JP2001358208A5 - - Google Patents
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- JP2001358208A5 JP2001358208A5 JP2000180182A JP2000180182A JP2001358208A5 JP 2001358208 A5 JP2001358208 A5 JP 2001358208A5 JP 2000180182 A JP2000180182 A JP 2000180182A JP 2000180182 A JP2000180182 A JP 2000180182A JP 2001358208 A5 JP2001358208 A5 JP 2001358208A5
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- JP
- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000180182A JP4422300B2 (ja) | 2000-06-15 | 2000-06-15 | ウェハ処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000180182A JP4422300B2 (ja) | 2000-06-15 | 2000-06-15 | ウェハ処理装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007192099A Division JP4422745B2 (ja) | 2007-07-24 | 2007-07-24 | ウェハ位置ずれ検出装置およびウェハ位置ずれ検出方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001358208A JP2001358208A (ja) | 2001-12-26 |
| JP2001358208A5 true JP2001358208A5 (enExample) | 2007-09-06 |
| JP4422300B2 JP4422300B2 (ja) | 2010-02-24 |
Family
ID=18681331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000180182A Expired - Lifetime JP4422300B2 (ja) | 2000-06-15 | 2000-06-15 | ウェハ処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4422300B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4650273B2 (ja) * | 2006-01-12 | 2011-03-16 | シンフォニアテクノロジー株式会社 | 基板搬送装置、および基板位置検出方法 |
| JP2007227781A (ja) * | 2006-02-24 | 2007-09-06 | Tokyo Electron Ltd | 基板の位置ずれ検査機構，処理システム及び基板の位置ずれ検査方法 |
| JP2010032242A (ja) * | 2008-07-25 | 2010-02-12 | Yamatake Corp | 基板検出装置 |
| CN115136291A (zh) * | 2020-02-17 | 2022-09-30 | 捷普有限公司 | 用于提供光纤耦合器的装置、系统和方法 |
| CN117813679A (zh) * | 2021-08-17 | 2024-04-02 | 东京毅力科创株式会社 | 用于测量半导体等离子体加工室中的可消耗部件的特性的光学传感器 |
| CN119542247B (zh) * | 2025-01-23 | 2025-05-06 | 四川艾庞机械科技有限公司 | 一种用于led芯片干法蚀刻的载片治具 |
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2000
- 2000-06-15 JP JP2000180182A patent/JP4422300B2/ja not_active Expired - Lifetime