JP4428299B2 - めっき装置 - Google Patents
めっき装置 Download PDFInfo
- Publication number
- JP4428299B2 JP4428299B2 JP2005177245A JP2005177245A JP4428299B2 JP 4428299 B2 JP4428299 B2 JP 4428299B2 JP 2005177245 A JP2005177245 A JP 2005177245A JP 2005177245 A JP2005177245 A JP 2005177245A JP 4428299 B2 JP4428299 B2 JP 4428299B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- plating solution
- shielding plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electroplating Methods And Accessories (AREA)
Description
1a 上部遮蔽板
1b 側部遮蔽板
2 ノズル部
3 被めっき体
4 陽極
5 めっき槽
6 流出部
7 注入孔
8 中間板
9 噴出口
10 継手
11 めっき装置
12 めっき電源
13 開口部
14 孔
Claims (1)
- 板状の被めっき体をその両面から挟持して略垂直に配設するための遮蔽板と、この遮蔽板の下端部に一体で構成され、前記被めっき体にめっき液を供給噴出するためのノズル部と、前記遮蔽板を間にして配設された一対の陽極と、これら遮蔽板、一対の陽極、ノズル部を内蔵し、前記めっき液を貯留するためのめっき槽とを備え、前記遮蔽板は、被めっき体の四辺端部を覆うようにフレーム形状とし、このフレーム形状の上端部にめっき液を流出させるための開口部を設けたことを特徴とするめっき装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005177245A JP4428299B2 (ja) | 2005-06-17 | 2005-06-17 | めっき装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005177245A JP4428299B2 (ja) | 2005-06-17 | 2005-06-17 | めっき装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006348356A JP2006348356A (ja) | 2006-12-28 |
JP4428299B2 true JP4428299B2 (ja) | 2010-03-10 |
Family
ID=37644500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005177245A Expired - Fee Related JP4428299B2 (ja) | 2005-06-17 | 2005-06-17 | めっき装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4428299B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101226663B1 (ko) * | 2012-08-09 | 2013-01-25 | (주) 탑스 | 애노드 모듈 및 이를 포함하는 전기 도금 장치 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102817065B (zh) * | 2011-06-08 | 2015-01-21 | 沈阳中科超硬磨具磨削研究所 | 一种电镀夹具 |
JP6411741B2 (ja) * | 2013-05-20 | 2018-10-24 | 国立大学法人 熊本大学 | 電解処理方法及び電解処理装置 |
JP6337016B2 (ja) | 2014-01-08 | 2018-06-06 | 東京エレクトロン株式会社 | 電解処理方法及び電解処理装置 |
-
2005
- 2005-06-17 JP JP2005177245A patent/JP4428299B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101226663B1 (ko) * | 2012-08-09 | 2013-01-25 | (주) 탑스 | 애노드 모듈 및 이를 포함하는 전기 도금 장치 |
Also Published As
Publication number | Publication date |
---|---|
JP2006348356A (ja) | 2006-12-28 |
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