JP4744196B2 - 粘着シート - Google Patents
粘着シート Download PDFInfo
- Publication number
- JP4744196B2 JP4744196B2 JP2005158581A JP2005158581A JP4744196B2 JP 4744196 B2 JP4744196 B2 JP 4744196B2 JP 2005158581 A JP2005158581 A JP 2005158581A JP 2005158581 A JP2005158581 A JP 2005158581A JP 4744196 B2 JP4744196 B2 JP 4744196B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- base material
- copolymer
- ethylene
- material layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000853 adhesive Substances 0.000 title claims description 9
- 230000001070 adhesive effect Effects 0.000 title claims description 9
- 239000010410 layer Substances 0.000 claims description 54
- 239000000463 material Substances 0.000 claims description 29
- 239000002344 surface layer Substances 0.000 claims description 22
- 238000002844 melting Methods 0.000 claims description 19
- 230000008018 melting Effects 0.000 claims description 19
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 9
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 9
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 8
- 229920006228 ethylene acrylate copolymer Polymers 0.000 claims description 8
- 229920005604 random copolymer Polymers 0.000 claims description 7
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 claims description 6
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 claims description 6
- 229920001577 copolymer Polymers 0.000 claims description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 4
- 229910021645 metal ion Inorganic materials 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- QVKOLZOAOSNSHQ-UHFFFAOYSA-N prop-1-ene;prop-2-enoic acid Chemical compound CC=C.OC(=O)C=C QVKOLZOAOSNSHQ-UHFFFAOYSA-N 0.000 claims description 2
- 230000000052 comparative effect Effects 0.000 description 13
- 238000005520 cutting process Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 239000002699 waste material Substances 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 9
- 239000002390 adhesive tape Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 229920003048 styrene butadiene rubber Polymers 0.000 description 8
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 4
- 239000002174 Styrene-butadiene Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000011115 styrene butadiene Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 241001050985 Disco Species 0.000 description 2
- 229920003298 Nucrel® Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- KUKLSWLXUCSXIB-UHFFFAOYSA-N but-1-ene;prop-2-enoic acid Chemical compound CCC=C.OC(=O)C=C KUKLSWLXUCSXIB-UHFFFAOYSA-N 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000005984 hydrogenation reaction Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000001225 nuclear magnetic resonance method Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
- Dicing (AREA)
Description
Claims (2)
- 基材層と、基材層の上に積層された中間層と、中間層の上に積層された表層を有する粘着シートであって、表層及び基材層を形成する樹脂が、その融点を70〜90℃とする一方、エチレン酢酸ビニル共重合体、エチレンメタクリル酸共重合体、エチレンメチルメタクリレート共重合体、アクリル酸エチレン共重合体、アクリル酸エチルエチレン共重合体、アクリル酸メチルエチレン共重合体、又はこれらの共重合体を金属イオンにより架橋した樹脂の少なくともいずれか1種を含む樹脂であり、中間層を形成する樹脂が、完全水素添加されたスチレン−ブタジエンランダム共重合体であるシートの基材層の露出面又は表層の露出面の少なくとも一方又は双方に、粘着剤層を積層した粘着シート。
- 電子部品ダイシング用である請求項1記載の粘着シート。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005158581A JP4744196B2 (ja) | 2005-05-31 | 2005-05-31 | 粘着シート |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005158581A JP4744196B2 (ja) | 2005-05-31 | 2005-05-31 | 粘着シート |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006339193A JP2006339193A (ja) | 2006-12-14 |
JP4744196B2 true JP4744196B2 (ja) | 2011-08-10 |
Family
ID=37559534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005158581A Expired - Fee Related JP4744196B2 (ja) | 2005-05-31 | 2005-05-31 | 粘着シート |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4744196B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100885793B1 (ko) | 2006-12-28 | 2009-02-26 | 제일모직주식회사 | 비닐기를 함유한 아크릴계 점착수지 조성물, 이를 포함하는광경화형 점착조성물 및 이를 포함하는 점착테이프 |
JP2009054953A (ja) * | 2007-08-29 | 2009-03-12 | Disco Abrasive Syst Ltd | ウェーハの加工方法 |
WO2010001959A1 (ja) * | 2008-07-03 | 2010-01-07 | 電気化学工業株式会社 | 粘着フィルム、該粘着フィルムを用いた積層体、及び成形体の保護方法 |
JP5963411B2 (ja) * | 2011-09-01 | 2016-08-03 | グンゼ株式会社 | ダイシング用基体フィルム |
KR101832297B1 (ko) * | 2011-12-26 | 2018-02-26 | 듀폰-미츠이 폴리케미칼 가부시키가이샤 | 레이저 다이싱용 필름 기재, 레이저 다이싱용 필름 및 전자부품의 제조방법 |
JP6159163B2 (ja) * | 2013-06-21 | 2017-07-05 | 日東電工株式会社 | 粘着シート |
JP6103140B2 (ja) * | 2014-11-19 | 2017-03-29 | 住友ベークライト株式会社 | ダイシングフィルム |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3290814B2 (ja) * | 1994-07-15 | 2002-06-10 | 住友ベークライト株式会社 | 熱可塑性エラストマー |
JPH11199840A (ja) * | 1998-01-16 | 1999-07-27 | Kureha Chem Ind Co Ltd | 粘着テープ用基材、粘着テープ及び離型テープ付き粘着テープ |
JP2000212424A (ja) * | 1998-11-17 | 2000-08-02 | Toray Ind Inc | ポリエステル樹脂組成物 |
JP4578050B2 (ja) * | 2001-09-04 | 2010-11-10 | グンゼ株式会社 | ウェハダイシングテープ用基材 |
JP2004331763A (ja) * | 2003-05-06 | 2004-11-25 | Okamoto Ind Inc | パール調光沢を有する軟質合成樹脂フィルム |
-
2005
- 2005-05-31 JP JP2005158581A patent/JP4744196B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2006339193A (ja) | 2006-12-14 |
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