JP4510649B2 - 配線基板、多層基板および電子部品実装体の製造方法 - Google Patents

配線基板、多層基板および電子部品実装体の製造方法 Download PDF

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Publication number
JP4510649B2
JP4510649B2 JP2005012779A JP2005012779A JP4510649B2 JP 4510649 B2 JP4510649 B2 JP 4510649B2 JP 2005012779 A JP2005012779 A JP 2005012779A JP 2005012779 A JP2005012779 A JP 2005012779A JP 4510649 B2 JP4510649 B2 JP 4510649B2
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JP
Japan
Prior art keywords
conductive paste
organic compound
metal particles
resin
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005012779A
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English (en)
Japanese (ja)
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JP2006202604A5 (enExample
JP2006202604A (ja
Inventor
久美子 平山
秀規 宮川
敦史 山口
貴之 樋口
茂昭 酒谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2005012779A priority Critical patent/JP4510649B2/ja
Publication of JP2006202604A publication Critical patent/JP2006202604A/ja
Publication of JP2006202604A5 publication Critical patent/JP2006202604A5/ja
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Publication of JP4510649B2 publication Critical patent/JP4510649B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2005012779A 2005-01-20 2005-01-20 配線基板、多層基板および電子部品実装体の製造方法 Expired - Fee Related JP4510649B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005012779A JP4510649B2 (ja) 2005-01-20 2005-01-20 配線基板、多層基板および電子部品実装体の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005012779A JP4510649B2 (ja) 2005-01-20 2005-01-20 配線基板、多層基板および電子部品実装体の製造方法

Publications (3)

Publication Number Publication Date
JP2006202604A JP2006202604A (ja) 2006-08-03
JP2006202604A5 JP2006202604A5 (enExample) 2008-01-24
JP4510649B2 true JP4510649B2 (ja) 2010-07-28

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JP2005012779A Expired - Fee Related JP4510649B2 (ja) 2005-01-20 2005-01-20 配線基板、多層基板および電子部品実装体の製造方法

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JP (1) JP4510649B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4505825B2 (ja) * 2006-09-15 2010-07-21 国立大学法人大阪大学 金属ナノ粒子の焼結方法およびその焼結方法を用いた基板上に配線を形成する方法
JP4979542B2 (ja) * 2007-11-05 2012-07-18 パナソニック株式会社 実装構造体およびその製造方法
JP5169171B2 (ja) * 2007-11-26 2013-03-27 パナソニック株式会社 電子部品の接合方法
JP2009134030A (ja) * 2007-11-29 2009-06-18 Seiko Epson Corp アクチュエータ、光スキャナおよび画像形成装置
JP2009139600A (ja) * 2007-12-05 2009-06-25 Seiko Epson Corp アクチュエータ、光スキャナおよび画像形成装置
JP5207281B2 (ja) * 2008-01-17 2013-06-12 国立大学法人大阪大学 導電性ペースト
JP2011054892A (ja) * 2009-09-04 2011-03-17 Nihon Superior Co Ltd 導電性ペーストを用いたはんだ接合
KR20130125944A (ko) 2012-05-10 2013-11-20 삼성전기주식회사 내부 전극용 도전성 페이스트 조성물, 적층 세라믹 전자부품 및 이의 제조방법
US11053348B2 (en) 2017-02-15 2021-07-06 3M Innovative Properties Company Epoxy stabilization using metal nanoparticles and nitrogen-containing catalysts, and methods

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05274911A (ja) * 1992-03-25 1993-10-22 Furukawa Electric Co Ltd:The 導電性レジンペースト
JP2001302881A (ja) * 2000-04-18 2001-10-31 Three M Innovative Properties Co 安定化されたカチオン重合性組成物およびそれを用いた接着剤フィルム並びに導体回路
WO2002035554A1 (en) * 2000-10-25 2002-05-02 Harima Chemicals, Inc. Electroconductive metal paste and method for production thereof
JP2004189954A (ja) * 2002-12-13 2004-07-08 Ricoh Co Ltd 熱硬化型導電性接着剤

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Publication number Publication date
JP2006202604A (ja) 2006-08-03

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