JP4526937B2 - 半導体製造テープ用帯電防止基材フィルム - Google Patents

半導体製造テープ用帯電防止基材フィルム Download PDF

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Publication number
JP4526937B2
JP4526937B2 JP2004350471A JP2004350471A JP4526937B2 JP 4526937 B2 JP4526937 B2 JP 4526937B2 JP 2004350471 A JP2004350471 A JP 2004350471A JP 2004350471 A JP2004350471 A JP 2004350471A JP 4526937 B2 JP4526937 B2 JP 4526937B2
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JP
Japan
Prior art keywords
resin composition
ethylene
copolymer
film
antistatic
Prior art date
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Expired - Lifetime
Application number
JP2004350471A
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English (en)
Japanese (ja)
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JP2006165071A5 (enExample
JP2006165071A (ja
Inventor
秀一 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Achilles Corp
Original Assignee
Achilles Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Achilles Corp filed Critical Achilles Corp
Priority to JP2004350471A priority Critical patent/JP4526937B2/ja
Publication of JP2006165071A publication Critical patent/JP2006165071A/ja
Publication of JP2006165071A5 publication Critical patent/JP2006165071A5/ja
Application granted granted Critical
Publication of JP4526937B2 publication Critical patent/JP4526937B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
JP2004350471A 2004-12-02 2004-12-02 半導体製造テープ用帯電防止基材フィルム Expired - Lifetime JP4526937B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004350471A JP4526937B2 (ja) 2004-12-02 2004-12-02 半導体製造テープ用帯電防止基材フィルム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004350471A JP4526937B2 (ja) 2004-12-02 2004-12-02 半導体製造テープ用帯電防止基材フィルム

Publications (3)

Publication Number Publication Date
JP2006165071A JP2006165071A (ja) 2006-06-22
JP2006165071A5 JP2006165071A5 (enExample) 2008-01-24
JP4526937B2 true JP4526937B2 (ja) 2010-08-18

Family

ID=36666763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004350471A Expired - Lifetime JP4526937B2 (ja) 2004-12-02 2004-12-02 半導体製造テープ用帯電防止基材フィルム

Country Status (1)

Country Link
JP (1) JP4526937B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008004679A (ja) * 2006-06-21 2008-01-10 Gunze Ltd ダイシング用基体フイルム
JP4822988B2 (ja) * 2006-09-07 2011-11-24 グンゼ株式会社 ダイシング用基体フイルム
KR20090058007A (ko) * 2006-10-02 2009-06-08 이데미쓰 유니테크 가부시키가이샤 제전성 조성물 및 그 성형품
JP5166762B2 (ja) * 2007-04-10 2013-03-21 アキレス株式会社 帯電防止フィルム
JP5307352B2 (ja) * 2007-04-24 2013-10-02 アキレス株式会社 軟質フィルム
JP5666875B2 (ja) * 2010-10-21 2015-02-12 アキレス株式会社 半導体製造工程用テープの基材フィルム
WO2012128317A1 (ja) * 2011-03-24 2012-09-27 住友ベークライト株式会社 半導体ウエハ等加工用粘着テープ
WO2013099778A1 (ja) * 2011-12-26 2013-07-04 三井・デュポンポリケミカル株式会社 レーザーダイシング用フィルム基材、レーザーダイシング用フィルム、及び電子部品の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03290464A (ja) * 1990-04-05 1991-12-20 Toray Ind Inc 熱可塑性樹脂組成物
JP2546409B2 (ja) * 1990-05-08 1996-10-23 東レ株式会社 熱可塑性樹脂組成物
JP3136640B2 (ja) * 1990-11-29 2001-02-19 東レ株式会社 自動車用ポリオレフィン系樹脂成形品
JPH05271489A (ja) * 1992-03-30 1993-10-19 Toray Ind Inc 熱可塑性樹脂組成物
JP3181681B2 (ja) * 1992-04-17 2001-07-03 三洋化成工業株式会社 樹脂組成物
DE4432777C1 (de) * 1994-09-15 1996-02-29 Schulman A Plastics Polyolefin mit permanenten antistatischen und nicht-taubildenden Eigenschaften, Verfahren zu seiner Her stellung und seine Verwendung
JP3361249B2 (ja) * 1997-08-08 2003-01-07 アトフィナ・ジャパン株式会社 熱可塑性樹脂組成物の製造方法及び成形品
JP2003282489A (ja) * 2002-03-26 2003-10-03 Sumitomo Bakelite Co Ltd 半導体加工用粘着シート
JP2003306654A (ja) * 2002-04-16 2003-10-31 Furukawa Electric Co Ltd:The 放射線硬化型粘着テープ
JP4259050B2 (ja) * 2002-07-01 2009-04-30 住友ベークライト株式会社 半導体基板加工用粘着シート
JP4195631B2 (ja) * 2003-04-03 2008-12-10 アキレス株式会社 熱可塑性ウレタン系樹脂複合フィルムまたはシート

Also Published As

Publication number Publication date
JP2006165071A (ja) 2006-06-22

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