JP4332059B2 - ウエハ加熱装置 - Google Patents
ウエハ加熱装置 Download PDFInfo
- Publication number
- JP4332059B2 JP4332059B2 JP2004112881A JP2004112881A JP4332059B2 JP 4332059 B2 JP4332059 B2 JP 4332059B2 JP 2004112881 A JP2004112881 A JP 2004112881A JP 2004112881 A JP2004112881 A JP 2004112881A JP 4332059 B2 JP4332059 B2 JP 4332059B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- wafer
- recess
- temperature measuring
- soaking plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Drying Of Solid Materials (AREA)
Description
2:均熱板
3:載置面
4:絶縁層
5:発熱抵抗体
6:給電部
7:導通端子
8:弾性体
10:測温素子
11:支持体
21:凹部
22:充填材
W:半導体ウエハ
t:厚み
Claims (4)
- セラミックスからなる均熱板の一方の主面をウエハ載置面とし、他方の主面または内部に発熱抵抗体を形成してなるウエハ加熱装置において、前記他方の主面からウエハ載置面に向けて測温素子を配置する凹部を設けると共に、該凹部の入口部分に面取り部を備え、前記凹部の少なくとも側面の表面粗さRmaxを1〜20μmとし、前記凹部の側面に、深さ方向に対して略垂直な方向のスジを有することを特徴とするウエハ加熱装置。
- 前記凹部の深さは前記均熱板の厚みの1/2〜3/4であることを特徴とする請求項1記載のウエハ加熱装置。
- 前記凹部に前記測温素子を配置して充填材を充填したことを特徴とする請求項1または2記載のウエハ加熱装置。
- 前記充填材に樹脂を用い、該樹脂にフィラーを分散させたことを特徴とする請求項3に記載のウエハ加熱装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004112881A JP4332059B2 (ja) | 2004-04-07 | 2004-04-07 | ウエハ加熱装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004112881A JP4332059B2 (ja) | 2004-04-07 | 2004-04-07 | ウエハ加熱装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002020784A Division JP3559549B2 (ja) | 2002-01-29 | 2002-01-29 | ウエハ加熱装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004233051A JP2004233051A (ja) | 2004-08-19 |
JP4332059B2 true JP4332059B2 (ja) | 2009-09-16 |
Family
ID=32959926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004112881A Expired - Fee Related JP4332059B2 (ja) | 2004-04-07 | 2004-04-07 | ウエハ加熱装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4332059B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102506574A (zh) * | 2011-09-27 | 2012-06-20 | 吴艺豪 | 一种被子烘干机 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI523136B (zh) * | 2013-07-18 | 2016-02-21 | Premtek Int Inc | 半導體製程溫度量測裝置 |
-
2004
- 2004-04-07 JP JP2004112881A patent/JP4332059B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102506574A (zh) * | 2011-09-27 | 2012-06-20 | 吴艺豪 | 一种被子烘干机 |
Also Published As
Publication number | Publication date |
---|---|
JP2004233051A (ja) | 2004-08-19 |
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