JP4440158B2 - 熱分解法により製造される二酸化ケイ素粉末 - Google Patents
熱分解法により製造される二酸化ケイ素粉末 Download PDFInfo
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- JP4440158B2 JP4440158B2 JP2005106834A JP2005106834A JP4440158B2 JP 4440158 B2 JP4440158 B2 JP 4440158B2 JP 2005106834 A JP2005106834 A JP 2005106834A JP 2005106834 A JP2005106834 A JP 2005106834A JP 4440158 B2 JP4440158 B2 JP 4440158B2
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 71
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000000197 pyrolysis Methods 0.000 title claims description 10
- 238000006243 chemical reaction Methods 0.000 claims abstract description 29
- 239000000203 mixture Substances 0.000 claims abstract description 21
- 150000003377 silicon compounds Chemical class 0.000 claims abstract description 17
- 239000000567 combustion gas Substances 0.000 claims abstract description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 14
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 14
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000001301 oxygen Substances 0.000 claims abstract description 12
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 12
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 12
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000002156 mixing Methods 0.000 claims abstract description 10
- 229920000728 polyester Polymers 0.000 claims abstract description 10
- 238000002485 combustion reaction Methods 0.000 claims abstract description 8
- 239000007787 solid Substances 0.000 claims abstract description 8
- 239000000126 substance Substances 0.000 claims abstract description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 7
- 239000011164 primary particle Substances 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910001868 water Inorganic materials 0.000 claims abstract description 7
- 239000012159 carrier gas Substances 0.000 claims abstract description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000001569 carbon dioxide Substances 0.000 claims abstract description 5
- 229910002092 carbon dioxide Inorganic materials 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 5
- 229910003902 SiCl 4 Inorganic materials 0.000 claims abstract description 4
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 claims abstract description 4
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910000041 hydrogen chloride Inorganic materials 0.000 claims abstract description 3
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical class Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 3
- 239000007858 starting material Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 3
- 238000010348 incorporation Methods 0.000 claims description 2
- 239000011541 reaction mixture Substances 0.000 claims description 2
- 239000004945 silicone rubber Substances 0.000 claims description 2
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 abstract description 5
- 239000005049 silicon tetrachloride Substances 0.000 abstract description 5
- 239000005055 methyl trichlorosilane Substances 0.000 abstract description 4
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 abstract description 4
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 abstract description 3
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 abstract description 3
- 239000005052 trichlorosilane Substances 0.000 abstract description 3
- 238000001704 evaporation Methods 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 17
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 12
- 239000000843 powder Substances 0.000 description 9
- 230000008719 thickening Effects 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- 229920001225 polyester resin Polymers 0.000 description 7
- 239000004645 polyester resin Substances 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 238000006460 hydrolysis reaction Methods 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 230000007062 hydrolysis Effects 0.000 description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 description 3
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 2
- -1 silicon halide Chemical class 0.000 description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- NJKDOKBDBHYMAH-UHFFFAOYSA-N dibutyl(dichloro)silane Chemical compound CCCC[Si](Cl)(Cl)CCCC NJKDOKBDBHYMAH-UHFFFAOYSA-N 0.000 description 1
- KTQYJQFGNYHXMB-UHFFFAOYSA-N dichloro(methyl)silicon Chemical compound C[Si](Cl)Cl KTQYJQFGNYHXMB-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 239000003317 industrial substance Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000005048 methyldichlorosilane Substances 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000005053 propyltrichlorosilane Substances 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- ZOYFEXPFPVDYIS-UHFFFAOYSA-N trichloro(ethyl)silane Chemical compound CC[Si](Cl)(Cl)Cl ZOYFEXPFPVDYIS-UHFFFAOYSA-N 0.000 description 1
- DOEHJNBEOVLHGL-UHFFFAOYSA-N trichloro(propyl)silane Chemical compound CCC[Si](Cl)(Cl)Cl DOEHJNBEOVLHGL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
- C01B33/181—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process
- C01B33/183—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process by oxidation or hydrolysis in the vapour phase of silicon compounds such as halides, trichlorosilane, monosilane
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/20—Silicates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Developing Agents For Electrophotography (AREA)
Description
− BET表面積200±25m2/gを有し、かつ該凝集体が
− 平均表面積7000〜12000nm2、
− 平均等価円直径(ECD=等価円直径)80〜100nm、及び
− 平均周囲長850〜1050nm
を有する二酸化ケイ素粉末である。
− 平均表面積7500〜9000nm2、
− 平均等価円直径83〜90nm、及び
− 平均周囲長870〜1000nm
を有する二酸化ケイ素粉末が有利なことがある。
− ケイ素化合物の混合物を、別個に又は一緒に蒸発させ、その蒸気をキャリヤガスにより混合室に移送し、その際、
− 第一成分としてのSiCl4は混合物に対して60〜95質量%の割合であり、
− H3SiCl、H2SiCl2、HSiCl3、CH3SiCl3、(CH3)2SiCl2、(CH3)3SiCl、(n−C3H7)SiCl3を含む群から選択される第二成分は混合物に対して5〜40質量%であり、
− 前記のものとは別個に、燃焼ガス、場合により酸素富化されかつ/又は予熱されていてよい一次空気を混合室に移送し、
− 塩化ケイ素の蒸気、燃焼ガス及び一次空気よりなる混合物を燃焼器中で着火させ、そしてその火炎を反応室で燃焼に用い、
− その火炎を取り囲む二次空気を反応室に取り込み、その際、二次空気/一次空気の比率は0.05〜3、有利には0.15〜2であり、
− 引き続き固体を気体状物質から分離し、そして次いでその固体を250℃〜750℃で水蒸気により処理し、その際、
− 酸素全量は、燃焼ガス及びケイ素化合物の完全な燃焼のために少なくとも十分であり、かつ
− ケイ素化合物、燃焼ガス、一次空気及び二次空気からなる出発物質の量は、1570〜1630℃の断熱火炎温度Tadが得られるように選択され、その際、
Tadは、出発物質温度+部分反応の反応エンタルピーの合計/反応室から排出される、二酸化ケイ素、水、塩化水素、二酸化炭素、酸素、窒素及びキャリヤガス(これが空気又は窒素でない場合)を含む物質の熱容量であり、その際、前記物質の1000℃での比熱を基礎とする
ことよりなる方法である。
70kg/時間の四塩化ケイ素及び35kg/時間のメチルトリクロロシランを蒸発させ、そして窒素を用いて燃焼器の混合室に移送する。同時に40Nm3/時間の水素及び195Nm3/時間の一次空気を混合室に添加する。該混合物は90℃の温度を有する。該混合物を着火させ、そしてその火炎を反応室で燃焼に用いる。更にその火炎を取り囲む30Nm3/時間の二次空気を反応室に取り込む。
比較例8〜10では、ケイ素化合物の組成が特許請求の範囲外である。第4表から読み取れるように、平均凝集体面積、平均ECD、平均凝集体周囲長、平均の最大凝集体径及び平均の最小凝集体径が本発明による二酸化ケイ素粉末のものより大きい粉末が得られる。
Claims (11)
- 一次粒子の凝集体の形の熱分解法により製造された二酸化ケイ素粉末であって、一次粒子が
− BET表面積200±25m2/gを有し、かつ該凝集体が
− 平均面積7000〜12000nm2、
− 平均等価円直径(ECD=等価円直径)80〜100nm、及び
− 平均周囲長850〜1050nm
を有することを特徴とする二酸化ケイ素粉末。 - 凝集体が
− 平均面積7500〜9000nm2、
− 平均等価円直径83〜90nm、及び
− 平均周囲長870〜1000nm
を有する、請求項1記載の熱分解法により製造された二酸化ケイ素粉末。 - 最大凝集体径が150〜170nmであり、かつ最小凝集体径が90〜110nmである、請求項1又は2記載の熱分解法により製造された二酸化ケイ素粉末。
- 塩化物含量が250ppm未満である、請求項1から3までのいずれか1項記載の熱分解法により製造された二酸化ケイ素粉末。
- 炭素含量が100ppm未満である、請求項1から4までのいずれか1項記載の熱分解法により製造された二酸化ケイ素粉末。
- 請求項1から5までのいずれか1項記載の二酸化ケイ素粉末の製造方法であって、
− ケイ素化合物の混合物を、別個に又は一緒に蒸発させ、その蒸気をキャリヤガスにより混合室に移送し、その際、
− 第一成分としてのSiCl4は混合物に対して60〜95質量%の割合であり、
− H3SiCl、H2SiCl2、HSiCl3、CH3SiCl3、(CH3)2SiCl2、(CH3)3SiCl、(n−C3H7)SiCl3を含む群から選択される第二成分は混合物に対して5〜40質量%であり、
− 前記のものとは別個に、燃焼ガス、場合により酸素富化されかつ/又は予熱されていてよい一次空気を混合室に移送し、
− 塩化ケイ素の蒸気、燃焼ガス及び一次空気よりなる混合物を燃焼器中で着火させ、そしてその火炎を反応室で燃焼に用い、
− その火炎を取り囲む二次空気を反応室に取り込み、その際、二次空気/一次空気の比率は0.05〜3であり、
− 引き続き固体を気体状物質から分離し、そして次いでその固体を250℃〜750℃で水蒸気により処理し、その際、
− 酸素全量は、燃焼ガス及びケイ素化合物の完全な燃焼のために少なくとも十分であり、かつ
− ケイ素化合物、燃焼ガス、一次空気及び二次空気からなる出発物質の量は、1570〜1630℃の断熱火炎温度Tadが得られるように選択され、その際、
Tadは、出発物質温度+部分反応の反応エンタルピーの合計/反応室から排出される、二酸化ケイ素、水、塩化水素、二酸化炭素、酸素、窒素及び場合によりキャリヤガス(これが空気又は窒素でない場合)を含む物質の熱容量であり、その際、前記物質の1000℃での比熱を基礎とする
ことを特徴とする方法。 - 二次空気/一次空気の比率が0.15〜2である、請求項6記載の方法。
- 出発物質の温度が90℃±40℃である、請求項6又は7記載の方法。
- 混合室から反応室への反応混合物の排出速度が10〜80m/秒である、請求項6から8までのいずれか1項記載の方法。
- 請求項1から5までのいずれか1項記載の熱分解法により製造された二酸化ケイ素粉末を含有するポリエステル。
- 請求項1から5までのいずれか1項記載の熱分解法により製造された二酸化ケイ素粉末を含有するシリコーンゴム。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200510001408 DE102005001408A1 (de) | 2005-01-12 | 2005-01-12 | Pyrogen hergestelltes Siliciumdioxidpulver |
Publications (2)
Publication Number | Publication Date |
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JP2006193405A JP2006193405A (ja) | 2006-07-27 |
JP4440158B2 true JP4440158B2 (ja) | 2010-03-24 |
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JP2005106834A Active JP4440158B2 (ja) | 2005-01-12 | 2005-04-01 | 熱分解法により製造される二酸化ケイ素粉末 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7491375B2 (ja) |
EP (1) | EP1693343B1 (ja) |
JP (1) | JP4440158B2 (ja) |
KR (1) | KR100649047B1 (ja) |
CN (1) | CN1803604B (ja) |
AT (1) | ATE480499T1 (ja) |
DE (2) | DE102005001408A1 (ja) |
ES (1) | ES2352503T3 (ja) |
UA (1) | UA83667C2 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102004021092A1 (de) * | 2004-04-29 | 2005-11-24 | Degussa Ag | Verwendung einer kationischen Siliciumdioxid-Dispersion als Textilveredlungsmittel |
DE102005007753A1 (de) * | 2005-02-18 | 2006-08-31 | Wacker Chemie Ag | Partikel mit geringer spezifischer Oberfläche und hoher Verdickungswirkung |
DE102006039273A1 (de) * | 2006-08-22 | 2008-02-28 | Evonik Degussa Gmbh | Pyrogenes Siliciumdioxid zur Verwendung als Hilfsstoff in pharmazeutischen und kosmetischen Zusammensetzungen |
DE102006054156A1 (de) * | 2006-11-16 | 2008-05-21 | Wacker Chemie Ag | Pyrogene Kieselsäure hergestellt in einer Produktions-Anlage mit großer Kapazität |
DE102007025685A1 (de) * | 2007-06-01 | 2008-12-04 | Evonik Degussa Gmbh | RTV-Zweikomponenten-Silikonkautschuk |
DE102007035952A1 (de) * | 2007-07-30 | 2009-04-09 | Evonik Degussa Gmbh | Oberflächenmodifizierte, pyrogen hergestellte Kieselsäuren |
DE102007035951A1 (de) * | 2007-07-30 | 2009-02-05 | Evonik Degussa Gmbh | Oberflächenmodifizierte, pyrogen hergestellte Kieselsäuren |
DE102007035955A1 (de) * | 2007-07-30 | 2009-02-05 | Evonik Degussa Gmbh | Oberflächenmodifizierte, pyrogen hergestellte Kieselsäuren |
DE102008000499A1 (de) * | 2008-03-04 | 2009-09-10 | Evonik Degussa Gmbh | Kieselsäure sowie Epoxidharze |
US8729158B2 (en) * | 2008-09-05 | 2014-05-20 | Cabot Corporation | Fumed silica of controlled aggregate size and processes for manufacturing the same |
US8038971B2 (en) * | 2008-09-05 | 2011-10-18 | Cabot Corporation | Fumed silica of controlled aggregate size and processes for manufacturing the same |
RU2012132445A (ru) | 2009-12-29 | 2014-02-10 | У.Р. Грейс Энд Ко.-Конн. | Композиции для образования пленок, имеющих желательную степень матирования, и способы их получения и применения |
JP5038449B2 (ja) * | 2010-03-09 | 2012-10-03 | キヤノン株式会社 | 画像形成装置 |
DE102010031585A1 (de) * | 2010-07-21 | 2012-01-26 | Evonik Degussa Gmbh | Siliciumdioxidpulver mit speziellen Oberflächeneigenschaften und dieses Pulver enthaltende Tonerzusammensetzung |
DE102011083528A1 (de) | 2011-09-27 | 2013-03-28 | Wacker Chemie Ag | Verfahren zur Herstellung von Zuckeralkoholen durch katalytische Hydrierung von Zuckern an einem Ru/SiO2-Katalysator |
WO2015003873A1 (de) * | 2013-07-11 | 2015-01-15 | Evonik Industries Ag | Verfahren zur herstellung von kieselsäure mit variabler verdickung |
KR102284997B1 (ko) * | 2017-07-13 | 2021-08-05 | 와커 헤미 아게 | 고 분산된 이산화규소의 제조 방법 |
Family Cites Families (13)
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DE2904199A1 (de) * | 1979-02-05 | 1980-08-07 | Degussa | Verfahren zur gelenkten herstellung von kieselsaeure mittels flammenhydrolyse |
DE3223454A1 (de) * | 1982-06-23 | 1983-12-29 | Wacker-Chemie GmbH, 8000 München | Verfahren zur herstellung von pyrogenerzeugter kieselsaeure mit verstaerkter verdickungswirkung |
US5340560A (en) * | 1993-04-30 | 1994-08-23 | General Electric Company | Method for making fumed silica having a reduced aggregate size and product |
EP0725037B2 (de) * | 1995-02-04 | 2012-04-25 | Evonik Degussa GmbH | Granulate auf Basis von pyrogen hergestelltem Siliciumdioxid, Verfahren zu ihrer Herstellung und ihre Verwendung |
DE19650500A1 (de) * | 1996-12-05 | 1998-06-10 | Degussa | Dotierte, pyrogen hergestellte Oxide |
JP3796565B2 (ja) * | 2000-08-15 | 2006-07-12 | 信越化学工業株式会社 | 球状シリカ微粒子の製造方法 |
JP3750728B2 (ja) * | 2000-12-05 | 2006-03-01 | 信越化学工業株式会社 | 微細シリカの製造方法 |
DE10145162A1 (de) * | 2001-09-13 | 2003-04-10 | Wacker Chemie Gmbh | Kieselsäure mit geringem Gehalt an Kieselsäure-Silanolgruppen |
DE10242798A1 (de) * | 2002-09-14 | 2004-04-01 | Degussa Ag | Silikonkautschuk |
DE10258858A1 (de) * | 2002-12-17 | 2004-08-05 | Degussa Ag | Pyrogen hergestelltes Siliciumdioxid |
KR100954073B1 (ko) * | 2002-12-18 | 2010-04-23 | 에보닉 데구사 게엠베하 | 구조적으로 피복된 실리카 |
DE10326049A1 (de) * | 2003-06-10 | 2004-12-30 | Degussa Ag | Flammenhydrolytisch hergestelltes Siliciumdioxid, Verfahren zu seiner Herstellung und Verwendung |
DE102004010755A1 (de) * | 2004-03-05 | 2005-09-22 | Degussa Ag | Silikonkautschuk |
-
2005
- 2005-01-12 DE DE200510001408 patent/DE102005001408A1/de not_active Withdrawn
- 2005-03-18 DE DE200550010213 patent/DE502005010213D1/de active Active
- 2005-03-18 ES ES05005928T patent/ES2352503T3/es active Active
- 2005-03-18 AT AT05005928T patent/ATE480499T1/de active
- 2005-03-18 EP EP05005928A patent/EP1693343B1/de active Active
- 2005-03-21 US US11/084,170 patent/US7491375B2/en active Active
- 2005-04-01 JP JP2005106834A patent/JP4440158B2/ja active Active
- 2005-04-04 KR KR20050028061A patent/KR100649047B1/ko active IP Right Grant
- 2005-04-22 CN CN2005100676208A patent/CN1803604B/zh active Active
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Also Published As
Publication number | Publication date |
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EP1693343A3 (de) | 2006-09-13 |
DE502005010213D1 (de) | 2010-10-21 |
EP1693343B1 (de) | 2010-09-08 |
JP2006193405A (ja) | 2006-07-27 |
CN1803604A (zh) | 2006-07-19 |
CN1803604B (zh) | 2011-10-05 |
ATE480499T1 (de) | 2010-09-15 |
DE102005001408A1 (de) | 2006-07-20 |
UA83667C2 (uk) | 2008-08-11 |
KR20060082382A (ko) | 2006-07-18 |
US20060155052A1 (en) | 2006-07-13 |
KR100649047B1 (ko) | 2006-11-27 |
EP1693343A2 (de) | 2006-08-23 |
ES2352503T3 (es) | 2011-02-21 |
US7491375B2 (en) | 2009-02-17 |
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