JP4371553B2 - セラミック成形体の乾燥方法、多孔質セラミック部材の製造方法、及び、セラミックフィルタの製造方法 - Google Patents
セラミック成形体の乾燥方法、多孔質セラミック部材の製造方法、及び、セラミックフィルタの製造方法 Download PDFInfo
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- JP4371553B2 JP4371553B2 JP2000248822A JP2000248822A JP4371553B2 JP 4371553 B2 JP4371553 B2 JP 4371553B2 JP 2000248822 A JP2000248822 A JP 2000248822A JP 2000248822 A JP2000248822 A JP 2000248822A JP 4371553 B2 JP4371553 B2 JP 4371553B2
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- molded body
- drying
- ceramic
- ceramic molded
- hot air
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- 239000000919 ceramic Substances 0.000 title claims description 161
- 238000001035 drying Methods 0.000 title claims description 91
- 238000000034 method Methods 0.000 title claims description 38
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 238000007602 hot air drying Methods 0.000 claims description 24
- 238000003825 pressing Methods 0.000 claims description 22
- 239000000843 powder Substances 0.000 claims description 17
- 239000011230 binding agent Substances 0.000 claims description 12
- 238000005192 partition Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000005238 degreasing Methods 0.000 claims description 4
- 238000010304 firing Methods 0.000 claims description 3
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- 239000007788 liquid Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
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- 235000010981 methylcellulose Nutrition 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
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- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- -1 methanol Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052575 non-oxide ceramic Inorganic materials 0.000 description 1
- 239000011225 non-oxide ceramic Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
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- Drying Of Solid Materials (AREA)
- Ceramic Products (AREA)
- Compositions Of Oxide Ceramics (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000248822A JP4371553B2 (ja) | 1999-08-24 | 2000-08-18 | セラミック成形体の乾燥方法、多孔質セラミック部材の製造方法、及び、セラミックフィルタの製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-237495 | 1999-08-24 | ||
| JP23749599 | 1999-08-24 | ||
| JP2000248822A JP4371553B2 (ja) | 1999-08-24 | 2000-08-18 | セラミック成形体の乾燥方法、多孔質セラミック部材の製造方法、及び、セラミックフィルタの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001130973A JP2001130973A (ja) | 2001-05-15 |
| JP2001130973A5 JP2001130973A5 (enExample) | 2005-09-15 |
| JP4371553B2 true JP4371553B2 (ja) | 2009-11-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000248822A Expired - Fee Related JP4371553B2 (ja) | 1999-08-24 | 2000-08-18 | セラミック成形体の乾燥方法、多孔質セラミック部材の製造方法、及び、セラミックフィルタの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4371553B2 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003106773A (ja) | 2001-09-26 | 2003-04-09 | Micro Denshi Kk | マイクロ波連続加熱装置 |
| JP2003137662A (ja) * | 2001-10-30 | 2003-05-14 | Kyocera Corp | セラミックス焼結体の製造方法 |
| JP2003285312A (ja) | 2002-03-28 | 2003-10-07 | Ngk Insulators Ltd | ハニカム成形体の乾燥方法 |
| JP4071025B2 (ja) | 2002-03-28 | 2008-04-02 | 日本碍子株式会社 | ハニカム構造体の製造方法 |
| KR101076121B1 (ko) * | 2004-09-22 | 2011-10-21 | 에스케이이노베이션 주식회사 | 허니컴 형태의 세라믹 성형체의 건조 방법 |
| WO2007094075A1 (ja) * | 2006-02-17 | 2007-08-23 | Ibiden Co., Ltd. | 乾燥用治具組立装置、乾燥用治具分解装置、乾燥用治具循環装置、セラミック成形体の乾燥方法、及び、ハニカム構造体の製造方法 |
| JP5121237B2 (ja) * | 2006-02-17 | 2013-01-16 | イビデン株式会社 | 乾燥用治具組立装置、乾燥用治具分解装置、乾燥用治具循環装置、セラミック成形体の乾燥方法、及び、ハニカム構造体の製造方法 |
| EP1826517B1 (en) * | 2006-02-28 | 2008-08-13 | Ibiden Co., Ltd. | Drying jig, drying method of honeycomb molded body, and manufacturing method of honeycomb structured body |
| US8674275B2 (en) | 2007-06-29 | 2014-03-18 | Corning Incorporated | Method of fabricating a honeycomb structure using microwaves |
| KR101189674B1 (ko) * | 2010-08-16 | 2012-10-10 | 한국에너지기술연구원 | 압출성형체 건조장치 |
| CN103900365A (zh) * | 2014-04-28 | 2014-07-02 | 潍坊汇韬化工有限公司 | 适合化工粉体物料的微波干燥设备 |
| JP7016267B2 (ja) * | 2017-03-24 | 2022-02-04 | 日本碍子株式会社 | 柱状ハニカム成形体の乾燥方法及び柱状ハニカム構造体の製造方法 |
| US11168033B2 (en) | 2017-03-24 | 2021-11-09 | Ngk Insulators, Ltd. | Method for drying columnar honeycomb formed body and method for producing columnar honeycomb structure |
| JP6761382B2 (ja) * | 2017-07-31 | 2020-09-23 | 日本碍子株式会社 | ハニカム構造体の製造方法 |
| CN109282637B (zh) * | 2018-11-13 | 2023-09-29 | 中国建筑材料科学研究总院有限公司 | 柱状陶瓷素坯干燥装置及干燥方法 |
| CN114478054B (zh) * | 2022-02-25 | 2022-10-18 | 郑州磨料磨具磨削研究所有限公司 | 一种多孔陶瓷及其制备方法 |
| CN118168280B (zh) * | 2024-05-07 | 2024-08-23 | 泰山石膏(河南)有限公司 | 一种石膏板干燥装置及其干燥方法 |
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| Publication number | Publication date |
|---|---|
| JP2001130973A (ja) | 2001-05-15 |
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