JP4417710B2 - 親有機性粘土成分により性能を向上させた接着剤が組み入れられたデバイス、組成物、および方法 - Google Patents

親有機性粘土成分により性能を向上させた接着剤が組み入れられたデバイス、組成物、および方法 Download PDF

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Publication number
JP4417710B2
JP4417710B2 JP2003509047A JP2003509047A JP4417710B2 JP 4417710 B2 JP4417710 B2 JP 4417710B2 JP 2003509047 A JP2003509047 A JP 2003509047A JP 2003509047 A JP2003509047 A JP 2003509047A JP 4417710 B2 JP4417710 B2 JP 4417710B2
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Japan
Prior art keywords
adhesive
conductive
adhesive composition
clay
film
Prior art date
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Expired - Fee Related
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JP2003509047A
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English (en)
Japanese (ja)
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JP2004534129A (ja
JP2004534129A5 (OSRAM
Inventor
チャング，セアリー
エム． ハイン，アンドリュー
ダブリュ． マグリ，マーク
シー． ノエ，スーザン
エム． サンフト，パトリシア
ジェイ． シュルツ，ウィリアム
ディー． タイラー，ロバート
エフ． テッド，スタンレイ
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of JP2004534129A publication Critical patent/JP2004534129A/ja
Publication of JP2004534129A5 publication Critical patent/JP2004534129A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/582—Recycling of unreacted starting or intermediate materials

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
JP2003509047A 2001-06-29 2002-04-12 親有機性粘土成分により性能を向上させた接着剤が組み入れられたデバイス、組成物、および方法 Expired - Fee Related JP4417710B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/896,655 US6884833B2 (en) 2001-06-29 2001-06-29 Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents
PCT/US2002/011309 WO2003002682A1 (en) 2001-06-29 2002-04-12 Devices, compositions, and methods incorporating adhesives whose preformance is enhanced by organophilic clay constituents

Publications (3)

Publication Number Publication Date
JP2004534129A JP2004534129A (ja) 2004-11-11
JP2004534129A5 JP2004534129A5 (OSRAM) 2005-12-22
JP4417710B2 true JP4417710B2 (ja) 2010-02-17

Family

ID=25406577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003509047A Expired - Fee Related JP4417710B2 (ja) 2001-06-29 2002-04-12 親有機性粘土成分により性能を向上させた接着剤が組み入れられたデバイス、組成物、および方法

Country Status (10)

Country Link
US (1) US6884833B2 (OSRAM)
EP (1) EP1399519B8 (OSRAM)
JP (1) JP4417710B2 (OSRAM)
KR (1) KR100877444B1 (OSRAM)
CN (1) CN1246410C (OSRAM)
AT (1) ATE290055T1 (OSRAM)
DE (1) DE60203113T2 (OSRAM)
MY (1) MY132559A (OSRAM)
TW (1) TWI301145B (OSRAM)
WO (1) WO2003002682A1 (OSRAM)

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EP1399519B8 (en) 2005-04-20
US20030100654A1 (en) 2003-05-29
HK1064404A1 (en) 2005-01-28
JP2004534129A (ja) 2004-11-11
DE60203113D1 (de) 2005-04-07
DE60203113T2 (de) 2006-01-19
EP1399519B1 (en) 2005-03-02
TWI301145B (en) 2008-09-21
MY132559A (en) 2007-10-31
US6884833B2 (en) 2005-04-26
CN1246410C (zh) 2006-03-22
ATE290055T1 (de) 2005-03-15
CN1522287A (zh) 2004-08-18
KR20040030710A (ko) 2004-04-09
EP1399519A1 (en) 2004-03-24
WO2003002682A1 (en) 2003-01-09

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