JP4456727B2 - 半導体装置の製造方法および基板処理装置 - Google Patents

半導体装置の製造方法および基板処理装置 Download PDF

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JP4456727B2
JP4456727B2 JP2000157939A JP2000157939A JP4456727B2 JP 4456727 B2 JP4456727 B2 JP 4456727B2 JP 2000157939 A JP2000157939 A JP 2000157939A JP 2000157939 A JP2000157939 A JP 2000157939A JP 4456727 B2 JP4456727 B2 JP 4456727B2
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boat
wafer
stage
processing chamber
time
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JP2001338889A5 (enExample
JP2001338889A (ja
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晃弘 大坂
幸一 能戸
建久 松永
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Kokusai Denki Electric Inc
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Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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JP2000157939A 2000-05-29 2000-05-29 半導体装置の製造方法および基板処理装置 Expired - Lifetime JP4456727B2 (ja)

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JP2000157939A JP4456727B2 (ja) 2000-05-29 2000-05-29 半導体装置の製造方法および基板処理装置

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JP2001338889A JP2001338889A (ja) 2001-12-07
JP2001338889A5 JP2001338889A5 (enExample) 2007-07-12
JP4456727B2 true JP4456727B2 (ja) 2010-04-28

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Publication number Priority date Publication date Assignee Title
JP5027430B2 (ja) * 2006-03-07 2012-09-19 株式会社日立国際電気 基板処理装置
JP4880408B2 (ja) * 2006-09-22 2012-02-22 株式会社日立国際電気 基板処理装置、基板処理方法、半導体装置の製造方法、メインコントローラおよびプログラム
JP2024102748A (ja) * 2023-01-19 2024-07-31 株式会社Kokusai Electric 基板処理装置、基板処理方法、半導体装置の製造方法及びプログラム

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