JP4377748B2 - 電子部品収納用パッケージおよび電子装置 - Google Patents
電子部品収納用パッケージおよび電子装置 Download PDFInfo
- Publication number
- JP4377748B2 JP4377748B2 JP2004158736A JP2004158736A JP4377748B2 JP 4377748 B2 JP4377748 B2 JP 4377748B2 JP 2004158736 A JP2004158736 A JP 2004158736A JP 2004158736 A JP2004158736 A JP 2004158736A JP 4377748 B2 JP4377748 B2 JP 4377748B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- base
- frame
- metal layer
- heat radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
1a:基体
1b:下部金属板
1c:上部金属層
1d:切欠き部
1e:搭載部
2:枠体
2a:配線導体
4:蓋体
5:電子部品
Claims (2)
- 上面の中央部に電子部品の搭載部を有する平板状の放熱部材と、
該放熱部材の上面に前記搭載部を取り囲んで取着された、内面から外面に導出される配線導体を有する枠体とを具備しており、
前記放熱部材は、平板状の基体と、該基体よりも熱膨張係数および熱伝導率が大きくかつ縦弾性係数が小さい材料から成る、前記基体の上面から側面にかけて形成された上部金属層および前記基体の下面に接合された下部金属板とから成り、
前記基体は、前記搭載部の直下に前記上部電極層と前記下部電極層を接続するとともに、前記基体よりも熱膨張係数および熱伝導率が大きい材料からなる貫通金属体が形成されており、
前記下部金属板は、前記基体の下面の端よりも外側に延出した延出部を有しているとともに該延出部にネジ止め用の切欠き部が形成されており、
前記上部金属層は、外周端が前記下部金属層に接していることを特徴とする電子部品収納用パッケージ。 - 請求項1記載の電子部品収納用パッケージと、前記搭載部に搭載されるとともに電極が前記配線導体に電気的に接続された前記電子部品と、前記枠体の上面に前記電子部品を覆うように取着された蓋体または前記枠体の内側に前記電子部品を覆うように充填された封止樹脂とを具備していることを特徴とする電子装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004158736A JP4377748B2 (ja) | 2004-05-28 | 2004-05-28 | 電子部品収納用パッケージおよび電子装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004158736A JP4377748B2 (ja) | 2004-05-28 | 2004-05-28 | 電子部品収納用パッケージおよび電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005340564A JP2005340564A (ja) | 2005-12-08 |
JP4377748B2 true JP4377748B2 (ja) | 2009-12-02 |
Family
ID=35493772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004158736A Expired - Fee Related JP4377748B2 (ja) | 2004-05-28 | 2004-05-28 | 電子部品収納用パッケージおよび電子装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4377748B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6554699B2 (ja) * | 2015-09-25 | 2019-08-07 | エムテックスマツムラ株式会社 | 中空パッケージの製造方法及び中空パッケージ |
-
2004
- 2004-05-28 JP JP2004158736A patent/JP4377748B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005340564A (ja) | 2005-12-08 |
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