JP2006021205A5 - - Google Patents

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Publication number
JP2006021205A5
JP2006021205A5 JP2004199353A JP2004199353A JP2006021205A5 JP 2006021205 A5 JP2006021205 A5 JP 2006021205A5 JP 2004199353 A JP2004199353 A JP 2004199353A JP 2004199353 A JP2004199353 A JP 2004199353A JP 2006021205 A5 JP2006021205 A5 JP 2006021205A5
Authority
JP
Japan
Prior art keywords
weight
lead
free solder
solder alloy
alloy according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004199353A
Other languages
English (en)
Japanese (ja)
Other versions
JP4492231B2 (ja
JP2006021205A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004199353A priority Critical patent/JP4492231B2/ja
Priority claimed from JP2004199353A external-priority patent/JP4492231B2/ja
Publication of JP2006021205A publication Critical patent/JP2006021205A/ja
Publication of JP2006021205A5 publication Critical patent/JP2006021205A5/ja
Application granted granted Critical
Publication of JP4492231B2 publication Critical patent/JP4492231B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004199353A 2004-07-06 2004-07-06 鉛フリーはんだ合金 Expired - Fee Related JP4492231B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004199353A JP4492231B2 (ja) 2004-07-06 2004-07-06 鉛フリーはんだ合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004199353A JP4492231B2 (ja) 2004-07-06 2004-07-06 鉛フリーはんだ合金

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007176333A Division JP4683015B2 (ja) 2007-07-04 2007-07-04 鉛フリーはんだ合金

Publications (3)

Publication Number Publication Date
JP2006021205A JP2006021205A (ja) 2006-01-26
JP2006021205A5 true JP2006021205A5 (enExample) 2007-08-23
JP4492231B2 JP4492231B2 (ja) 2010-06-30

Family

ID=35794859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004199353A Expired - Fee Related JP4492231B2 (ja) 2004-07-06 2004-07-06 鉛フリーはんだ合金

Country Status (1)

Country Link
JP (1) JP4492231B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102974954B (zh) * 2012-12-17 2015-03-11 南京航空航天大学 含Fe和Pr的Sn-Cu-Ni无铅钎料
JP6680992B1 (ja) * 2019-05-27 2020-04-15 千住金属工業株式会社 はんだ合金、はんだ粉末、ソルダペースト、はんだボール、ソルダプリフォーム、およびはんだ継手

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3754152B2 (ja) * 1996-11-08 2006-03-08 田中電子工業株式会社 無鉛半田材料及びそれを用いた電子部品
JP2000197988A (ja) * 1998-03-26 2000-07-18 Nihon Superior Co Ltd 無鉛はんだ合金
JP2000061585A (ja) * 1998-08-21 2000-02-29 Tanaka Denshi Kogyo Kk 半田材料の鋳造方法
JP3602529B1 (ja) * 2003-01-22 2004-12-15 白光株式会社 マニュアルソルダリング用またはフローソルダリング用鉛フリーはんだ及びそれを用いた電子部品

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