JP4551776B2 - 両面fpc - Google Patents
両面fpc Download PDFInfo
- Publication number
- JP4551776B2 JP4551776B2 JP2005009607A JP2005009607A JP4551776B2 JP 4551776 B2 JP4551776 B2 JP 4551776B2 JP 2005009607 A JP2005009607 A JP 2005009607A JP 2005009607 A JP2005009607 A JP 2005009607A JP 4551776 B2 JP4551776 B2 JP 4551776B2
- Authority
- JP
- Japan
- Prior art keywords
- double
- sided fpc
- contact
- conductor pattern
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims description 105
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 29
- 239000011889 copper foil Substances 0.000 claims description 29
- 238000007747 plating Methods 0.000 description 24
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 22
- 239000010931 gold Substances 0.000 description 22
- 229910052737 gold Inorganic materials 0.000 description 22
- 239000010410 layer Substances 0.000 description 21
- 239000004642 Polyimide Substances 0.000 description 12
- 229920001721 polyimide Polymers 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920003055 poly(ester-imide) Polymers 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structure Of Printed Boards (AREA)
Description
1a ベース
1b・1c 銅箔
1d・1e カバーレイ
10 端末部
11 第1導体パターン
11s 領域(第2コンタクトの接点と対向する領域)
12 第2導体パターン
12s 領域(第1コンタクトの接点と対向する領域)
Claims (3)
- 絶縁性のベースの両面に積層される第1及び第2銅箔がエッチングされた複数の第1及び第2導体パターンと、
これらの第1及び第2導体パターンを被覆すると共に、コネクタと接続されるための端末部では、複数の前記第1及び第2導体パターンを露出させた絶縁性のカバーレイと、備え、
前記端末部の一方の面に配置された複数の前記第1導体パターンは、前記端末部の他方の面に配置された複数の前記第2導体パターンと半ピッチ分ずらされて並設配置され、
前記第1導体パターンは、前記コネクタに設けた第1コンタクトの接点で加圧され、
前記第2導体パターンは、前記コネクタに設けた第2コンタクトの接点で加圧され、
前記第1導体パターンは、前記第2コンタクトの接点と対向すると共に、当該第1導体パターンから前記端末部の幅方向に前記第1銅箔を延出して補強する第1領域を一端部に有し、
前記第2導体パターンは、前記第1コンタクトの接点と対向すると共に、当該第2導体パターンから前記端末部の幅方向に前記第2銅箔を延出して補強する第2領域を他端部に有する両面FPC。 - 前記ベースの板厚が25μmである請求項1記載の両面FPC。
- 前記端末部における第1及び第2導体パターンのピッチが0.4mmである請求項1又は2記載の両面FPC。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005009607A JP4551776B2 (ja) | 2005-01-17 | 2005-01-17 | 両面fpc |
US11/330,157 US7301104B2 (en) | 2005-01-17 | 2006-01-12 | Double-sided flexible printed circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005009607A JP4551776B2 (ja) | 2005-01-17 | 2005-01-17 | 両面fpc |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006196849A JP2006196849A (ja) | 2006-07-27 |
JP4551776B2 true JP4551776B2 (ja) | 2010-09-29 |
Family
ID=36682704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005009607A Expired - Fee Related JP4551776B2 (ja) | 2005-01-17 | 2005-01-17 | 両面fpc |
Country Status (2)
Country | Link |
---|---|
US (1) | US7301104B2 (ja) |
JP (1) | JP4551776B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11757137B2 (en) | 2018-01-10 | 2023-09-12 | Samsung Sdi Co., Ltd. | Battery pack |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4063779B2 (ja) * | 2004-02-27 | 2008-03-19 | 三洋電機株式会社 | Pll回路 |
JP4584006B2 (ja) * | 2005-04-12 | 2010-11-17 | 日本メクトロン株式会社 | 可撓性回路基板 |
TWI367058B (en) * | 2006-06-12 | 2012-06-21 | Au Optronics Corp | Circuit board |
JP4560026B2 (ja) * | 2006-10-04 | 2010-10-13 | セイコーエプソン株式会社 | フレキシブル基板及びこれを備えた電気光学装置、並びに電子機器 |
US20080083554A1 (en) * | 2006-10-04 | 2008-04-10 | International Business Machines Corporation | Hybrid bonded flex circuit |
DE102007004642A1 (de) * | 2007-01-25 | 2008-08-07 | Siemens Home And Office Communication Devices Gmbh & Co. Kg | Flexible Leiterplattenfolie mit zwei Kupferlagen |
US7722398B2 (en) * | 2007-04-13 | 2010-05-25 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector assembly with a protecting section over a flexible printed circuit board connected thereto |
CN105140136B (zh) * | 2009-03-30 | 2018-02-13 | 高通股份有限公司 | 使用顶部后钝化技术和底部结构技术的集成电路芯片 |
JP5342341B2 (ja) * | 2009-06-23 | 2013-11-13 | 株式会社フジクラ | プリント配線基板 |
EP2446808A4 (en) * | 2009-06-25 | 2013-01-02 | Olympus Medical Systems Corp | IMAGE CAPTURE UNIT |
TWI434626B (zh) * | 2011-07-21 | 2014-04-11 | Au Optronics Corp | 軟性電路板 |
TWI413315B (zh) | 2011-08-30 | 2013-10-21 | Wistron Corp | 連接器及其電子裝置 |
JP5966875B2 (ja) * | 2012-11-16 | 2016-08-10 | 富士通株式会社 | コネクタ及びフレキシブルプリント基板 |
US8920188B2 (en) * | 2013-02-27 | 2014-12-30 | Silicon Image, Inc. | Integrated connector/flex cable |
JP5697724B2 (ja) * | 2013-09-05 | 2015-04-08 | 株式会社フジクラ | プリント配線板及び該配線板を接続するコネクタ |
JP5559925B1 (ja) * | 2013-09-05 | 2014-07-23 | 株式会社フジクラ | プリント配線板及び該配線板を接続するコネクタ |
JP5779624B2 (ja) * | 2013-09-05 | 2015-09-16 | 株式会社フジクラ | プリント配線板及び該配線板を接続するコネクタ |
JP6190345B2 (ja) | 2014-09-22 | 2017-08-30 | 株式会社フジクラ | プリント配線板 |
CN106951117B (zh) * | 2017-03-13 | 2023-01-10 | 安徽精卓光显技术有限责任公司 | 触控元件及其制作方法 |
JP6383830B2 (ja) * | 2017-04-03 | 2018-08-29 | 株式会社フジクラ | プリント配線板 |
KR102316563B1 (ko) * | 2017-05-22 | 2021-10-25 | 엘지디스플레이 주식회사 | 금속으로 형성된 상부 기판을 포함하는 유기 발광 표시 장치 및 이의 제조 방법 |
CN108012406A (zh) * | 2017-12-06 | 2018-05-08 | 广州兴森快捷电路科技有限公司 | 可拉伸的fpc板及其制作方法 |
KR102404752B1 (ko) * | 2018-01-25 | 2022-05-31 | 주식회사 엘지에너지솔루션 | 단락 방지 기능이 개선된 플랫 케이블 |
CN108241240B (zh) * | 2018-02-08 | 2021-05-14 | 上海天马微电子有限公司 | 一种显示面板以及显示装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62109475U (ja) * | 1985-12-27 | 1987-07-13 | ||
JPH10303521A (ja) * | 1997-04-23 | 1998-11-13 | Hitachi Ltd | 伝送線路基板 |
JPH1154219A (ja) * | 1997-08-05 | 1999-02-26 | Tokai Rubber Ind Ltd | 電気コネクタおよびそれに用いる接続ガイド |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4798918A (en) * | 1987-09-21 | 1989-01-17 | Intel Corporation | High density flexible circuit |
DE69230660T2 (de) * | 1991-10-29 | 2000-12-07 | Sumitomo Wiring Systems, Ltd. | Kabelbaum |
US5274195A (en) * | 1992-06-02 | 1993-12-28 | Advanced Circuit Technology, Inc. | Laminated conductive material, multiple conductor cables and methods of manufacturing such cables |
JPH06132666A (ja) | 1992-10-20 | 1994-05-13 | Hitachi Ltd | 多層フレキシブルプリント基板及びその製造方法 |
JPH0837351A (ja) * | 1994-07-21 | 1996-02-06 | Amp Japan Ltd | フレキシブル回路板ハーネス装置及びそれに使用されるフレキシブル回路板 |
JP4073557B2 (ja) * | 1998-10-13 | 2008-04-09 | 株式会社アイペックス | フレキシブル印刷配線基板用コネクタ |
JP2000156262A (ja) * | 1998-11-19 | 2000-06-06 | Kenwood Corp | コネクタ接続構造 |
JP2002094203A (ja) | 2000-09-11 | 2002-03-29 | Nec Yonezawa Ltd | フレキシブル回路板および同用コネクタ |
JP4443105B2 (ja) | 2002-11-21 | 2010-03-31 | 沖電線株式会社 | フライングテール付き多層基板及び多層積層体の製造方法 |
JP3840180B2 (ja) * | 2002-12-26 | 2006-11-01 | 住友電工プリントサーキット株式会社 | フレキシブルプリント配線板 |
JP4276881B2 (ja) | 2003-04-30 | 2009-06-10 | 日本圧着端子製造株式会社 | 多層プリント配線板の接続構造 |
JP4276882B2 (ja) | 2003-04-30 | 2009-06-10 | 日本圧着端子製造株式会社 | 多層プリント配線板の接続構造 |
-
2005
- 2005-01-17 JP JP2005009607A patent/JP4551776B2/ja not_active Expired - Fee Related
-
2006
- 2006-01-12 US US11/330,157 patent/US7301104B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62109475U (ja) * | 1985-12-27 | 1987-07-13 | ||
JPH10303521A (ja) * | 1997-04-23 | 1998-11-13 | Hitachi Ltd | 伝送線路基板 |
JPH1154219A (ja) * | 1997-08-05 | 1999-02-26 | Tokai Rubber Ind Ltd | 電気コネクタおよびそれに用いる接続ガイド |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11757137B2 (en) | 2018-01-10 | 2023-09-12 | Samsung Sdi Co., Ltd. | Battery pack |
Also Published As
Publication number | Publication date |
---|---|
US20060157271A1 (en) | 2006-07-20 |
US7301104B2 (en) | 2007-11-27 |
JP2006196849A (ja) | 2006-07-27 |
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