JP4422411B2 - ダイ支持を有するマイクロエレクトロニック・アセンブリを形成する方法 - Google Patents

ダイ支持を有するマイクロエレクトロニック・アセンブリを形成する方法 Download PDF

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Publication number
JP4422411B2
JP4422411B2 JP2002578545A JP2002578545A JP4422411B2 JP 4422411 B2 JP4422411 B2 JP 4422411B2 JP 2002578545 A JP2002578545 A JP 2002578545A JP 2002578545 A JP2002578545 A JP 2002578545A JP 4422411 B2 JP4422411 B2 JP 4422411B2
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JP
Japan
Prior art keywords
die
substrate
bond pads
solder
precursor material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002578545A
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English (en)
Japanese (ja)
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JP2004524703A (ja
JP2004524703A5 (https=
Inventor
エム． シャイファーズ、スティーブン
スキポール、アンドリュー
ガモタ、ダニエル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
NXP USA Inc
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Filing date
Publication date
Application filed by NXP USA Inc filed Critical NXP USA Inc
Publication of JP2004524703A publication Critical patent/JP2004524703A/ja
Publication of JP2004524703A5 publication Critical patent/JP2004524703A5/ja
Application granted granted Critical
Publication of JP4422411B2 publication Critical patent/JP4422411B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Wire Bonding (AREA)
JP2002578545A 2001-03-28 2002-02-22 ダイ支持を有するマイクロエレクトロニック・アセンブリを形成する方法 Expired - Fee Related JP4422411B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/819,393 US6562663B2 (en) 2001-03-28 2001-03-28 Microelectronic assembly with die support and method
PCT/US2002/005431 WO2002080229A2 (en) 2001-03-28 2002-02-22 Microelectronic assembly with die support and method

Publications (3)

Publication Number Publication Date
JP2004524703A JP2004524703A (ja) 2004-08-12
JP2004524703A5 JP2004524703A5 (https=) 2005-12-22
JP4422411B2 true JP4422411B2 (ja) 2010-02-24

Family

ID=25228026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002578545A Expired - Fee Related JP4422411B2 (ja) 2001-03-28 2002-02-22 ダイ支持を有するマイクロエレクトロニック・アセンブリを形成する方法

Country Status (4)

Country Link
US (2) US6562663B2 (https=)
EP (1) EP1504468A4 (https=)
JP (1) JP4422411B2 (https=)
WO (1) WO2002080229A2 (https=)

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US6352881B1 (en) * 1999-07-22 2002-03-05 National Semiconductor Corporation Method and apparatus for forming an underfill adhesive layer
JP4403631B2 (ja) * 2000-04-24 2010-01-27 ソニー株式会社 チップ状電子部品の製造方法、並びにその製造に用いる擬似ウエーハの製造方法
JP2001313350A (ja) * 2000-04-28 2001-11-09 Sony Corp チップ状電子部品及びその製造方法、並びにその製造に用いる疑似ウエーハ及びその製造方法
US7423337B1 (en) 2002-08-19 2008-09-09 National Semiconductor Corporation Integrated circuit device package having a support coating for improved reliability during temperature cycling
US7115998B2 (en) * 2002-08-29 2006-10-03 Micron Technology, Inc. Multi-component integrated circuit contacts
US7301222B1 (en) 2003-02-12 2007-11-27 National Semiconductor Corporation Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages
TW594955B (en) * 2003-06-30 2004-06-21 Advanced Semiconductor Eng Flip chip package process
US7282375B1 (en) 2004-04-14 2007-10-16 National Semiconductor Corporation Wafer level package design that facilitates trimming and testing
JP5197175B2 (ja) * 2008-06-16 2013-05-15 キヤノン株式会社 インクジェット記録ヘッドおよびその製造方法
CN102105971B (zh) * 2009-04-24 2013-05-22 松下电器产业株式会社 半导体封装元器件的安装方法和安装结构体
US9691734B1 (en) * 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US9620430B2 (en) * 2012-01-23 2017-04-11 Taiwan Semiconductor Manufacturing Company, Ltd. Sawing underfill in packaging processes
US9622356B2 (en) 2013-03-14 2017-04-11 Lockheed Martin Corporation Electronic package mounting

Family Cites Families (28)

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JPH0312942A (ja) * 1989-06-12 1991-01-21 Sharp Corp 半導体装置の封止方法および半導体チップ
US5120678A (en) * 1990-11-05 1992-06-09 Motorola Inc. Electrical component package comprising polymer-reinforced solder bump interconnection
US5289346A (en) * 1991-02-26 1994-02-22 Microelectronics And Computer Technology Corporation Peripheral to area adapter with protective bumper for an integrated circuit chip
US5496775A (en) * 1992-07-15 1996-03-05 Micron Semiconductor, Inc. Semiconductor device having ball-bonded pads
US5824569A (en) * 1992-07-15 1998-10-20 Micron Technology, Inc. Semiconductor device having ball-bonded pads
DE4405710A1 (de) * 1994-02-23 1995-08-24 Bosch Gmbh Robert Vorrichtung mit einer Trägerplatte und Verfahren zum Aufbringen eines Passivierungsgels
JPH0888464A (ja) * 1994-09-20 1996-04-02 Sony Corp フリップチップ実装方法
US5659203A (en) * 1995-06-07 1997-08-19 International Business Machines Corporation Reworkable polymer chip encapsulant
US5804881A (en) * 1995-11-27 1998-09-08 Motorola, Inc. Method and assembly for providing improved underchip encapsulation
US5720100A (en) * 1995-12-29 1998-02-24 Motorola, Inc. Assembly having a frame embedded in a polymeric encapsulant and method for forming same
US5844315A (en) * 1996-03-26 1998-12-01 Motorola Corporation Low-profile microelectronic package
US5821456A (en) * 1996-05-01 1998-10-13 Motorola, Inc. Microelectronic assembly including a decomposable encapsulant, and method for forming and reworking same
US5682066A (en) * 1996-08-12 1997-10-28 Motorola, Inc. Microelectronic assembly including a transparent encapsulant
US5760337A (en) * 1996-12-16 1998-06-02 Shell Oil Company Thermally reworkable binders for flip-chip devices
US6228688B1 (en) * 1997-02-03 2001-05-08 Kabushiki Kaisha Toshiba Flip-chip resin-encapsulated semiconductor device
US5844319A (en) * 1997-03-03 1998-12-01 Motorola Corporation Microelectronic assembly with collar surrounding integrated circuit component on a substrate
US5895229A (en) * 1997-05-19 1999-04-20 Motorola, Inc. Microelectronic package including a polymer encapsulated die, and method for forming same
US5942798A (en) * 1997-11-24 1999-08-24 Stmicroelectronics, Inc. Apparatus and method for automating the underfill of flip-chip devices
JP3367886B2 (ja) * 1998-01-20 2003-01-20 株式会社村田製作所 電子回路装置
US6046910A (en) * 1998-03-18 2000-04-04 Motorola, Inc. Microelectronic assembly having slidable contacts and method for manufacturing the assembly
US6228678B1 (en) * 1998-04-27 2001-05-08 Fry's Metals, Inc. Flip chip with integrated mask and underfill
US6011301A (en) * 1998-06-09 2000-01-04 Stmicroelectronics, Inc. Stress reduction for flip chip package
US6391762B1 (en) * 1999-11-12 2002-05-21 Motorola, Inc. Method of forming a microelectronic assembly with a particulate free underfill material and a microelectronic assembly incorporation the same
US6294840B1 (en) * 1999-11-18 2001-09-25 Lsi Logic Corporation Dual-thickness solder mask in integrated circuit package
US6214650B1 (en) * 2000-02-01 2001-04-10 Lockheed Martin Corporation Method and apparatus for sealing a ball grid array package and circuit card interconnection
US6483196B1 (en) * 2000-04-03 2002-11-19 General Electric Company Flip chip led apparatus
US6372544B1 (en) * 2000-06-23 2002-04-16 Advanced Micro Devices, Inc. Method to reduce occurrences of fillet cracking in flip-chip underfill
KR100443504B1 (ko) * 2001-06-12 2004-08-09 주식회사 하이닉스반도체 볼 그리드 어레이 패키지 구조 및 그 제조방법

Also Published As

Publication number Publication date
EP1504468A2 (en) 2005-02-09
WO2002080229A3 (en) 2003-04-17
US6562663B2 (en) 2003-05-13
EP1504468A4 (en) 2005-05-25
JP2004524703A (ja) 2004-08-12
US20040002181A1 (en) 2004-01-01
US20020142514A1 (en) 2002-10-03
WO2002080229A2 (en) 2002-10-10

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