JP4514758B2 - 温度調節機構を有する集積回路プローブ装置 - Google Patents
温度調節機構を有する集積回路プローブ装置 Download PDFInfo
- Publication number
- JP4514758B2 JP4514758B2 JP2007005583A JP2007005583A JP4514758B2 JP 4514758 B2 JP4514758 B2 JP 4514758B2 JP 2007005583 A JP2007005583 A JP 2007005583A JP 2007005583 A JP2007005583 A JP 2007005583A JP 4514758 B2 JP4514758 B2 JP 4514758B2
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- Prior art keywords
- integrated circuit
- flow path
- test
- probe
- circuit probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000523 sample Substances 0.000 title claims description 70
- 230000007246 mechanism Effects 0.000 title claims description 24
- 239000012530 fluid Substances 0.000 claims description 21
- 238000005259 measurement Methods 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/44—Modifications of instruments for temperature compensation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
Description
12 回路基板
16 プローブピン
28 コンタクト面
30 ウエハ
32 ウエハチャック
34 ヒーター
36 集積回路デバイス
38 パッド
50 集積回路プローブ装置
52 支持体
54 流路
56 流出口
58 流入口
60 テストヘッド
62 ポゴピン
64 ホルダー
66 温度調節機構
Claims (8)
- 集積回路プローブ装置において、
第1の面及び第2の面を有する回路基板、
前記回路基板上に位置決めされ、前記第1の面に面している集積回路デバイスに電気的に接触するように構成された、少なくとも1本のプローブピン、
複数の試験測定ユニットを含み、前記第2の面上の複数のコンタクト面と電気的接続を形成することができるように構成されたテストヘッド、及び
前記第2の面上に直接配置された温度調節機構であって、前記テストヘッドの前記電気的接続のピンに面した流体の流出口を有してなり、前記テストヘッドと前記試験測定ユニットが、指定された動作温度で前記集積回路デバイスの電気的測定を行うことを保証するもの、を備えることを特徴とする集積回路プローブ装置。 - 前記温度調節機構が、
前記第2の面上に配置された支持部材、及び
前記支持部材上に配置された少なくとも1つの流路、
を有することを特徴とする請求項1に記載の集積回路プローブ装置。 - 前記流路が少なくとも1つの流入口及び複数の流出口を有することを特徴とする請求項2に記載の集積回路プローブ装置。
- 前記流路により前記流路内を流体が流れることができ、前記流体が気体、液体またはこれらの組合せであることを特徴とする請求項2に記載の集積回路プローブ装置。
- 前記流路が導管であることを特徴とする請求項2に記載の集積回路プローブ装置。
- 前記温度調節機構が前記回路基板の前記第2の面上に配置された少なくとも1つの流路を有し、前記流路が少なくとも1つの流入口及び複数の流出口を有することを特徴とする請求項1に記載の集積回路プローブ装置。
- 前記流路により前記流路内を流体が流れることができ、前記流体が気体、液体またはこれらの組合せであることを特徴とする請求項6に記載の集積回路プローブ装置。
- 前記流路が導管であることを特徴とする請求項6に記載の集積回路プローブ装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095131279A TWI321820B (en) | 2006-08-25 | 2006-08-25 | Integrated circuits probing apparatus having a temperature-adjusting mechanism |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008051792A JP2008051792A (ja) | 2008-03-06 |
JP4514758B2 true JP4514758B2 (ja) | 2010-07-28 |
Family
ID=39112778
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007005583A Active JP4514758B2 (ja) | 2006-08-25 | 2007-01-15 | 温度調節機構を有する集積回路プローブ装置 |
Country Status (4)
Country | Link |
---|---|
US (4) | US7576553B2 (ja) |
JP (1) | JP4514758B2 (ja) |
KR (1) | KR20080018775A (ja) |
TW (1) | TWI321820B (ja) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7901131B2 (en) * | 2006-12-22 | 2011-03-08 | Hewlett-Packard Development Company, L.P. | Apparatus state determination method and system |
KR100913780B1 (ko) | 2008-04-01 | 2009-08-26 | (주)유비프리시젼 | 열 변형 방지가 가능한 프로브 유니트 |
TW201011848A (en) * | 2008-09-04 | 2010-03-16 | Star Techn Inc | Apparatus for testing integrated circuits |
CN101907644B (zh) * | 2009-06-04 | 2013-11-06 | 鸿富锦精密工业(深圳)有限公司 | 电子探棒控制系统 |
JP6092509B2 (ja) * | 2011-10-17 | 2017-03-08 | 東京エレクトロン株式会社 | 接触端子の支持体及びプローブカード |
US8836356B2 (en) | 2011-12-12 | 2014-09-16 | International Business Machines Corporation | Vertical probe assembly with air channel |
TWM436227U (en) * | 2012-03-23 | 2012-08-21 | Mpi Corp | Heating point testing appliances |
CN102774634B (zh) * | 2012-05-28 | 2014-08-13 | 杭州长川科技有限公司 | 集成电路翻面装置及控制方法 |
CN103543304B (zh) * | 2012-07-13 | 2016-05-18 | 旺矽科技股份有限公司 | 高频探针卡 |
US9562943B2 (en) * | 2012-11-19 | 2017-02-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer temperature sensing methods and related semiconductor wafer |
CN103926480A (zh) * | 2013-01-10 | 2014-07-16 | 致茂电子(苏州)有限公司 | 具有干燥环境的测试机台 |
TW201504631A (zh) * | 2013-07-23 | 2015-02-01 | Mpi Corp | 光電元件檢測用之高頻探針卡 |
KR101794744B1 (ko) | 2013-08-14 | 2017-12-01 | 에프이아이 컴파니 | 하전 입자 비임 시스템용 회로 프로브 |
US9678109B2 (en) * | 2014-01-09 | 2017-06-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Probe card |
US9709599B2 (en) * | 2014-01-09 | 2017-07-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Membrane probe card |
US9805891B2 (en) | 2014-10-25 | 2017-10-31 | ComponentZee, LLC | Multiplexing, switching and testing devices and methods using fluid pressure |
US9577358B2 (en) * | 2014-10-25 | 2017-02-21 | ComponentZee, LLC | Fluid pressure activated electrical contact devices and methods |
US10003149B2 (en) | 2014-10-25 | 2018-06-19 | ComponentZee, LLC | Fluid pressure activated electrical contact devices and methods |
TWI604198B (zh) * | 2016-06-22 | 2017-11-01 | 思達科技股份有限公司 | 測試裝置、夾持組件及探針卡載具 |
KR102619328B1 (ko) * | 2016-06-29 | 2024-01-02 | 세메스 주식회사 | 웨이퍼 검사 공정에서 척의 온도를 제어하는 방법 |
TWI831844B (zh) * | 2018-10-05 | 2024-02-11 | 美商色拉頓系統公司 | 高電壓探針卡系統 |
US11047880B2 (en) | 2019-01-16 | 2021-06-29 | Star Technologies, Inc. | Probing device |
US11054465B2 (en) * | 2019-10-21 | 2021-07-06 | Star Technologies, Inc. | Method of operating a probing apparatus |
US11754619B2 (en) | 2021-01-11 | 2023-09-12 | Star Technologies, Inc. | Probing apparatus with temperature-adjusting mechanism |
CN114252723B (zh) * | 2022-02-28 | 2022-06-10 | 杭州长川科技股份有限公司 | 一种控温测试台 |
CN114705972B (zh) * | 2022-05-06 | 2023-05-09 | 中国软件评测中心(工业和信息化部软件与集成电路促进中心) | 一种集成电路性能测试装置及其测试方法 |
CN116295933B (zh) * | 2023-05-15 | 2023-08-08 | 上海泽丰半导体科技有限公司 | 探针卡测温系统及测温方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH10510682A (ja) * | 1995-08-09 | 1998-10-13 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | 半導体ウエハーのテストおよびバーン・イン |
JP2003507882A (ja) * | 1999-08-17 | 2003-02-25 | フォームファクター,インコーポレイテッド | 電気接触器、特に流体圧力を用いるウェーハレベルの接触器 |
Family Cites Families (14)
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US4172993A (en) * | 1978-09-13 | 1979-10-30 | The Singer Company | Environmental hood for testing printed circuit cards |
US4567432A (en) * | 1983-06-09 | 1986-01-28 | Texas Instruments Incorporated | Apparatus for testing integrated circuits |
US4820976A (en) * | 1987-11-24 | 1989-04-11 | Advanced Micro Devices, Inc. | Test fixture capable of electrically testing an integrated circuit die having a planar array of contacts |
JP2556245B2 (ja) | 1992-11-27 | 1996-11-20 | 日本電気株式会社 | プローブカード |
US5550482A (en) * | 1993-07-20 | 1996-08-27 | Tokyo Electron Kabushiki Kaisha | Probe device |
US5777384A (en) * | 1996-10-11 | 1998-07-07 | Motorola, Inc. | Tunable semiconductor device |
JP2000180469A (ja) * | 1998-12-18 | 2000-06-30 | Fujitsu Ltd | 半導体装置用コンタクタ及び半導体装置用コンタクタを用いた試験装置及び半導体装置用コンタクタを用いた試験方法及び半導体装置用コンタクタのクリーニング方法 |
JP2000241454A (ja) | 1999-02-23 | 2000-09-08 | Mitsubishi Electric Corp | 高温テスト用プローブカード及びテスト装置 |
JP2001284417A (ja) * | 2000-03-30 | 2001-10-12 | Nagase & Co Ltd | プローバ及び該プローバを備えた低温試験装置 |
US6891385B2 (en) * | 2001-12-27 | 2005-05-10 | Formfactor, Inc. | Probe card cooling assembly with direct cooling of active electronic components |
TW594899B (en) * | 2002-12-18 | 2004-06-21 | Star Techn Inc | Detection card for semiconductor measurement |
WO2006017078A2 (en) * | 2004-07-07 | 2006-02-16 | Cascade Microtech, Inc. | Probe head having a membrane suspended probe |
TWI259042B (en) * | 2004-06-08 | 2006-07-21 | Powerchip Semiconductor Corp | A facility of semiconductor |
KR100671485B1 (ko) | 2005-04-19 | 2007-01-19 | 주식회사 씨너텍 | 웨이퍼 번인 테스트용 프로브카드의 항온장치 |
-
2006
- 2006-08-25 TW TW095131279A patent/TWI321820B/zh active
- 2006-12-12 US US11/609,558 patent/US7576553B2/en active Active
-
2007
- 2007-01-05 KR KR1020070001323A patent/KR20080018775A/ko not_active Application Discontinuation
- 2007-01-15 JP JP2007005583A patent/JP4514758B2/ja active Active
-
2008
- 2008-03-12 US US12/046,818 patent/US7616018B2/en active Active
- 2008-09-26 US US12/239,060 patent/US20090015283A1/en not_active Abandoned
-
2010
- 2010-02-01 US US12/697,508 patent/US20100134130A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10510682A (ja) * | 1995-08-09 | 1998-10-13 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | 半導体ウエハーのテストおよびバーン・イン |
JP2003507882A (ja) * | 1999-08-17 | 2003-02-25 | フォームファクター,インコーポレイテッド | 電気接触器、特に流体圧力を用いるウェーハレベルの接触器 |
Also Published As
Publication number | Publication date |
---|---|
US7616018B2 (en) | 2009-11-10 |
KR20080018775A (ko) | 2008-02-28 |
TW200811974A (en) | 2008-03-01 |
US7576553B2 (en) | 2009-08-18 |
JP2008051792A (ja) | 2008-03-06 |
US20090015283A1 (en) | 2009-01-15 |
US20080048700A1 (en) | 2008-02-28 |
US20080150567A1 (en) | 2008-06-26 |
TWI321820B (en) | 2010-03-11 |
US20100134130A1 (en) | 2010-06-03 |
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