JP4372163B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP4372163B2 JP4372163B2 JP2007016575A JP2007016575A JP4372163B2 JP 4372163 B2 JP4372163 B2 JP 4372163B2 JP 2007016575 A JP2007016575 A JP 2007016575A JP 2007016575 A JP2007016575 A JP 2007016575A JP 4372163 B2 JP4372163 B2 JP 4372163B2
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- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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Description
以下、本発明の第1の実施の形態に係る半導体装置、および本発明の第1の実施の形態に係る半導体装置の製造方法を、図1〜図7に基づいて説明する。
次に、本発明の第2の実施の形態に係る半導体装置、および半導体装置の製造方法を説明する。
次に、本発明の第3の実施の形態に係る半導体装置、および半導体装置の製造方法を説明する。
次に、本発明の第4の実施の形態に係る半導体装置、および半導体装置の製造方法を説明する。
次に、本発明の第5の実施の形態に係る半導体装置、および半導体装置の製造方法を説明する。
Claims (4)
- 略板形状の導電性の電流経路部材を、超音波接合冶具に形成されている吸引孔より吸引して前記超音波接合冶具の互いに異なる位置に設けられている超音波振動供給用の複数の接触端面にそれぞれ接触させて支持し、
前記複数の接触端面のうち一の箇所を半導体素子の上面に形成された電極部材の上面に移動させて前記電流経路部材を前記電極部材の上面に対して接触させると共に、前記複数の接触端面のうち他の箇所を前記電極部材とは異なる位置にあるリード端子の上面に移動させて前記電流経路部材を前記リード端子の上面に対して接触させ、
前記複数の接触端面から前記電流経路部材に対してそれぞれ超音波振動を与えることにより、前記電流経路部材の一の箇所と前記電極部材、および前記電流経路部材の他の箇所と前記リード端子とをそれぞれ直接かつ同時に超音波接合することを特徴とする半導体装置の製造方法。 - 板状の導電性部材を所定の大きさに切り出すことによって前記電流経路部材を形成することを特徴とする請求項1に記載の半導体装置の製造方法。
- 前記板状の導電性部材を所定の大きさに切り出した後、その両端部に対して中間部が凸状に突出した形状となるよう成型して前記電流経路部材を形成することを特徴とする請求項2に記載の半導体装置の製造方法。
- 前記電流経路部材はアルミニウムを材料としていることを特徴とする請求項1乃至3のいずれか1項に記載の半導体装置の製造方法。
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JP2007016575A JP4372163B2 (ja) | 2007-01-26 | 2007-01-26 | 半導体装置の製造方法 |
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JP2007016575A JP4372163B2 (ja) | 2007-01-26 | 2007-01-26 | 半導体装置の製造方法 |
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JP2001120309A Division JP4112816B2 (ja) | 2001-04-18 | 2001-04-18 | 半導体装置および半導体装置の製造方法 |
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JP2007110167A JP2007110167A (ja) | 2007-04-26 |
JP4372163B2 true JP4372163B2 (ja) | 2009-11-25 |
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