A (en) * | 2005-02-21 | 2007-01-16 | Fuji Photo Film Co Ltd | Plotting method, plotting device, plotting system and correction method |
JP2006259715A (ja) * | 2005-02-21 | 2006-09-28 | Fuji Photo Film Co Ltd | 描画方法、描画装置、描画システムおよび補正方法 |
CN1306244C (zh) * | 2005-06-16 | 2007-03-21 | 姚晓栋 | 基于数字影像的印制线路板现场测试方法 |
GB0517929D0 (en) * | 2005-09-02 | 2005-10-12 | Xaar Technology Ltd | Method of printing |
TWI270656B (en) * | 2005-11-29 | 2007-01-11 | Machvision Inc | Analysis method for sag or protrusion of copper-filled micro via |
JP4143101B2 (ja) * | 2006-08-10 | 2008-09-03 | アドバンスド・マスク・インスペクション・テクノロジー株式会社 | 試料検査装置、画像位置合わせ方法、位置ずれ量推定方法及びプログラム |
US7847938B2 (en) * | 2007-10-01 | 2010-12-07 | Maskless Lithography, Inc. | Alignment system for optical lithography |
US8482732B2 (en) * | 2007-10-01 | 2013-07-09 | Maskless Lithography, Inc. | Alignment system for various materials and material flows |
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-
2003
- 2003-05-01 US US10/513,058 patent/US7508515B2/en not_active Expired - Lifetime
- 2003-05-01 KR KR1020047017651A patent/KR100983748B1/ko active IP Right Grant
- 2003-05-01 WO PCT/IL2003/000356 patent/WO2003094582A2/en active Application Filing
- 2003-05-01 CN CNB038126613A patent/CN100480620C/zh not_active Expired - Lifetime
- 2003-05-01 JP JP2004502684A patent/JP4563170B2/ja not_active Expired - Lifetime
- 2003-05-01 AU AU2003224400A patent/AU2003224400A1/en not_active Abandoned
- 2003-05-01 DE DE10392578T patent/DE10392578T5/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
AU2003224400A8 (en) | 2003-11-17 |
CN1659417A (zh) | 2005-08-24 |
AU2003224400A1 (en) | 2003-11-17 |
KR20040104693A (ko) | 2004-12-10 |
KR100983748B1 (ko) | 2010-09-24 |
US7508515B2 (en) | 2009-03-24 |
WO2003094582A3 (en) | 2005-02-17 |
US20050213806A1 (en) | 2005-09-29 |
CN100480620C (zh) | 2009-04-22 |
DE10392578T5 (de) | 2005-05-12 |
WO2003094582A2 (en) | 2003-11-13 |
JP2005524982A (ja) | 2005-08-18 |
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