JP4422300B2 - ウェハ処理装置 - Google Patents

ウェハ処理装置 Download PDF

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Publication number
JP4422300B2
JP4422300B2 JP2000180182A JP2000180182A JP4422300B2 JP 4422300 B2 JP4422300 B2 JP 4422300B2 JP 2000180182 A JP2000180182 A JP 2000180182A JP 2000180182 A JP2000180182 A JP 2000180182A JP 4422300 B2 JP4422300 B2 JP 4422300B2
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Japan
Prior art keywords
wafer
robot arm
optical sensor
state
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000180182A
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English (en)
Japanese (ja)
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JP2001358208A5 (enExample
JP2001358208A (ja
Inventor
篤行 市川
泰幸 白井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
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Canon Anelva Corp
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Application filed by Canon Anelva Corp filed Critical Canon Anelva Corp
Priority to JP2000180182A priority Critical patent/JP4422300B2/ja
Publication of JP2001358208A publication Critical patent/JP2001358208A/ja
Publication of JP2001358208A5 publication Critical patent/JP2001358208A5/ja
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Publication of JP4422300B2 publication Critical patent/JP4422300B2/ja
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  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2000180182A 2000-06-15 2000-06-15 ウェハ処理装置 Expired - Lifetime JP4422300B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000180182A JP4422300B2 (ja) 2000-06-15 2000-06-15 ウェハ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000180182A JP4422300B2 (ja) 2000-06-15 2000-06-15 ウェハ処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007192099A Division JP4422745B2 (ja) 2007-07-24 2007-07-24 ウェハ位置ずれ検出装置およびウェハ位置ずれ検出方法

Publications (3)

Publication Number Publication Date
JP2001358208A JP2001358208A (ja) 2001-12-26
JP2001358208A5 JP2001358208A5 (enExample) 2007-09-06
JP4422300B2 true JP4422300B2 (ja) 2010-02-24

Family

ID=18681331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000180182A Expired - Lifetime JP4422300B2 (ja) 2000-06-15 2000-06-15 ウェハ処理装置

Country Status (1)

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JP (1) JP4422300B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4650273B2 (ja) * 2006-01-12 2011-03-16 シンフォニアテクノロジー株式会社 基板搬送装置、および基板位置検出方法
JP2007227781A (ja) * 2006-02-24 2007-09-06 Tokyo Electron Ltd 基板の位置ずれ検査機構，処理システム及び基板の位置ずれ検査方法
JP2010032242A (ja) * 2008-07-25 2010-02-12 Yamatake Corp 基板検出装置
CN115136291A (zh) * 2020-02-17 2022-09-30 捷普有限公司 用于提供光纤耦合器的装置、系统和方法
CN117813679A (zh) * 2021-08-17 2024-04-02 东京毅力科创株式会社 用于测量半导体等离子体加工室中的可消耗部件的特性的光学传感器
CN119542247B (zh) * 2025-01-23 2025-05-06 四川艾庞机械科技有限公司 一种用于led芯片干法蚀刻的载片治具

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Publication number Publication date
JP2001358208A (ja) 2001-12-26

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