JP4342367B2 - 配線基板の製造方法 - Google Patents

配線基板の製造方法 Download PDF

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Publication number
JP4342367B2
JP4342367B2 JP2004116078A JP2004116078A JP4342367B2 JP 4342367 B2 JP4342367 B2 JP 4342367B2 JP 2004116078 A JP2004116078 A JP 2004116078A JP 2004116078 A JP2004116078 A JP 2004116078A JP 4342367 B2 JP4342367 B2 JP 4342367B2
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Japan
Prior art keywords
wiring board
metal foil
manufacturing
metal
main surface
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Expired - Fee Related
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JP2004116078A
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English (en)
Japanese (ja)
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JP2005302969A (ja
JP2005302969A5 (https=
Inventor
達也 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP2004116078A priority Critical patent/JP4342367B2/ja
Publication of JP2005302969A publication Critical patent/JP2005302969A/ja
Publication of JP2005302969A5 publication Critical patent/JP2005302969A5/ja
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Publication of JP4342367B2 publication Critical patent/JP4342367B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2004116078A 2004-04-09 2004-04-09 配線基板の製造方法 Expired - Fee Related JP4342367B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004116078A JP4342367B2 (ja) 2004-04-09 2004-04-09 配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004116078A JP4342367B2 (ja) 2004-04-09 2004-04-09 配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2005302969A JP2005302969A (ja) 2005-10-27
JP2005302969A5 JP2005302969A5 (https=) 2008-11-06
JP4342367B2 true JP4342367B2 (ja) 2009-10-14

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ID=35334116

Family Applications (1)

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JP2004116078A Expired - Fee Related JP4342367B2 (ja) 2004-04-09 2004-04-09 配線基板の製造方法

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JP (1) JP4342367B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5120304B2 (ja) * 2008-09-30 2013-01-16 凸版印刷株式会社 スティフナー付きプリント配線板および放熱板付き半導体パッケージの製造方法
JP2014138017A (ja) * 2013-01-15 2014-07-28 Fujitsu Ltd 半導体装置及びその製造方法
JP2014168005A (ja) * 2013-02-28 2014-09-11 Kyocer Slc Technologies Corp 配線基板
KR102268781B1 (ko) 2014-11-12 2021-06-28 삼성전자주식회사 인쇄회로기판 및 이를 포함하는 반도체 패키지
WO2025134670A1 (ja) * 2023-12-18 2025-06-26 株式会社ジャパンディスプレイ 多層配線基板及びその作製方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000022045A (ja) * 1998-07-02 2000-01-21 Toshiba Microelectronics Corp 半導体装置
JP3635219B2 (ja) * 1999-03-11 2005-04-06 新光電気工業株式会社 半導体装置用多層基板及びその製造方法
JP3838232B2 (ja) * 2000-06-30 2006-10-25 日本電気株式会社 半導体パッケージ基板の製造方法及び半導体装置製造方法
JP3983146B2 (ja) * 2002-09-17 2007-09-26 Ｎｅｃエレクトロニクス株式会社 多層配線基板の製造方法

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Publication number Publication date
JP2005302969A (ja) 2005-10-27

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