JP4492231B2 - 鉛フリーはんだ合金 - Google Patents

鉛フリーはんだ合金 Download PDF

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Publication number
JP4492231B2
JP4492231B2 JP2004199353A JP2004199353A JP4492231B2 JP 4492231 B2 JP4492231 B2 JP 4492231B2 JP 2004199353 A JP2004199353 A JP 2004199353A JP 2004199353 A JP2004199353 A JP 2004199353A JP 4492231 B2 JP4492231 B2 JP 4492231B2
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Japan
Prior art keywords
solder
lead
solder alloy
weight
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004199353A
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English (en)
Japanese (ja)
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JP2006021205A5 (enExample
JP2006021205A (ja
Inventor
啓友 熊井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2004199353A priority Critical patent/JP4492231B2/ja
Publication of JP2006021205A publication Critical patent/JP2006021205A/ja
Publication of JP2006021205A5 publication Critical patent/JP2006021205A5/ja
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Publication of JP4492231B2 publication Critical patent/JP4492231B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2004199353A 2004-07-06 2004-07-06 鉛フリーはんだ合金 Expired - Fee Related JP4492231B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004199353A JP4492231B2 (ja) 2004-07-06 2004-07-06 鉛フリーはんだ合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004199353A JP4492231B2 (ja) 2004-07-06 2004-07-06 鉛フリーはんだ合金

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007176333A Division JP4683015B2 (ja) 2007-07-04 2007-07-04 鉛フリーはんだ合金

Publications (3)

Publication Number Publication Date
JP2006021205A JP2006021205A (ja) 2006-01-26
JP2006021205A5 JP2006021205A5 (enExample) 2007-08-23
JP4492231B2 true JP4492231B2 (ja) 2010-06-30

Family

ID=35794859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004199353A Expired - Fee Related JP4492231B2 (ja) 2004-07-06 2004-07-06 鉛フリーはんだ合金

Country Status (1)

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JP (1) JP4492231B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102974954B (zh) * 2012-12-17 2015-03-11 南京航空航天大学 含Fe和Pr的Sn-Cu-Ni无铅钎料
JP6680992B1 (ja) * 2019-05-27 2020-04-15 千住金属工業株式会社 はんだ合金、はんだ粉末、ソルダペースト、はんだボール、ソルダプリフォーム、およびはんだ継手

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3754152B2 (ja) * 1996-11-08 2006-03-08 田中電子工業株式会社 無鉛半田材料及びそれを用いた電子部品
JP2000197988A (ja) * 1998-03-26 2000-07-18 Nihon Superior Co Ltd 無鉛はんだ合金
JP2000061585A (ja) * 1998-08-21 2000-02-29 Tanaka Denshi Kogyo Kk 半田材料の鋳造方法
JP3602529B1 (ja) * 2003-01-22 2004-12-15 白光株式会社 マニュアルソルダリング用またはフローソルダリング用鉛フリーはんだ及びそれを用いた電子部品

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Publication number Publication date
JP2006021205A (ja) 2006-01-26

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