JP2006021205A5 - - Google Patents

Download PDF

Info

Publication number
JP2006021205A5
JP2006021205A5 JP2004199353A JP2004199353A JP2006021205A5 JP 2006021205 A5 JP2006021205 A5 JP 2006021205A5 JP 2004199353 A JP2004199353 A JP 2004199353A JP 2004199353 A JP2004199353 A JP 2004199353A JP 2006021205 A5 JP2006021205 A5 JP 2006021205A5
Authority
JP
Japan
Prior art keywords
weight
lead
free solder
solder alloy
alloy according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004199353A
Other languages
Japanese (ja)
Other versions
JP2006021205A (en
JP4492231B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2004199353A priority Critical patent/JP4492231B2/en
Priority claimed from JP2004199353A external-priority patent/JP4492231B2/en
Publication of JP2006021205A publication Critical patent/JP2006021205A/en
Publication of JP2006021205A5 publication Critical patent/JP2006021205A5/ja
Application granted granted Critical
Publication of JP4492231B2 publication Critical patent/JP4492231B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Claims (5)

Ｃｕ：０．１〜３重量％、Ｎｉ：０．００１〜１重量％、Ｆｅ：０．００１〜０．０５重量％を含有し、残部がＳｎからなることを特徴とする鉛フリーはんだ合金。   A lead-free solder alloy containing Cu: 0.1 to 3% by weight, Ni: 0.001 to 1% by weight, Fe: 0.001 to 0.05% by weight, with the balance being Sn. Ｃｏ，Ｍｎ，Ｃｒ，Ｍｏから選ばれる１種以上の金属元素を、１重量％以下含有することを特徴とする請求項１に記載の鉛フリーはんだ合金。   The lead-free solder alloy according to claim 1, wherein the lead-free solder alloy contains 1% by weight or less of one or more metal elements selected from Co, Mn, Cr, and Mo. 前記Ｆｅの含有量が、０．０１〜０．０３重量％であることを特徴とする請求項１又は２に記載の鉛フリーはんだ合金。 The lead-free solder alloy according to claim 1 or 2 , wherein the Fe content is 0.01 to 0.03% by weight. 前記Ｆｅの含有量が、０．０２〜０．０３重量％であることを特徴とする請求項３に記載の鉛フリーはんだ合金。 The lead-free solder alloy according to claim 3 , wherein the Fe content is 0.02 to 0.03% by weight. 前記金属元素の含有量が、０．８重量％以下であることを特徴とする請求項２から４のいずれか１項に記載の鉛フリーはんだ合金。 The lead-free solder alloy according to any one of claims 2 to 4 , wherein the content of the metal element is 0.8% by weight or less.
JP2004199353A 2004-07-06 2004-07-06 Lead-free solder alloy Expired - Fee Related JP4492231B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004199353A JP4492231B2 (en) 2004-07-06 2004-07-06 Lead-free solder alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004199353A JP4492231B2 (en) 2004-07-06 2004-07-06 Lead-free solder alloy

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007176333A Division JP4683015B2 (en) 2007-07-04 2007-07-04 Lead-free solder alloy

Publications (3)

Publication Number Publication Date
JP2006021205A JP2006021205A (en) 2006-01-26
JP2006021205A5 true JP2006021205A5 (en) 2007-08-23
JP4492231B2 JP4492231B2 (en) 2010-06-30

Family

ID=35794859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004199353A Expired - Fee Related JP4492231B2 (en) 2004-07-06 2004-07-06 Lead-free solder alloy

Country Status (1)

Country Link
JP (1) JP4492231B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102974954B (en) * 2012-12-17 2015-03-11 南京航空航天大学 Tin-copper-nickel (Sn-Cu-Ni) lead-free solder containing ferrum (Fe) and praseodymium (Pr)
JP6680992B1 (en) * 2019-05-27 2020-04-15 千住金属工業株式会社 Solder alloys, solder powders, solder pastes, solder balls, solder preforms, and solder joints

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3754152B2 (en) * 1996-11-08 2006-03-08 田中電子工業株式会社 Lead-free solder material and electronic parts using the same
JP2000197988A (en) * 1998-03-26 2000-07-18 Nihon Superior Co Ltd Leadless solder alloy
JP2000061585A (en) * 1998-08-21 2000-02-29 Tanaka Denshi Kogyo Kk Method for casting solder material
JP3602529B1 (en) * 2003-01-22 2004-12-15 白光株式会社 Lead-free solder for manual soldering or flow soldering and electronic components using it

Similar Documents

Publication Publication Date Title
JP2003094195A5 (en)
JP2017209732A5 (en)
MX2020003650A (en) Solder alloy, solder ball, solder preform, solder paste and solder joint.
JP2020187134A5 (en)
CN106460094B (en) The lightweight noble alloy made of titanium and gold and timer or jewelry part made of the lightweight noble alloy of the titanium and gold
MX2009010504A (en) Austenitic iron/nickel/chromium/copper alloy.
DK1452613T3 (en) Lead-free copper alloy and its use
WO2009126954A3 (en) Martensitic stainless steel strengthened by copper-nucleated nitride precipitates
JP2008505247A5 (en)
RU2007123588A (en) ALLOY ON THE BASIS OF TITANIUM ALUMINIDES
EP2578707A4 (en) Copper-based alloy and structural material comprising same
CA2646554A1 (en) High corrosion resistance hot dip galvanized steel material
WO2006000307A3 (en) Corrosion-resistant copper alloy containing magnesium and use thereof
JP2012107295A5 (en)
HRP20211480T1 (en) Solder alloy
ATE523608T1 (en) USE OF A COPPER-NICKEL-TIN ALLOY
JP2004533543A5 (en)
JP2019093428A5 (en)
JP2016528377A5 (en)
JP2021126704A5 (en)
EP1199129A3 (en) Self-brazing materials for elevated temperature applications
JP2006021205A5 (en)
ATE113320T1 (en) CORROSION RESISTANT ALLOY.
TW200622008A (en) Weight made of tungsten based sintered alloy, its production method and vibrator for vibration generator
WO2009041194A1 (en) High-strength high-electroconductivity copper alloy possessing excellent hot workability