JP4325894B2 - ウエハ加熱装置 - Google Patents

ウエハ加熱装置 Download PDF

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Publication number
JP4325894B2
JP4325894B2 JP37169199A JP37169199A JP4325894B2 JP 4325894 B2 JP4325894 B2 JP 4325894B2 JP 37169199 A JP37169199 A JP 37169199A JP 37169199 A JP37169199 A JP 37169199A JP 4325894 B2 JP4325894 B2 JP 4325894B2
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Japan
Prior art keywords
wafer
soaking plate
plate
heating apparatus
heat
Prior art date
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Expired - Fee Related
Application number
JP37169199A
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English (en)
Japanese (ja)
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JP2001189276A (ja
JP2001189276A5 (enExample
Inventor
京治 内山
広治 坂元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP37169199A priority Critical patent/JP4325894B2/ja
Publication of JP2001189276A publication Critical patent/JP2001189276A/ja
Publication of JP2001189276A5 publication Critical patent/JP2001189276A5/ja
Application granted granted Critical
Publication of JP4325894B2 publication Critical patent/JP4325894B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Drying Of Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Resistance Heating (AREA)
JP37169199A 1999-12-27 1999-12-27 ウエハ加熱装置 Expired - Fee Related JP4325894B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP37169199A JP4325894B2 (ja) 1999-12-27 1999-12-27 ウエハ加熱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP37169199A JP4325894B2 (ja) 1999-12-27 1999-12-27 ウエハ加熱装置

Publications (3)

Publication Number Publication Date
JP2001189276A JP2001189276A (ja) 2001-07-10
JP2001189276A5 JP2001189276A5 (enExample) 2005-06-09
JP4325894B2 true JP4325894B2 (ja) 2009-09-02

Family

ID=18499145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP37169199A Expired - Fee Related JP4325894B2 (ja) 1999-12-27 1999-12-27 ウエハ加熱装置

Country Status (1)

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JP (1) JP4325894B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3702194B2 (ja) * 2000-04-13 2005-10-05 東京エレクトロン株式会社 加熱装置
WO2001095388A1 (fr) * 2000-06-07 2001-12-13 Ibiden Co., Ltd. Recipient support, fabrication de semi-conducteurs et dispositif d'inspection
JP4875806B2 (ja) * 2001-07-31 2012-02-15 アプライド マテリアルズ インコーポレイテッド 加熱プレートの取付構造および半導体製造装置
JP4869952B2 (ja) * 2007-01-05 2012-02-08 東京エレクトロン株式会社 熱処理装置
JP7027135B2 (ja) * 2017-11-28 2022-03-01 京セラ株式会社 試料保持具
JP7523250B2 (ja) * 2020-05-07 2024-07-26 京セラ株式会社 試料保持具
CN112349626A (zh) * 2020-09-28 2021-02-09 芯米(厦门)半导体设备有限公司 一种晶圆烘烤装置

Also Published As

Publication number Publication date
JP2001189276A (ja) 2001-07-10

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