JP4544911B2 - 処理装置およびプリント基板の生産方法 - Google Patents

処理装置およびプリント基板の生産方法 Download PDF

Info

Publication number
JP4544911B2
JP4544911B2 JP2004162632A JP2004162632A JP4544911B2 JP 4544911 B2 JP4544911 B2 JP 4544911B2 JP 2004162632 A JP2004162632 A JP 2004162632A JP 2004162632 A JP2004162632 A JP 2004162632A JP 4544911 B2 JP4544911 B2 JP 4544911B2
Authority
JP
Japan
Prior art keywords
processing
circuit board
printed circuit
processing unit
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004162632A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005342813A (ja
Inventor
徹 石井
卓也 原
伊藤　　猛
敬一郎 笹岑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Fine Technologies Co Ltd
Original Assignee
Yamaha Fine Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Fine Technologies Co Ltd filed Critical Yamaha Fine Technologies Co Ltd
Priority to JP2004162632A priority Critical patent/JP4544911B2/ja
Priority to TW094117276A priority patent/TWI279303B/zh
Priority to CN 200520012467 priority patent/CN2862133Y/zh
Priority to CN 200510075976 priority patent/CN1704859B/zh
Priority to KR1020050044991A priority patent/KR100681295B1/ko
Publication of JP2005342813A publication Critical patent/JP2005342813A/ja
Application granted granted Critical
Publication of JP4544911B2 publication Critical patent/JP4544911B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Numerical Control (AREA)
JP2004162632A 2004-05-31 2004-05-31 処理装置およびプリント基板の生産方法 Expired - Fee Related JP4544911B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004162632A JP4544911B2 (ja) 2004-05-31 2004-05-31 処理装置およびプリント基板の生産方法
TW094117276A TWI279303B (en) 2004-05-31 2005-05-26 Processing apparatus, method for producing printed circuit board, and processing program
CN 200520012467 CN2862133Y (zh) 2004-05-31 2005-05-27 处理装置
CN 200510075976 CN1704859B (zh) 2004-05-31 2005-05-27 处理装置和印刷基板的生产方法
KR1020050044991A KR100681295B1 (ko) 2004-05-31 2005-05-27 프린트 기판의 처리 장치, 프린트 기판의 생산 방법 및 처리 프로그램을 기록한 컴퓨터로 판독가능한 기록매체

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004162632A JP4544911B2 (ja) 2004-05-31 2004-05-31 処理装置およびプリント基板の生産方法

Publications (2)

Publication Number Publication Date
JP2005342813A JP2005342813A (ja) 2005-12-15
JP4544911B2 true JP4544911B2 (ja) 2010-09-15

Family

ID=35495649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004162632A Expired - Fee Related JP4544911B2 (ja) 2004-05-31 2004-05-31 処理装置およびプリント基板の生産方法

Country Status (2)

Country Link
JP (1) JP4544911B2 (zh)
CN (2) CN2862133Y (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4544911B2 (ja) * 2004-05-31 2010-09-15 ヤマハファインテック株式会社 処理装置およびプリント基板の生産方法
WO2009005145A1 (ja) * 2007-07-04 2009-01-08 Mitsubishi Electric Corporation レーザ加工装置、加工制御装置および加工装置
CN102198670B (zh) * 2010-03-22 2013-10-02 宏恒胜电子科技（淮安）有限公司 板材裁切系统
JP5282137B2 (ja) 2011-12-06 2013-09-04 ヤマハ発動機株式会社 基板作業装置
TWI458587B (zh) * 2012-01-17 2014-11-01 Chin Yen Wang 位置校正裝置
CN107322679A (zh) * 2017-08-08 2017-11-07 苏州维信电子有限公司 柔性电路板冲孔机及冲孔工艺

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5748421A (en) * 1980-09-02 1982-03-19 Nec Corp Tapping machine
JPS62287310A (ja) * 1986-06-06 1987-12-14 S G:Kk マルチヘツド型位置検出装置及び位置制御装置
JPH0798608A (ja) * 1993-09-28 1995-04-11 Toyoda Mach Works Ltd ２トーチ型レーザ加工機の加工経路決定装置
JP2000108093A (ja) * 1998-09-30 2000-04-18 Uht Corp テープ状物の穿孔機
JP2000158390A (ja) * 1998-11-26 2000-06-13 Hitachi Via Mechanics Ltd プリント基板加工機
JP2003131714A (ja) * 2000-11-13 2003-05-09 Sumitomo Heavy Ind Ltd 加工計画方法、装置、及び、そのための加工データ作成方法、装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4544911B2 (ja) * 2004-05-31 2010-09-15 ヤマハファインテック株式会社 処理装置およびプリント基板の生産方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5748421A (en) * 1980-09-02 1982-03-19 Nec Corp Tapping machine
JPS62287310A (ja) * 1986-06-06 1987-12-14 S G:Kk マルチヘツド型位置検出装置及び位置制御装置
JPH0798608A (ja) * 1993-09-28 1995-04-11 Toyoda Mach Works Ltd ２トーチ型レーザ加工機の加工経路決定装置
JP2000108093A (ja) * 1998-09-30 2000-04-18 Uht Corp テープ状物の穿孔機
JP2000158390A (ja) * 1998-11-26 2000-06-13 Hitachi Via Mechanics Ltd プリント基板加工機
JP2003131714A (ja) * 2000-11-13 2003-05-09 Sumitomo Heavy Ind Ltd 加工計画方法、装置、及び、そのための加工データ作成方法、装置

Also Published As

Publication number Publication date
CN1704859B (zh) 2010-04-28
CN2862133Y (zh) 2007-01-24
CN1704859A (zh) 2005-12-07
JP2005342813A (ja) 2005-12-15

Similar Documents

Publication Publication Date Title
JP6619019B2 (ja) 対基板作業システム、および挿入方法
JP4544911B2 (ja) 処理装置およびプリント基板の生産方法
EP3319408B1 (en) Substrate work machine and recognition method
CN107538138B (zh) 激光加工装置
JPWO2017060974A1 (ja) 切断・屈曲装置、および切断装置
KR20090013064A (ko) 작업물 위치 결정 장치
JP4343391B2 (ja) ワークの加工装置
KR100681295B1 (ko) 프린트 기판의 처리 장치, 프린트 기판의 생산 방법 및 처리 프로그램을 기록한 컴퓨터로 판독가능한 기록매체
JP4514519B2 (ja) プリント基板の生産方法、処理装置および処理プログラム
WO2018029844A1 (ja) 対基板作業機
JP4514690B2 (ja) コネクタ部の打ち抜き装置、コネクタ部の打ち抜き方法およびコネクタ部の打ち抜き方法を実現するためのプログラム
JP7411099B2 (ja) 部品実装機
JP5597328B2 (ja) カッティングプロッタ、およびそれを用いたカッティング方法
JP6886102B2 (ja) レーザ加工方法
JPWO2017085810A1 (ja) 対基板作業機、および挿入方法
JP6415109B2 (ja) ワーク加工装置
WO2021161458A1 (ja) 部品実装プログラム
WO2022064701A1 (ja) 演算装置、および屈曲方法
JP6314054B2 (ja) レーザ加工システムにおける自動プログラミング装置
JP2005028432A (ja) 板材加工機における板材寸法測定方法およびワーククランプ位置決定方法並びにその方法に用いるワーククランプ装置
JPH069767B2 (ja) ワイヤ・カット装置におけるワイヤの垂直出し方法
JP2020136599A (ja) データ作成装置、決定装置、装着作業機、及び、装着作業実行方法
JP2007283367A (ja) 板材生産制御装置
JP2007121172A (ja) 帯状パターンの中心線形成装置、帯状パターンの中心線形成方法および帯状パターンの中心線形成方法を実現するためのプログラム
JP2003053571A (ja) レーザ加工方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20061211

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100112

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100315

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100428

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100609

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100629

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100629

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130709

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4544911

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees