JP4323636B2 - 位置計測方法及び位置計測装置 - Google Patents

位置計測方法及び位置計測装置 Download PDF

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Publication number
JP4323636B2
JP4323636B2 JP26700599A JP26700599A JP4323636B2 JP 4323636 B2 JP4323636 B2 JP 4323636B2 JP 26700599 A JP26700599 A JP 26700599A JP 26700599 A JP26700599 A JP 26700599A JP 4323636 B2 JP4323636 B2 JP 4323636B2
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JP
Japan
Prior art keywords
mark
measurement
wafer
alignment
shots
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP26700599A
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English (en)
Japanese (ja)
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JP2001093807A (ja
JP2001093807A5 (enExample
Inventor
秀樹 稲
洋 諸星
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP26700599A priority Critical patent/JP4323636B2/ja
Priority to US09/666,483 priority patent/US6639677B1/en
Publication of JP2001093807A publication Critical patent/JP2001093807A/ja
Publication of JP2001093807A5 publication Critical patent/JP2001093807A5/ja
Application granted granted Critical
Publication of JP4323636B2 publication Critical patent/JP4323636B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP26700599A 1999-09-21 1999-09-21 位置計測方法及び位置計測装置 Expired - Fee Related JP4323636B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP26700599A JP4323636B2 (ja) 1999-09-21 1999-09-21 位置計測方法及び位置計測装置
US09/666,483 US6639677B1 (en) 1999-09-21 2000-09-20 Position measuring method and position measuring system using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26700599A JP4323636B2 (ja) 1999-09-21 1999-09-21 位置計測方法及び位置計測装置

Publications (3)

Publication Number Publication Date
JP2001093807A JP2001093807A (ja) 2001-04-06
JP2001093807A5 JP2001093807A5 (enExample) 2006-10-26
JP4323636B2 true JP4323636B2 (ja) 2009-09-02

Family

ID=17438744

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26700599A Expired - Fee Related JP4323636B2 (ja) 1999-09-21 1999-09-21 位置計測方法及び位置計測装置

Country Status (2)

Country Link
US (1) US6639677B1 (enExample)
JP (1) JP4323636B2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003324055A (ja) 2002-04-30 2003-11-14 Canon Inc 管理システム及び装置及び方法並びに露光装置及びその制御方法
JP4018438B2 (ja) * 2002-04-30 2007-12-05 キヤノン株式会社 半導体露光装置を管理する管理システム
JP3913151B2 (ja) * 2002-09-10 2007-05-09 キヤノン株式会社 露光装置のパラメータの値を最適化する方法及びシステム、露光装置及び露光方法
JP4227470B2 (ja) 2003-06-18 2009-02-18 キヤノン株式会社 位置検出方法
JP2005045164A (ja) * 2003-07-25 2005-02-17 Toshiba Corp 自動焦点合わせ装置
DE10345466A1 (de) * 2003-09-30 2005-04-28 Infineon Technologies Ag Verfahren zur Erfassung von Plazierungsfehlern von Schaltungsmustern bei der Übertragung mittels einer Maske in Schichten eines Substrats eines Halbleiterwafers
US7112890B2 (en) * 2003-10-30 2006-09-26 Asml Holding N.V. Tunable alignment geometry
US7218399B2 (en) * 2004-01-21 2007-05-15 Nikon Corporation Method and apparatus for measuring optical overlay deviation
US7259828B2 (en) * 2004-05-14 2007-08-21 Asml Netherlands B.V. Alignment system and method and device manufactured thereby
US20060012779A1 (en) * 2004-07-13 2006-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4795300B2 (ja) * 2006-04-18 2011-10-19 キヤノン株式会社 位置合わせ方法、インプリント方法、位置合わせ装置、インプリント装置、及び位置計測方法
NL1036559A1 (nl) * 2008-03-12 2009-09-15 Asml Netherlands Bv Lithographic Apparatus and Method.
JP2014072313A (ja) * 2012-09-28 2014-04-21 Toshiba Corp アライメント計測システム、重ね合わせ計測システム及び半導体装置の製造方法
JP2018185452A (ja) * 2017-04-27 2018-11-22 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6522386B1 (en) * 1997-07-24 2003-02-18 Nikon Corporation Exposure apparatus having projection optical system with aberration correction element
WO1999040613A1 (en) * 1998-02-09 1999-08-12 Nikon Corporation Method of adjusting position detector
US6396569B2 (en) * 1999-09-02 2002-05-28 Texas Instruments Incorporated Image displacement test reticle for measuring aberration characteristics of projection optics
US6542221B1 (en) * 1999-11-24 2003-04-01 Texas Instruments Incorporated Integrated circuit system with automated best focus determination based on change in alignment due to predictable pattern degradation

Also Published As

Publication number Publication date
JP2001093807A (ja) 2001-04-06
US6639677B1 (en) 2003-10-28

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