JP2006165071A5 - - Google Patents
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- Publication number
- JP2006165071A5 JP2006165071A5 JP2004350471A JP2004350471A JP2006165071A5 JP 2006165071 A5 JP2006165071 A5 JP 2006165071A5 JP 2004350471 A JP2004350471 A JP 2004350471A JP 2004350471 A JP2004350471 A JP 2004350471A JP 2006165071 A5 JP2006165071 A5 JP 2006165071A5
- Authority
- JP
- Japan
- Prior art keywords
- ethylene
- copolymer
- resin
- resin composition
- copolymer resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims description 36
- 239000002216 antistatic agent Substances 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 229920000570 polyether Polymers 0.000 claims description 16
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 15
- 229920001038 ethylene copolymer Polymers 0.000 claims description 14
- 238000010559 graft polymerization reaction Methods 0.000 claims description 14
- 229920001577 copolymer Polymers 0.000 claims description 12
- 229920006026 co-polymeric resin Polymers 0.000 claims description 11
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 5
- 239000005977 Ethylene Substances 0.000 claims description 5
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 claims description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 4
- WXCZUWHSJWOTRV-UHFFFAOYSA-N but-1-ene;ethene Chemical compound C=C.CCC=C WXCZUWHSJWOTRV-UHFFFAOYSA-N 0.000 claims description 3
- ALSOCDGAZNNNME-UHFFFAOYSA-N ethene;hex-1-ene Chemical compound C=C.CCCCC=C ALSOCDGAZNNNME-UHFFFAOYSA-N 0.000 claims description 3
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 claims description 3
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 claims description 3
- 229920006225 ethylene-methyl acrylate Polymers 0.000 claims description 3
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- 229920002943 EPDM rubber Polymers 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 229920002614 Polyether block amide Polymers 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229920006146 polyetheresteramide block copolymer Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920002397 thermoplastic olefin Polymers 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004350471A JP4526937B2 (ja) | 2004-12-02 | 2004-12-02 | 半導体製造テープ用帯電防止基材フィルム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004350471A JP4526937B2 (ja) | 2004-12-02 | 2004-12-02 | 半導体製造テープ用帯電防止基材フィルム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006165071A JP2006165071A (ja) | 2006-06-22 |
| JP2006165071A5 true JP2006165071A5 (enExample) | 2008-01-24 |
| JP4526937B2 JP4526937B2 (ja) | 2010-08-18 |
Family
ID=36666763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004350471A Expired - Lifetime JP4526937B2 (ja) | 2004-12-02 | 2004-12-02 | 半導体製造テープ用帯電防止基材フィルム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4526937B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008004679A (ja) * | 2006-06-21 | 2008-01-10 | Gunze Ltd | ダイシング用基体フイルム |
| JP4822988B2 (ja) * | 2006-09-07 | 2011-11-24 | グンゼ株式会社 | ダイシング用基体フイルム |
| JPWO2008041690A1 (ja) * | 2006-10-02 | 2010-02-04 | 出光ユニテック株式会社 | 制電性組成物及びその成形品 |
| JP5166762B2 (ja) * | 2007-04-10 | 2013-03-21 | アキレス株式会社 | 帯電防止フィルム |
| JP5307352B2 (ja) * | 2007-04-24 | 2013-10-02 | アキレス株式会社 | 軟質フィルム |
| JP5666875B2 (ja) * | 2010-10-21 | 2015-02-12 | アキレス株式会社 | 半導体製造工程用テープの基材フィルム |
| JP2012211314A (ja) * | 2011-03-24 | 2012-11-01 | Sumitomo Bakelite Co Ltd | 半導体ウエハ等加工用粘着テープ |
| KR20140102756A (ko) * | 2011-12-26 | 2014-08-22 | 듀폰-미츠이 폴리케미칼 가부시키가이샤 | 레이저 다이싱용 필름 기재, 레이저 다이싱용 필름 및 전자부품의 제조방법 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03290464A (ja) * | 1990-04-05 | 1991-12-20 | Toray Ind Inc | 熱可塑性樹脂組成物 |
| JP2546409B2 (ja) * | 1990-05-08 | 1996-10-23 | 東レ株式会社 | 熱可塑性樹脂組成物 |
| JP3136640B2 (ja) * | 1990-11-29 | 2001-02-19 | 東レ株式会社 | 自動車用ポリオレフィン系樹脂成形品 |
| JPH05271489A (ja) * | 1992-03-30 | 1993-10-19 | Toray Ind Inc | 熱可塑性樹脂組成物 |
| JP3181681B2 (ja) * | 1992-04-17 | 2001-07-03 | 三洋化成工業株式会社 | 樹脂組成物 |
| DE4432777C1 (de) * | 1994-09-15 | 1996-02-29 | Schulman A Plastics | Polyolefin mit permanenten antistatischen und nicht-taubildenden Eigenschaften, Verfahren zu seiner Her stellung und seine Verwendung |
| JP3361249B2 (ja) * | 1997-08-08 | 2003-01-07 | アトフィナ・ジャパン株式会社 | 熱可塑性樹脂組成物の製造方法及び成形品 |
| JP2003282489A (ja) * | 2002-03-26 | 2003-10-03 | Sumitomo Bakelite Co Ltd | 半導体加工用粘着シート |
| JP2003306654A (ja) * | 2002-04-16 | 2003-10-31 | Furukawa Electric Co Ltd:The | 放射線硬化型粘着テープ |
| JP4259050B2 (ja) * | 2002-07-01 | 2009-04-30 | 住友ベークライト株式会社 | 半導体基板加工用粘着シート |
| JP4195631B2 (ja) * | 2003-04-03 | 2008-12-10 | アキレス株式会社 | 熱可塑性ウレタン系樹脂複合フィルムまたはシート |
-
2004
- 2004-12-02 JP JP2004350471A patent/JP4526937B2/ja not_active Expired - Lifetime
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