JP4484564B2 - 静電気保護回路及びそれを備えた高周波回路装置 - Google Patents
静電気保護回路及びそれを備えた高周波回路装置 Download PDFInfo
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- JP4484564B2 JP4484564B2 JP2004094078A JP2004094078A JP4484564B2 JP 4484564 B2 JP4484564 B2 JP 4484564B2 JP 2004094078 A JP2004094078 A JP 2004094078A JP 2004094078 A JP2004094078 A JP 2004094078A JP 4484564 B2 JP4484564 B2 JP 4484564B2
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- 230000005611 electricity Effects 0.000 claims description 112
- 230000003068 static effect Effects 0.000 claims description 112
- 239000003990 capacitor Substances 0.000 claims description 80
- 230000004888 barrier function Effects 0.000 claims description 42
- 230000005540 biological transmission Effects 0.000 claims description 37
- 230000000903 blocking effect Effects 0.000 claims description 9
- 238000010586 diagram Methods 0.000 description 24
- 239000002184 metal Substances 0.000 description 16
- 230000002441 reversible effect Effects 0.000 description 14
- 230000015556 catabolic process Effects 0.000 description 12
- 230000006866 deterioration Effects 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- 239000003985 ceramic capacitor Substances 0.000 description 8
- 239000006096 absorbing agent Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 7
- 230000002829 reductive effect Effects 0.000 description 6
- 238000007599 discharging Methods 0.000 description 4
- 230000002238 attenuated effect Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 230000003252 repetitive effect Effects 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
- H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
- H02H9/045—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage adapted to a particular application and not provided for elsewhere
- H02H9/046—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage adapted to a particular application and not provided for elsewhere responsive to excess voltage appearing at terminals of integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
- H01L2224/37099—Material
- H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/4005—Shape
- H01L2224/4007—Shape of bonding interfaces, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12035—Zener diode
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
- Semiconductor Integrated Circuits (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Amplifiers (AREA)
- Emergency Protection Circuit Devices (AREA)
Description
1a、3a 信号端子
2 IF信号切替SWユニット(SW−BOX、高周波回路装置)
2a、2b 接続端子(信号端子)
3 レシーバ(高周波回路装置)
4、4a、4b ケーブル
11、13、16、25 コンデンサ
12、22 アッテネータ
14 RFアンプ部
15 マイクロストリップライン
17、26 サージアブソーバ
21 コンデンサ(DCカットコンデンサ)
23 高周波スイッチ回路
24 チョークコイル
30 静電気保護回路
31、38a、38b インダクタ(高周波遮断素子)
32、39a、39b ショットキーバリアダイオード(ダイオード)
32a アノード
32b カソード
33、42a、42b マイクロストリップライン(高周波遮断素子)
34 放電グランドパターン
35a、35b トラップ回路
36 抵抗
37 コンデンサ
40 信号端子
41 内部回路
43 マイクロストリップライン
Claims (9)
- 高周波信号と駆動電源としての直流信号とが重畳されて伝送される信号端子に静電気が印加されたときに、前記信号端子に接続されている内部回路を前記静電気から保護する静電気保護回路であって、
前記直流信号を遮断するためのDCカットコンデンサと前記信号端子との間の伝送ラインとグランド間に並列に接続された少なくとも2つのトラップ回路と、
前記伝送ラインの前記各トラップ回路との各接続点間に挿入された抵抗と、
を備え、
前記各トラップ回路は高周波遮断素子とカソードが前記高周波遮断素子の一端に接続されアノードがグランドに接続されたダイオードとが直列に接続されて成ることを特徴とする静電気保護回路。 - 高周波信号と駆動電源としての直流信号とが重畳されて伝送される信号端子に静電気が印加されたときに、前記信号端子に接続されている内部回路を前記静電気から保護する静電気保護回路であって、
前記直流信号を遮断するためのDCカットコンデンサと前記信号端子との間の伝送ラインとグランド間に並列に接続された少なくとも2つのトラップ回路と、
前記伝送ラインの前記各トラップ回路との各接続点間に挿入されたコンデンサと、
を備え、
前記各トラップ回路は高周波遮断素子とカソードが前記高周波遮断素子の一端に接続されアノードがグランドに接続されたダイオードとが直列に接続されて成ることを特徴とする静電気保護回路。 - 高周波信号と駆動電源としての直流信号とが重畳されて伝送される信号端子に静電気が印加されたときに、前記信号端子に接続されている内部回路を前記静電気から保護する静電気保護回路であって、
前記直流信号を遮断するためのDCカットコンデンサと前記信号端子との間の伝送ラインとグランド間に並列に接続された第1、第2のトラップ回路と、
前記伝送ラインの第1、第2のトラップ回路との各接続点間に挿入されたコンデンサと、
を備え、
第1のトラップ回路は高周波遮断素子とカソードが前記高周波遮断素子の一端に接続されアノードがグランドに接続されたダイオードとが直列に接続されて成り、
第2のトラップ回路は前記高周波信号の1/4波長の長さのマイクロストリップラインから成ることを特徴とする静電気保護回路。 - 前記ダイオードが、ショットキーバリアダイオードであることを特徴とする請求項1〜請求項3のいずれかに記載の静電気保護回路。
- 前記高周波遮断素子が、インダクタであることを特徴とする請求項1〜請求項4のいずれかに記載の静電気保護回路。
- 前記高周波遮断素子が、マイクロストリップラインであることを特徴とする請求項1〜請求項4のいずれかに記載の静電気保護回路。
- 前記マイクロストリップラインの長さが、前記信号端子に伝送される高周波信号の1/4波長であることを特徴とする請求項6に記載の静電気保護回路。
- 前記マイクロストリップラインの周辺に、グランドに接続された放電グランドパターンを設けたことを特徴とする請求項6または請求項7に記載の静電気保護回路。
- 請求項1〜請求項8のいずれかに記載の静電気保護回路を備えたことを特徴とする高周波回路装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004094078A JP4484564B2 (ja) | 2003-09-19 | 2004-03-29 | 静電気保護回路及びそれを備えた高周波回路装置 |
TW93126535A TWI262588B (en) | 2003-09-19 | 2004-09-02 | Static electricity protective circuit and high-frequency circuit apparatus incorporating the same |
US10/937,490 US7430103B2 (en) | 2003-09-19 | 2004-09-10 | Static electricity protective circuit and high-frequency circuit apparatus incorporating the same |
CNB2004100119182A CN100344211C (zh) | 2003-09-19 | 2004-09-20 | 静电保护电路和含有该电路的高频电路设备 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003327676 | 2003-09-19 | ||
JP2004094078A JP4484564B2 (ja) | 2003-09-19 | 2004-03-29 | 静電気保護回路及びそれを備えた高周波回路装置 |
Publications (2)
Publication Number | Publication Date |
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JP2005117000A JP2005117000A (ja) | 2005-04-28 |
JP4484564B2 true JP4484564B2 (ja) | 2010-06-16 |
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Family Applications (1)
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JP2004094078A Expired - Fee Related JP4484564B2 (ja) | 2003-09-19 | 2004-03-29 | 静電気保護回路及びそれを備えた高周波回路装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7430103B2 (ja) |
JP (1) | JP4484564B2 (ja) |
CN (1) | CN100344211C (ja) |
TW (1) | TWI262588B (ja) |
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JP2003152588A (ja) * | 2001-08-31 | 2003-05-23 | Hitachi Metals Ltd | マルチバンドアンテナスイッチ回路およびマルチバンドアンテナスイッチ積層モジュール複合部品並びにそれを用いた通信装置 |
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JP2606841Y2 (ja) | 1993-11-30 | 2001-01-29 | 株式会社東芝 | インタフェース回路 |
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- 2004-03-29 JP JP2004094078A patent/JP4484564B2/ja not_active Expired - Fee Related
- 2004-09-02 TW TW93126535A patent/TWI262588B/zh not_active IP Right Cessation
- 2004-09-10 US US10/937,490 patent/US7430103B2/en not_active Expired - Fee Related
- 2004-09-20 CN CNB2004100119182A patent/CN100344211C/zh not_active Expired - Fee Related
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JP2001186047A (ja) * | 1999-12-24 | 2001-07-06 | Kyocera Corp | 高周波回路 |
JP2001237372A (ja) * | 2000-02-21 | 2001-08-31 | Hitachi Ltd | 半導体集積回路装置 |
JP2003023101A (ja) * | 2001-07-05 | 2003-01-24 | Mitsubishi Electric Corp | 半導体装置 |
JP2003152588A (ja) * | 2001-08-31 | 2003-05-23 | Hitachi Metals Ltd | マルチバンドアンテナスイッチ回路およびマルチバンドアンテナスイッチ積層モジュール複合部品並びにそれを用いた通信装置 |
JP2003243512A (ja) * | 2002-02-14 | 2003-08-29 | Hitachi Ltd | 静電破壊保護回路 |
Also Published As
Publication number | Publication date |
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CN100344211C (zh) | 2007-10-17 |
TW200515583A (en) | 2005-05-01 |
US20050063129A1 (en) | 2005-03-24 |
CN1678162A (zh) | 2005-10-05 |
TWI262588B (en) | 2006-09-21 |
US7430103B2 (en) | 2008-09-30 |
JP2005117000A (ja) | 2005-04-28 |
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