JP4356137B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP4356137B2
JP4356137B2 JP13819099A JP13819099A JP4356137B2 JP 4356137 B2 JP4356137 B2 JP 4356137B2 JP 13819099 A JP13819099 A JP 13819099A JP 13819099 A JP13819099 A JP 13819099A JP 4356137 B2 JP4356137 B2 JP 4356137B2
Authority
JP
Japan
Prior art keywords
anisotropic conductive
conductive resin
semiconductor element
substrate
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP13819099A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000332390A (ja
JP2000332390A5 (enExample
Inventor
優治 八木
武雄 安保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP13819099A priority Critical patent/JP4356137B2/ja
Publication of JP2000332390A publication Critical patent/JP2000332390A/ja
Publication of JP2000332390A5 publication Critical patent/JP2000332390A5/ja
Application granted granted Critical
Publication of JP4356137B2 publication Critical patent/JP4356137B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP13819099A 1999-05-19 1999-05-19 半導体装置の製造方法 Expired - Fee Related JP4356137B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13819099A JP4356137B2 (ja) 1999-05-19 1999-05-19 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13819099A JP4356137B2 (ja) 1999-05-19 1999-05-19 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2000332390A JP2000332390A (ja) 2000-11-30
JP2000332390A5 JP2000332390A5 (enExample) 2006-06-08
JP4356137B2 true JP4356137B2 (ja) 2009-11-04

Family

ID=15216191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13819099A Expired - Fee Related JP4356137B2 (ja) 1999-05-19 1999-05-19 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4356137B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5003182B2 (ja) * 2007-01-31 2012-08-15 パナソニック株式会社 電子部品実装方法およびテープ貼付装置
WO2009119427A1 (ja) * 2008-03-26 2009-10-01 日本電気株式会社 半導体装置およびその製造方法
JP2010067922A (ja) * 2008-09-12 2010-03-25 Sony Chemical & Information Device Corp 熱圧着装置及び電気部品の実装方法
JP6597056B2 (ja) 2015-08-26 2019-10-30 富士通株式会社 半導体実装装置の加熱ヘッダ及び半導体の接合方法
JP6582975B2 (ja) 2015-12-28 2019-10-02 富士通株式会社 半導体実装装置、半導体実装装置のヘッド及び積層チップの製造方法

Also Published As

Publication number Publication date
JP2000332390A (ja) 2000-11-30

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