JP4330467B2 - プロセス装置及び該プロセス装置内のパーティクル除去方法 - Google Patents

プロセス装置及び該プロセス装置内のパーティクル除去方法 Download PDF

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Publication number
JP4330467B2
JP4330467B2 JP2004051706A JP2004051706A JP4330467B2 JP 4330467 B2 JP4330467 B2 JP 4330467B2 JP 2004051706 A JP2004051706 A JP 2004051706A JP 2004051706 A JP2004051706 A JP 2004051706A JP 4330467 B2 JP4330467 B2 JP 4330467B2
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JP
Japan
Prior art keywords
temperature
gas
wall
processing chamber
vacuum processing
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Expired - Fee Related
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JP2004051706A
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English (en)
Japanese (ja)
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JP2005243915A (ja
Inventor
剛 守屋
宏史 長池
博之 中山
喜久夫 奥山
学 島田
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2004051706A priority Critical patent/JP4330467B2/ja
Priority to KR1020050015360A priority patent/KR100635436B1/ko
Priority to TW094105654A priority patent/TW200534334A/zh
Priority to US11/065,359 priority patent/US7347006B2/en
Priority to CNB2005100529177A priority patent/CN100349043C/zh
Publication of JP2005243915A publication Critical patent/JP2005243915A/ja
Application granted granted Critical
Publication of JP4330467B2 publication Critical patent/JP4330467B2/ja
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    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63C—SKATES; SKIS; ROLLER SKATES; DESIGN OR LAYOUT OF COURTS, RINKS OR THE LIKE
    • A63C17/00—Roller skates; Skate-boards
    • A63C17/18—Roller skates; Skate-boards convertible into ice or snow-running skates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63C—SKATES; SKIS; ROLLER SKATES; DESIGN OR LAYOUT OF COURTS, RINKS OR THE LIKE
    • A63C1/00—Skates
    • A63C1/04—Skates fastened by means of clamps
    • A63C1/16—Special structure of the clamp fastening devices
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63C—SKATES; SKIS; ROLLER SKATES; DESIGN OR LAYOUT OF COURTS, RINKS OR THE LIKE
    • A63C1/00—Skates
    • A63C1/22—Skates with special foot-plates of the boot
    • A63C1/26—Skates with special foot-plates of the boot divided into two parts permitting adjustment to the size of the foot
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
    • H01J2237/0225—Detecting or monitoring foreign particles

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
JP2004051706A 2004-02-26 2004-02-26 プロセス装置及び該プロセス装置内のパーティクル除去方法 Expired - Fee Related JP4330467B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004051706A JP4330467B2 (ja) 2004-02-26 2004-02-26 プロセス装置及び該プロセス装置内のパーティクル除去方法
KR1020050015360A KR100635436B1 (ko) 2004-02-26 2005-02-24 프로세스 장치 및 해당 프로세스 장치내의 파티클 제거 방법
TW094105654A TW200534334A (en) 2004-02-26 2005-02-24 Processing apparatus and method for removing particles therefrom
US11/065,359 US7347006B2 (en) 2004-02-26 2005-02-25 Processing apparatus and method for removing particles therefrom
CNB2005100529177A CN100349043C (zh) 2004-02-26 2005-02-28 处理装置及该处理装置内的颗粒除去方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004051706A JP4330467B2 (ja) 2004-02-26 2004-02-26 プロセス装置及び該プロセス装置内のパーティクル除去方法

Publications (2)

Publication Number Publication Date
JP2005243915A JP2005243915A (ja) 2005-09-08
JP4330467B2 true JP4330467B2 (ja) 2009-09-16

Family

ID=34879627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004051706A Expired - Fee Related JP4330467B2 (ja) 2004-02-26 2004-02-26 プロセス装置及び該プロセス装置内のパーティクル除去方法

Country Status (5)

Country Link
US (1) US7347006B2 (https=)
JP (1) JP4330467B2 (https=)
KR (1) KR100635436B1 (https=)
CN (1) CN100349043C (https=)
TW (1) TW200534334A (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
DE102004044176A1 (de) * 2004-09-13 2006-03-30 BSH Bosch und Siemens Hausgeräte GmbH Trocknungsverfahren für ein Haushaltsgerät und Haushaltsgerät zur Durchführung des Trocknungsverfahren
JP5036290B2 (ja) * 2006-12-12 2012-09-26 東京エレクトロン株式会社 基板処理装置および基板搬送方法、ならびにコンピュータプログラム
JP5064119B2 (ja) * 2007-06-07 2012-10-31 東京エレクトロン株式会社 真空引き方法及び記憶媒体
US7473006B1 (en) * 2007-07-30 2009-01-06 James Bollman Illuminated landscape edging system
US20090086471A1 (en) * 2007-07-30 2009-04-02 Bollman James E Illuminated landscape module for existing edging system
US7837805B2 (en) * 2007-08-29 2010-11-23 Micron Technology, Inc. Methods for treating surfaces
KR100905213B1 (ko) 2007-09-19 2009-07-01 세메스 주식회사 기판 처리 장치
EP2058427A1 (en) * 2007-11-06 2009-05-13 BSH Electrodomésticos España, S.A. Household appliance having a heat pump unit and means for cooling a component thereof
US8361276B2 (en) * 2008-02-11 2013-01-29 Apjet, Inc. Large area, atmospheric pressure plasma for downstream processing
JP4611409B2 (ja) * 2008-09-03 2011-01-12 晃俊 沖野 プラズマ温度制御装置
JP5121684B2 (ja) * 2008-12-11 2013-01-16 株式会社日立ハイテクノロジーズ プラズマ処理装置
US8591755B2 (en) * 2010-09-15 2013-11-26 Lam Research Corporation Methods for controlling plasma constituent flux and deposition during semiconductor fabrication and apparatus for implementing the same
CN102368466B (zh) * 2011-09-20 2013-11-27 天通吉成机器技术有限公司 一种干法刻蚀坚硬无机材料基板等离子体刻蚀机的电极
KR20150046966A (ko) * 2013-10-23 2015-05-04 삼성디스플레이 주식회사 플라즈마 처리 장치 및 플라즈마 처리 방법
CN104716069B (zh) * 2015-03-23 2017-10-17 上海华力微电子有限公司 晶圆可接受性测试机台内部环境的监测方法和监测装置
CN105097408B (zh) * 2015-07-21 2017-09-26 深圳市华星光电技术有限公司 一种干法刻蚀机台及其使用方法
CN105589232A (zh) * 2016-03-11 2016-05-18 京东方科技集团股份有限公司 一种显示面板加工设备
JP2019169635A (ja) 2018-03-23 2019-10-03 東京エレクトロン株式会社 クリーニング方法及び処理装置
JP7122864B2 (ja) 2018-05-14 2022-08-22 東京エレクトロン株式会社 クリーニング方法及び基板処理装置
JP7462383B2 (ja) 2019-04-15 2024-04-05 東京エレクトロン株式会社 クリーニング方法及びプラズマ処理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0757297B2 (ja) * 1987-04-22 1995-06-21 日本真空技術株式会社 真空排気系用微粒子トラツプ
US5367139A (en) 1989-10-23 1994-11-22 International Business Machines Corporation Methods and apparatus for contamination control in plasma processing
US5589041A (en) * 1995-06-07 1996-12-31 Sony Corporation Plasma sputter etching system with reduced particle contamination
JP2786144B2 (ja) * 1996-01-30 1998-08-13 九州日本電気株式会社 半導体装置の製造方法
JP3171161B2 (ja) * 1998-03-20 2001-05-28 日本電気株式会社 プラズマエッチング方法及びプラズマエッチング装置
JP2002196367A (ja) * 2000-02-10 2002-07-12 Matsushita Electric Ind Co Ltd 液晶表示装置
JP2001305546A (ja) * 2001-04-09 2001-10-31 Matsushita Electric Ind Co Ltd 液晶表示パネル及びその製造方法
US6811651B2 (en) * 2001-06-22 2004-11-02 Tokyo Electron Limited Gas temperature control for a plasma process

Also Published As

Publication number Publication date
JP2005243915A (ja) 2005-09-08
TW200534334A (en) 2005-10-16
CN100349043C (zh) 2007-11-14
KR20060042140A (ko) 2006-05-12
CN1661433A (zh) 2005-08-31
US7347006B2 (en) 2008-03-25
KR100635436B1 (ko) 2006-10-18
TWI373787B (https=) 2012-10-01
US20050189071A1 (en) 2005-09-01

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