JP4450983B2 - 液晶表示体基板用プラズマ処理装置 - Google Patents
液晶表示体基板用プラズマ処理装置 Download PDFInfo
- Publication number
- JP4450983B2 JP4450983B2 JP2000381801A JP2000381801A JP4450983B2 JP 4450983 B2 JP4450983 B2 JP 4450983B2 JP 2000381801 A JP2000381801 A JP 2000381801A JP 2000381801 A JP2000381801 A JP 2000381801A JP 4450983 B2 JP4450983 B2 JP 4450983B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- plasma processing
- crystal display
- housing
- processing chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012545 processing Methods 0.000 title claims description 132
- 239000000758 substrate Substances 0.000 title claims description 122
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 30
- 230000007246 mechanism Effects 0.000 claims description 93
- 238000012546 transfer Methods 0.000 claims description 37
- 230000003028 elevating effect Effects 0.000 claims description 14
- 230000000452 restraining effect Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 description 25
- 230000002093 peripheral effect Effects 0.000 description 13
- 239000002245 particle Substances 0.000 description 11
- 239000003507 refrigerant Substances 0.000 description 9
- 230000007723 transport mechanism Effects 0.000 description 9
- 239000006227 byproduct Substances 0.000 description 7
- 230000002159 abnormal effect Effects 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000725 suspension Substances 0.000 description 5
- 229920003002 synthetic resin Polymers 0.000 description 5
- 239000000057 synthetic resin Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 238000009832 plasma treatment Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Liquid Crystal (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000381801A JP4450983B2 (ja) | 1999-12-22 | 2000-12-15 | 液晶表示体基板用プラズマ処理装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-363801 | 1999-12-22 | ||
| JP36380199 | 1999-12-22 | ||
| JP2000381801A JP4450983B2 (ja) | 1999-12-22 | 2000-12-15 | 液晶表示体基板用プラズマ処理装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002260922A Division JP3924721B2 (ja) | 1999-12-22 | 2002-09-06 | シールドリングの分割部材、シールドリング及びプラズマ処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001244253A JP2001244253A (ja) | 2001-09-07 |
| JP2001244253A5 JP2001244253A5 (enExample) | 2009-01-08 |
| JP4450983B2 true JP4450983B2 (ja) | 2010-04-14 |
Family
ID=26581513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000381801A Expired - Fee Related JP4450983B2 (ja) | 1999-12-22 | 2000-12-15 | 液晶表示体基板用プラズマ処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4450983B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100626279B1 (ko) * | 1999-12-30 | 2006-09-22 | 엘지.필립스 엘시디 주식회사 | 드라이 에칭장치 |
| JP4916220B2 (ja) * | 2006-05-31 | 2012-04-11 | 東京エレクトロン株式会社 | プラズマ処理装置及びそれに用いられる電極 |
| JP4450106B1 (ja) * | 2008-03-11 | 2010-04-14 | 東京エレクトロン株式会社 | 載置台構造及び処理装置 |
| JP5560909B2 (ja) * | 2010-05-31 | 2014-07-30 | 東京エレクトロン株式会社 | 蓋体保持治具 |
| JP5631114B2 (ja) * | 2010-08-24 | 2014-11-26 | 株式会社日本マイクロニクス | 平板状被検査体の検査装置 |
| US10892180B2 (en) * | 2014-06-02 | 2021-01-12 | Applied Materials, Inc. | Lift pin assembly |
-
2000
- 2000-12-15 JP JP2000381801A patent/JP4450983B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001244253A (ja) | 2001-09-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI795621B (zh) | 電漿處理裝置及電漿處理裝置之載置台 | |
| US7276123B2 (en) | Semiconductor-processing apparatus provided with susceptor and placing block | |
| JP4367959B2 (ja) | プラズマ処理装置 | |
| TW201349377A (zh) | 獨立晶圓處理的方法及設備 | |
| JP7455012B2 (ja) | プラズマ処理装置およびプラズマ処理装置の載置台 | |
| JP3924721B2 (ja) | シールドリングの分割部材、シールドリング及びプラズマ処理装置 | |
| US20210375650A1 (en) | High temperature and vacuum isolation processing mini-environments | |
| TWI484555B (zh) | 基板處理裝置及半導體裝置之製造方法 | |
| KR20210030917A (ko) | 기판 처리 장치 및 기판 처리 방법 | |
| JP4450983B2 (ja) | 液晶表示体基板用プラズマ処理装置 | |
| KR100873967B1 (ko) | 완충메카니즘을 갖는 반도체 제조장치 및 반도체 웨이퍼의완충방법 | |
| KR100622201B1 (ko) | 액정 표시 장치용 기판을 위한 플라즈마 처리 장치 | |
| TWI791295B (zh) | 成膜裝置 | |
| JP2001267254A (ja) | 半導体製造装置 | |
| KR102818285B1 (ko) | 기판 지지 유닛과 이를 가지는 기판 처리 장치 및 링 반송 방법 | |
| JP7769538B2 (ja) | 基板支持台及びリングの交換方法 | |
| JP5031960B2 (ja) | 基板処理装置および半導体装置の製造方法 | |
| KR20230061962A (ko) | 기판 지지 유닛과 이를 가지는 기판 처리 장치 및 링 반송 방법 | |
| JP4270413B2 (ja) | プロセス装置 | |
| JP2004011005A (ja) | 処理装置および処理方法 | |
| JPH0260055B2 (enExample) | ||
| CN116895577A (zh) | 用于末端执行器的载体、包括载体的运送设备、和衬底处理设备 | |
| KR20230064019A (ko) | 반송 로봇, 이를 가지는 기판 처리 장치 | |
| KR20230064021A (ko) | 기판 처리 장치 | |
| JP2009177178A (ja) | プロセス装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071214 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20071214 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20091015 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20091027 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091221 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100126 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100127 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 4450983 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130205 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130205 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160205 Year of fee payment: 6 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |