HK1084423A1 - Device and method for electrolytically treating electrically insulated structures - Google Patents

Device and method for electrolytically treating electrically insulated structures

Info

Publication number
HK1084423A1
HK1084423A1 HK06106798A HK06106798A HK1084423A1 HK 1084423 A1 HK1084423 A1 HK 1084423A1 HK 06106798 A HK06106798 A HK 06106798A HK 06106798 A HK06106798 A HK 06106798A HK 1084423 A1 HK1084423 A1 HK 1084423A1
Authority
HK
Hong Kong
Prior art keywords
electrically insulated
contact
electrolytically treating
insulated structures
conducting structures
Prior art date
Application number
HK06106798A
Other languages
English (en)
Inventor
Michael Guggemos
Franz Kohnle
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of HK1084423A1 publication Critical patent/HK1084423A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Processes Specially Adapted For Manufacturing Cables (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
HK06106798A 2003-09-12 2006-06-14 Device and method for electrolytically treating electrically insulated structures HK1084423A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10342512A DE10342512B3 (de) 2003-09-12 2003-09-12 Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut
PCT/EP2004/009436 WO2005026415A1 (en) 2003-09-12 2004-08-19 Device and method for electrolytically treating electrically insulated structures

Publications (1)

Publication Number Publication Date
HK1084423A1 true HK1084423A1 (en) 2006-07-28

Family

ID=33039358

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06106798A HK1084423A1 (en) 2003-09-12 2006-06-14 Device and method for electrolytically treating electrically insulated structures

Country Status (13)

Country Link
US (1) US20060201817A1 (zh)
EP (1) EP1664390B1 (zh)
JP (1) JP4474414B2 (zh)
KR (1) KR101076947B1 (zh)
CN (1) CN1849415A (zh)
AT (1) ATE350514T1 (zh)
BR (1) BRPI0413715B1 (zh)
CA (1) CA2532451A1 (zh)
DE (2) DE10342512B3 (zh)
HK (1) HK1084423A1 (zh)
MX (1) MXPA06002649A (zh)
TW (1) TWI336358B (zh)
WO (1) WO2005026415A1 (zh)

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DE102005031948B3 (de) * 2005-07-08 2006-06-14 Höllmüller Maschinenbau GmbH Vorrichtungen und Verfahren zur elektrolytischen Behandlung von Folien von Rolle zu Rolle
JP5301993B2 (ja) 2005-08-12 2013-09-25 モジュメタル エルエルシー 組成変調複合材料及びその形成方法
KR20090009876A (ko) * 2006-04-18 2009-01-23 바스프 에스이 전해 도금 장치 및 방법
RU2008145105A (ru) * 2006-04-18 2010-05-27 Басф Се (De) Способ и устройство для гальванического покрытия
DE102006033353B4 (de) * 2006-07-19 2010-11-18 Höllmüller Maschinenbau GmbH Verfahren und Vorrichtung zum Behandeln von flachen, zerbrechlichen Substraten
TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating
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US20100264035A1 (en) * 2009-04-15 2010-10-21 Solopower, Inc. Reel-to-reel plating of conductive grids for flexible thin film solar cells
DE102009022337A1 (de) * 2009-05-13 2010-11-18 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zur Behandlung eines Substrats
EP3009532A1 (en) 2009-06-08 2016-04-20 Modumetal, Inc. Electrodeposited nanolaminate coatings and claddings for corrosion protection
US8377267B2 (en) * 2009-09-30 2013-02-19 National Semiconductor Corporation Foil plating for semiconductor packaging
CN102383159A (zh) * 2011-08-09 2012-03-21 长春一汽富维高新汽车饰件有限公司 粗化生产与三价铬电解工艺合并的装置及方法
EP2626144A1 (en) * 2012-02-07 2013-08-14 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Roll to roll manufacturing system having a clean room deposition zone and a separate processing zone
BR112015022020A8 (pt) 2013-03-15 2019-12-10 Modumetal Inc objeto ou revestimento e seu processo de fabricação
WO2016044720A1 (en) 2014-09-18 2016-03-24 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
CA2905575C (en) 2013-03-15 2022-07-12 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
US10472727B2 (en) 2013-03-15 2019-11-12 Modumetal, Inc. Method and apparatus for continuously applying nanolaminate metal coatings
WO2014145771A1 (en) 2013-03-15 2014-09-18 Modumetal, Inc. Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes
EA032264B1 (ru) 2013-03-15 2019-05-31 Модьюметл, Инк. Способ нанесения покрытия на изделие, изделие, полученное вышеуказанным способом, и труба
CN104195611B (zh) * 2014-08-15 2016-09-14 洛阳弘洋机械有限公司 一种棒料连续镀铬生产线
EA201790644A1 (ru) 2014-09-18 2017-08-31 Модьюметал, Инк. Способы изготовления изделий электроосаждением и процессами послойного синтеза
CN104928738B (zh) * 2015-05-21 2017-04-19 中国科学院山西煤炭化学研究所 一种碳纤维丝束的连续电镀金属方法及装置
CN105177660B (zh) * 2015-10-09 2017-11-21 华晶精密制造股份有限公司 一种金刚石切割线生产用水平上砂装置
CN109952391B (zh) 2016-09-08 2022-11-01 莫杜美拓有限公司 在工件上提供层压涂层的方法，及由其制备的制品
EP3512987A1 (en) 2016-09-14 2019-07-24 Modumetal, Inc. System for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom
CN110114210B (zh) 2016-11-02 2022-03-04 莫杜美拓有限公司 拓扑优化的高界面填充结构
CA3057836A1 (en) 2017-03-24 2018-09-27 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
US11286575B2 (en) 2017-04-21 2022-03-29 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
US11214884B2 (en) 2017-07-11 2022-01-04 University Of South Florida Electrochemical three-dimensional printing and soldering
CN107523831B (zh) * 2017-09-30 2019-01-18 江阴康强电子有限公司 粗化浸镀子槽
EP3784823A1 (en) 2018-04-27 2021-03-03 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
CN108950622B (zh) * 2018-08-28 2020-07-21 温州杰锐电子科技有限公司 一种电刷镀装置
US10807823B2 (en) * 2019-02-01 2020-10-20 Assa Abloy Ab Card stacker
CN112249702A (zh) * 2019-07-22 2021-01-22 艾里亚设计股分有限公司 导引辊装置
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CN112111775B (zh) * 2020-08-15 2023-02-03 智兴(上海)五金有限公司 一种导线快速氧化处理系统

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Also Published As

Publication number Publication date
US20060201817A1 (en) 2006-09-14
EP1664390A1 (en) 2006-06-07
TWI336358B (en) 2011-01-21
CN1849415A (zh) 2006-10-18
BRPI0413715B1 (pt) 2013-09-17
DE10342512B3 (de) 2004-10-28
EP1664390B1 (en) 2007-01-03
ATE350514T1 (de) 2007-01-15
MXPA06002649A (es) 2006-06-06
TW200510577A (en) 2005-03-16
DE602004004164D1 (de) 2007-02-15
DE602004004164T2 (de) 2007-10-11
WO2005026415A1 (en) 2005-03-24
KR101076947B1 (ko) 2011-10-26
CA2532451A1 (en) 2005-03-24
BRPI0413715A (pt) 2006-10-17
KR20060058116A (ko) 2006-05-29
JP4474414B2 (ja) 2010-06-02
JP2007505213A (ja) 2007-03-08

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20150819