JP4497345B2 - 振動子の支持構造及び該支持構造の製造方法 - Google Patents
振動子の支持構造及び該支持構造の製造方法 Download PDFInfo
- Publication number
- JP4497345B2 JP4497345B2 JP2003343970A JP2003343970A JP4497345B2 JP 4497345 B2 JP4497345 B2 JP 4497345B2 JP 2003343970 A JP2003343970 A JP 2003343970A JP 2003343970 A JP2003343970 A JP 2003343970A JP 4497345 B2 JP4497345 B2 JP 4497345B2
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- Japan
- Prior art keywords
- vibrator
- substrate
- support
- pin
- support structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000000034 method Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims description 65
- 239000000853 adhesive Substances 0.000 claims description 39
- 230000001070 adhesive effect Effects 0.000 claims description 39
- 239000011231 conductive filler Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 238000001514 detection method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000001902 propagating effect Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5642—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams
- G01C19/5663—Manufacturing; Trimming; Mounting; Housings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10628—Leaded surface mounted device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10848—Thinned leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2045—Protection against vibrations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Gyroscopes (AREA)
Description
2 支持ピン
2a 振動子接合部
2b 基板接合部
3 支持ピン
3a 振動子接合部
3b 基板接合部
4 基板
4a ピン接合部
7 開口
8 導電性接着剤
Claims (2)
- 支持ピンを介して振動子を基板上に支持する振動子の支持構造を製造する方法であって、
前記支持ピンの基板接合部と前記基板のピン接合部とをその間に介在して接合する導電性接着剤を、前記振動子及び支持ピンの自重のみが加わった状態下で硬化させることを特徴とする振動子の支持構造の製造方法。 - 前記支持ピンの基板接合部と前記基板のピン接合部とを接合する導電性接着剤を、導電性フィラーを含む樹脂からなり、かつ、鉛筆硬度が4H以下であるものを用い、該導電性接着剤を前記基板接合部と前記ピン接合部との各々に予め塗布したことを特徴とする請求項1に記載した振動子の支持構造の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003343970A JP4497345B2 (ja) | 2003-02-12 | 2003-10-02 | 振動子の支持構造及び該支持構造の製造方法 |
US10/735,704 US7161282B2 (en) | 2003-02-12 | 2003-12-16 | Vibrator support structure and manufacturing method for the support structure |
US11/355,772 US20060137815A1 (en) | 2003-02-12 | 2006-02-16 | Vibrator support structure and manufacturing method for the support structure |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003034124 | 2003-02-12 | ||
JP2003343970A JP4497345B2 (ja) | 2003-02-12 | 2003-10-02 | 振動子の支持構造及び該支持構造の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004264286A JP2004264286A (ja) | 2004-09-24 |
JP4497345B2 true JP4497345B2 (ja) | 2010-07-07 |
Family
ID=32828961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003343970A Expired - Fee Related JP4497345B2 (ja) | 2003-02-12 | 2003-10-02 | 振動子の支持構造及び該支持構造の製造方法 |
Country Status (2)
Country | Link |
---|---|
US (2) | US7161282B2 (ja) |
JP (1) | JP4497345B2 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3966237B2 (ja) * | 2003-06-19 | 2007-08-29 | セイコーエプソン株式会社 | 圧電デバイス、圧電デバイスを搭載した電子機器 |
US20070007862A1 (en) * | 2003-09-18 | 2007-01-11 | Akihisa Adachi | Ultrasonic vibrator and ultrasonic flowmeter employing the same |
US7630210B2 (en) * | 2005-11-29 | 2009-12-08 | Amphenol Corporation | Lead(Pb)-free electronic component attachment |
JP4924873B2 (ja) * | 2006-08-02 | 2012-04-25 | セイコーエプソン株式会社 | 圧電振動ジャイロモジュール及び圧電振動ジャイロセンサ |
JP2008096318A (ja) * | 2006-10-13 | 2008-04-24 | Fujitsu Media Device Kk | 振動センサおよびその製造方法 |
JP2010190706A (ja) * | 2009-02-18 | 2010-09-02 | Panasonic Corp | 慣性力センサ |
JP2012175492A (ja) * | 2011-02-23 | 2012-09-10 | Nippon Dempa Kogyo Co Ltd | 圧電デバイス及び圧電デバイスの製造方法 |
KR101662126B1 (ko) * | 2014-05-02 | 2016-10-05 | 주식회사 엠플러스 | 진동발생장치 |
JP6417764B2 (ja) * | 2014-07-24 | 2018-11-07 | セイコーエプソン株式会社 | 電子部品、電子部品の製造方法、電子機器、および移動体 |
JP7167545B2 (ja) * | 2018-08-13 | 2022-11-09 | Tdk株式会社 | 振動デバイス |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2751608A (en) * | 1953-09-17 | 1956-06-26 | George R Lucas | Hide away bed gates |
US3289223A (en) * | 1964-10-26 | 1966-12-06 | Carl W Oja | Safety attachment for beds |
US3290701A (en) * | 1965-01-11 | 1966-12-13 | Cal Dak Company | Bed rail |
US3474473A (en) * | 1967-11-09 | 1969-10-28 | Orrin Hannaberg | Adjustable hand rail attachment for a bed and mattress |
US4178645A (en) * | 1977-12-29 | 1979-12-18 | Cosme Peter A | Safety bed |
JPS57154921A (en) * | 1981-03-20 | 1982-09-24 | Toyo Commun Equip Co Ltd | Support of piezoelectric device |
US4706350A (en) * | 1985-01-07 | 1987-11-17 | Motorola, Inc. | Self-locating, self-fixturing hard crystal blank mounting system |
US4833743A (en) * | 1988-08-15 | 1989-05-30 | The Quaker Oats Company | Bed safety side rail |
US5170089A (en) * | 1989-12-20 | 1992-12-08 | General Electric Company | Two-axis motion apparatus utilizing piezoelectric material |
JPH06221854A (ja) | 1993-01-26 | 1994-08-12 | Murata Mfg Co Ltd | 振動子の支持構造 |
JPH06258082A (ja) | 1993-03-08 | 1994-09-16 | Murata Mfg Co Ltd | 振動子の支持構造 |
US5437067A (en) * | 1994-01-28 | 1995-08-01 | Safety 1St, Inc. | Bed side rails |
US5463784A (en) * | 1994-08-17 | 1995-11-07 | Alpern; Erwin A. | Hand rail attachment for beds |
US5577277A (en) * | 1995-03-30 | 1996-11-26 | Safety 1St, Inc. | Collapsable bed side rail |
US5640726A (en) * | 1995-06-26 | 1997-06-24 | Fichner-Rathus; Lois | Safety rail for sleeping beds |
US5596776A (en) * | 1995-11-28 | 1997-01-28 | Huang; Li-Chu C. | Collapsible safeguard rail structure |
JP3610762B2 (ja) * | 1997-04-15 | 2005-01-19 | 株式会社村田製作所 | 圧電振動体の支持構造及びこの圧電振動体の支持構造を有する圧電トランス、ジャイロ並びに積層圧電体部品 |
DE69832843T2 (de) * | 1997-05-28 | 2006-07-27 | Murata Mfg. Co., Ltd., Nagaokakyo | Vibrationskreisel |
JP3341661B2 (ja) * | 1997-12-10 | 2002-11-05 | 株式会社村田製作所 | 振動ジャイロ |
JP3767212B2 (ja) | 1998-11-16 | 2006-04-19 | 株式会社村田製作所 | 振動ジャイロの支持構造および支持方法 |
US6134731A (en) * | 1999-04-01 | 2000-10-24 | Bel-Art Products, Inc. | Adjustable support apparatus |
JP3674440B2 (ja) | 2000-02-15 | 2005-07-20 | 株式会社村田製作所 | 振動ジャイロ |
JP3613117B2 (ja) * | 2000-02-23 | 2005-01-26 | 株式会社村田製作所 | 振動子及びそれを用いた振動ジャイロ及びそれを用いた電子装置 |
KR100791725B1 (ko) * | 2000-05-19 | 2008-01-03 | 티디케이가부시기가이샤 | 기능성층을 갖는 기능성 필름 및 그 기능성층이 부여된 물체 |
US6453490B1 (en) * | 2001-09-27 | 2002-09-24 | Colleen Cardinale | Bed safety guard |
JP3966237B2 (ja) * | 2003-06-19 | 2007-08-29 | セイコーエプソン株式会社 | 圧電デバイス、圧電デバイスを搭載した電子機器 |
-
2003
- 2003-10-02 JP JP2003343970A patent/JP4497345B2/ja not_active Expired - Fee Related
- 2003-12-16 US US10/735,704 patent/US7161282B2/en active Active
-
2006
- 2006-02-16 US US11/355,772 patent/US20060137815A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20040155560A1 (en) | 2004-08-12 |
JP2004264286A (ja) | 2004-09-24 |
US7161282B2 (en) | 2007-01-09 |
US20060137815A1 (en) | 2006-06-29 |
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