JP4372162B2 - 超音波接合冶具 - Google Patents
超音波接合冶具 Download PDFInfo
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- JP4372162B2 JP4372162B2 JP2007016574A JP2007016574A JP4372162B2 JP 4372162 B2 JP4372162 B2 JP 4372162B2 JP 2007016574 A JP2007016574 A JP 2007016574A JP 2007016574 A JP2007016574 A JP 2007016574A JP 4372162 B2 JP4372162 B2 JP 4372162B2
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- mosfet
- semiconductor device
- lead frame
- current path
- connection strap
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Description
以下、本発明の第1の実施の形態に係る半導体装置、および本発明の第1の実施の形態に係る半導体装置の製造方法を、図1〜図7に基づいて説明する。
次に、本発明の第2の実施の形態に係る半導体装置、および半導体装置の製造方法を説明する。
次に、本発明の第3の実施の形態に係る半導体装置、および半導体装置の製造方法を説明する。
次に、本発明の第4の実施の形態に係る半導体装置、および半導体装置の製造方法を説明する。
次に、本発明の第5の実施の形態に係る半導体装置、および半導体装置の製造方法を説明する。
Claims (3)
- 半導体素子の上面に形成された電極部材に対して略板形状の導電性の電流経路部材を直接超音波接合するための超音波接合冶具であって、
前記電流経路部材に接触し前記電流経路部材に対して超音波振動を与えるための接触端面と、
前記電流経路部材を吸引して前記電流経路部材を前記接触端面に支持するための吸引孔と、
前記電流経路部材の一部位を前記電極部材に対して超音波接合すると同時に、前記電極部材とは異なる位置にあるリード端子に対しても前記電流経路部材の異なる部位を直接超音波接合するための、前記接触端面とは異なる別の接触端面と、
を有することを特徴とする超音波接合冶具。 - 前記接触端面は複数設けられており、前記吸引孔は前記複数の接触端面の間に設けられていることを特徴とする請求項1に記載の超音波接合冶具。
- 前記接触端面には凹凸部が形成されていることを特徴とする請求項1または2に記載の超音波接合冶具。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007016574A JP4372162B2 (ja) | 2007-01-26 | 2007-01-26 | 超音波接合冶具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007016574A JP4372162B2 (ja) | 2007-01-26 | 2007-01-26 | 超音波接合冶具 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001120309A Division JP4112816B2 (ja) | 2001-04-18 | 2001-04-18 | 半導体装置および半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2007123937A JP2007123937A (ja) | 2007-05-17 |
JP4372162B2 true JP4372162B2 (ja) | 2009-11-25 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007016574A Expired - Lifetime JP4372162B2 (ja) | 2007-01-26 | 2007-01-26 | 超音波接合冶具 |
Country Status (1)
Country | Link |
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JP (1) | JP4372162B2 (ja) |
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JP2010118577A (ja) * | 2008-11-14 | 2010-05-27 | Sumitomo Electric Ind Ltd | 樹脂封止型半導体装置およびその製造方法 |
CN102049743B (zh) * | 2010-11-02 | 2013-06-12 | 上海交通大学 | 用于超声波加工的夹具 |
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JP6451180B2 (ja) | 2014-09-26 | 2019-01-16 | 富士電機株式会社 | 半導体装置の製造装置及び半導体装置 |
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