JP4474414B2 - 電気絶縁構造体を電解処理するための装置および方法 - Google Patents

電気絶縁構造体を電解処理するための装置および方法 Download PDF

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JP4474414B2
JP4474414B2 JP2006525683A JP2006525683A JP4474414B2 JP 4474414 B2 JP4474414 B2 JP 4474414B2 JP 2006525683 A JP2006525683 A JP 2006525683A JP 2006525683 A JP2006525683 A JP 2006525683A JP 4474414 B2 JP4474414 B2 JP 4474414B2
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contact
workpiece
liquid
electrode
module
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JP2007505213A (ja
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ミヒャエル グッゲモス
フランツ コーンレ
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アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Processes Specially Adapted For Manufacturing Cables (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Electrolytic Production Of Metals (AREA)
JP2006525683A 2003-09-12 2004-08-19 電気絶縁構造体を電解処理するための装置および方法 Expired - Fee Related JP4474414B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10342512A DE10342512B3 (de) 2003-09-12 2003-09-12 Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut
PCT/EP2004/009436 WO2005026415A1 (en) 2003-09-12 2004-08-19 Device and method for electrolytically treating electrically insulated structures

Publications (2)

Publication Number Publication Date
JP2007505213A JP2007505213A (ja) 2007-03-08
JP4474414B2 true JP4474414B2 (ja) 2010-06-02

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JP2006525683A Expired - Fee Related JP4474414B2 (ja) 2003-09-12 2004-08-19 電気絶縁構造体を電解処理するための装置および方法

Country Status (13)

Country Link
US (1) US20060201817A1 (zh)
EP (1) EP1664390B1 (zh)
JP (1) JP4474414B2 (zh)
KR (1) KR101076947B1 (zh)
CN (1) CN1849415A (zh)
AT (1) ATE350514T1 (zh)
BR (1) BRPI0413715B1 (zh)
CA (1) CA2532451A1 (zh)
DE (2) DE10342512B3 (zh)
HK (1) HK1084423A1 (zh)
MX (1) MXPA06002649A (zh)
TW (1) TWI336358B (zh)
WO (1) WO2005026415A1 (zh)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4862513B2 (ja) * 2005-06-23 2012-01-25 東レ株式会社 給電用ローラならびに電解めっき被膜付きフィルムの製造装置および方法
DE102005031948B3 (de) * 2005-07-08 2006-06-14 Höllmüller Maschinenbau GmbH Vorrichtungen und Verfahren zur elektrolytischen Behandlung von Folien von Rolle zu Rolle
CA2619509C (en) 2005-08-12 2015-01-06 Modumetal, Llc. Compositionally modulated composite materials and methods for making the same
RU2420616C2 (ru) * 2006-04-18 2011-06-10 Басф Се Устройство и способ для гальванического покрытия
DE502007002680D1 (de) * 2006-04-18 2010-03-11 Basf Se Vorrichtung und verfahren zur galvanischen beschichtung
DE102006033353B4 (de) * 2006-07-19 2010-11-18 Höllmüller Maschinenbau GmbH Verfahren und Vorrichtung zum Behandeln von flachen, zerbrechlichen Substraten
TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating
DE102008004592A1 (de) 2008-01-16 2009-07-23 Danziger, Manfred, Dr. Bandgalvanikanlage zur elektrochemischen Verstärkung einer elektrisch leitfähigen äußeren Schicht eines Bandes
JP2009249659A (ja) * 2008-04-02 2009-10-29 Nippon Mektron Ltd 電気めっき装置及び電気めっき方法
US20100264035A1 (en) * 2009-04-15 2010-10-21 Solopower, Inc. Reel-to-reel plating of conductive grids for flexible thin film solar cells
DE102009022337A1 (de) * 2009-05-13 2010-11-18 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zur Behandlung eines Substrats
BRPI1010877B1 (pt) 2009-06-08 2020-09-15 Modumetal, Inc Revestimento de multicamadas resistente à corrosão e método de eletrodeposição
US8377267B2 (en) * 2009-09-30 2013-02-19 National Semiconductor Corporation Foil plating for semiconductor packaging
CN102383159A (zh) * 2011-08-09 2012-03-21 长春一汽富维高新汽车饰件有限公司 粗化生产与三价铬电解工艺合并的装置及方法
EP2626144A1 (en) * 2012-02-07 2013-08-14 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Roll to roll manufacturing system having a clean room deposition zone and a separate processing zone
EA032264B1 (ru) 2013-03-15 2019-05-31 Модьюметл, Инк. Способ нанесения покрытия на изделие, изделие, полученное вышеуказанным способом, и труба
US10472727B2 (en) 2013-03-15 2019-11-12 Modumetal, Inc. Method and apparatus for continuously applying nanolaminate metal coatings
BR112015022078B1 (pt) 2013-03-15 2022-05-17 Modumetal, Inc Aparelho e método para eletrodepositar um revestimento nanolaminado
EP2971261A4 (en) 2013-03-15 2017-05-31 Modumetal, Inc. Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes
WO2016044720A1 (en) 2014-09-18 2016-03-24 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
BR112015022020A8 (pt) 2013-03-15 2019-12-10 Modumetal Inc objeto ou revestimento e seu processo de fabricação
CN104195611B (zh) * 2014-08-15 2016-09-14 洛阳弘洋机械有限公司 一种棒料连续镀铬生产线
EA201790644A1 (ru) 2014-09-18 2017-08-31 Модьюметал, Инк. Способы изготовления изделий электроосаждением и процессами послойного синтеза
CN104928738B (zh) * 2015-05-21 2017-04-19 中国科学院山西煤炭化学研究所 一种碳纤维丝束的连续电镀金属方法及装置
CN105177660B (zh) * 2015-10-09 2017-11-21 华晶精密制造股份有限公司 一种金刚石切割线生产用水平上砂装置
AR109584A1 (es) 2016-09-08 2018-12-26 Modumetal Inc Procesos para proveer recubrimientos laminados sobre piezas de trabajo, y los artículos que se obtienen con los mismos
CA3057836A1 (en) 2017-03-24 2018-09-27 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
EP3612669A1 (en) 2017-04-21 2020-02-26 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
US11214884B2 (en) * 2017-07-11 2022-01-04 University Of South Florida Electrochemical three-dimensional printing and soldering
CN107523831B (zh) * 2017-09-30 2019-01-18 江阴康强电子有限公司 粗化浸镀子槽
EP3784823A1 (en) 2018-04-27 2021-03-03 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
CN108950622B (zh) * 2018-08-28 2020-07-21 温州杰锐电子科技有限公司 一种电刷镀装置
US10807823B2 (en) * 2019-02-01 2020-10-20 Assa Abloy Ab Card stacker
CN112249702A (zh) * 2019-07-22 2021-01-22 艾里亚设计股分有限公司 导引辊装置
US11713514B2 (en) * 2019-08-08 2023-08-01 Hutchinson Technology Incorporated Systems for electroplating and methods of use thereof
CN112111775B (zh) * 2020-08-15 2023-02-03 智兴(上海)五金有限公司 一种导线快速氧化处理系统

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1055001A (zh) * 1964-02-04
US3535222A (en) * 1964-02-04 1970-10-20 Aluminium Lab Ltd Apparatus for continuous electrolytic treatment
US4282073A (en) * 1979-08-22 1981-08-04 Thomas Steel Strip Corporation Electro-co-deposition of corrosion resistant nickel/zinc alloys onto steel substrates
US4324633A (en) * 1980-10-20 1982-04-13 Lovejoy Curtis N Electrolytic apparatus for treating continuous strip material
US4401523A (en) * 1980-12-18 1983-08-30 Republic Steel Corporation Apparatus and method for plating metallic strip
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
US4560445A (en) * 1984-12-24 1985-12-24 Polyonics Corporation Continuous process for fabricating metallic patterns on a thin film substrate
FR2653787B1 (fr) 1989-10-27 1992-02-14 Lorraine Laminage Installation et procede de revetement electrolytique d'une bande metallique.
DE4229403C2 (de) 1992-09-03 1995-04-13 Hoellmueller Maschbau H Vorrichtung zum Galvanisieren dünner, ein- oder beidseits mit einer leitfähigen Beschichtung versehener Kunststoffolien
DE19612555C2 (de) * 1996-03-29 1998-03-19 Atotech Deutschland Gmbh Verfahren zur selektiven elektrochemischen Behandlung von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens
DE19717512C3 (de) * 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating
DE19951325C2 (de) * 1999-10-20 2003-06-26 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von elektrisch isolierendem Folienmaterial sowie Anwendungen des Verfahrens
DE10043814C1 (de) * 2000-09-06 2002-04-11 Egon Huebel Verfahren und Vorrichtungen zum elektrochemischen Behandeln von Gut
DE10065649C2 (de) * 2000-12-29 2003-03-20 Egon Huebel Vorrichtung und Verfahren zum elektrochemischen Behandeln von elektrisch leitfähigen Bändern
DE10065643C2 (de) * 2000-12-29 2003-03-20 Egon Huebel Vorrichtung und Verfahren zum elektrochemischen Behandeln von bandförmigem und plattenförmigem Gut
WO2003038158A2 (de) * 2001-10-25 2003-05-08 Infineon Technologies Ag Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen

Also Published As

Publication number Publication date
CN1849415A (zh) 2006-10-18
HK1084423A1 (en) 2006-07-28
WO2005026415A1 (en) 2005-03-24
ATE350514T1 (de) 2007-01-15
US20060201817A1 (en) 2006-09-14
EP1664390A1 (en) 2006-06-07
DE602004004164D1 (de) 2007-02-15
CA2532451A1 (en) 2005-03-24
JP2007505213A (ja) 2007-03-08
DE10342512B3 (de) 2004-10-28
DE602004004164T2 (de) 2007-10-11
BRPI0413715A (pt) 2006-10-17
TW200510577A (en) 2005-03-16
MXPA06002649A (es) 2006-06-06
EP1664390B1 (en) 2007-01-03
TWI336358B (en) 2011-01-21
KR101076947B1 (ko) 2011-10-26
KR20060058116A (ko) 2006-05-29
BRPI0413715B1 (pt) 2013-09-17

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