JP4330821B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
- Publication number
- JP4330821B2 JP4330821B2 JP2001203647A JP2001203647A JP4330821B2 JP 4330821 B2 JP4330821 B2 JP 4330821B2 JP 2001203647 A JP2001203647 A JP 2001203647A JP 2001203647 A JP2001203647 A JP 2001203647A JP 4330821 B2 JP4330821 B2 JP 4330821B2
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- JP
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- Prior art keywords
- chip
- wafer
- manufacturing
- sealing material
- bumps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims description 132
- 239000003566 sealing material Substances 0.000 claims description 247
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- 229910052718 tin Inorganic materials 0.000 description 1
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001203647A JP4330821B2 (ja) | 2001-07-04 | 2001-07-04 | 半導体装置の製造方法 |
TW091114071A TW546813B (en) | 2001-07-04 | 2002-06-26 | Manufacturing method of semiconductor device for die reinforcement during picking using sealing material |
US10/187,629 US6777313B2 (en) | 2001-07-04 | 2002-07-03 | Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup time |
KR10-2002-0038237A KR100481658B1 (ko) | 2001-07-04 | 2002-07-03 | 밀봉재를 이용하여 픽업시의 칩의 보강을 행하는 반도체장치의 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001203647A JP4330821B2 (ja) | 2001-07-04 | 2001-07-04 | 半導体装置の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2003017513A JP2003017513A (ja) | 2003-01-17 |
JP2003017513A5 JP2003017513A5 (ko) | 2005-10-27 |
JP4330821B2 true JP4330821B2 (ja) | 2009-09-16 |
Family
ID=19040245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001203647A Expired - Fee Related JP4330821B2 (ja) | 2001-07-04 | 2001-07-04 | 半導体装置の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6777313B2 (ko) |
JP (1) | JP4330821B2 (ko) |
KR (1) | KR100481658B1 (ko) |
TW (1) | TW546813B (ko) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6794751B2 (en) * | 2001-06-29 | 2004-09-21 | Intel Corporation | Multi-purpose planarizing/back-grind/pre-underfill arrangements for bumped wafers and dies |
US6649445B1 (en) * | 2002-09-11 | 2003-11-18 | Motorola, Inc. | Wafer coating and singulation method |
US8026126B2 (en) * | 2002-11-27 | 2011-09-27 | Asm Assembly Automation Ltd | Apparatus and method for thin die detachment |
SG116533A1 (en) * | 2003-03-26 | 2005-11-28 | Toshiba Kk | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device. |
JP4599075B2 (ja) * | 2003-03-26 | 2010-12-15 | 株式会社東芝 | 半導体製造装置及び半導体装置の製造方法 |
JP2004311576A (ja) | 2003-04-03 | 2004-11-04 | Toshiba Corp | 半導体装置の製造方法 |
JP2004335916A (ja) * | 2003-05-12 | 2004-11-25 | Toshiba Corp | 半導体装置の製造方法 |
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US20030017663A1 (en) | 2003-01-23 |
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KR20030004132A (ko) | 2003-01-14 |
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US6777313B2 (en) | 2004-08-17 |
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