JP4323443B2 - 剥離装置及び剥離方法 - Google Patents

剥離装置及び剥離方法 Download PDF

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Publication number
JP4323443B2
JP4323443B2 JP2005052388A JP2005052388A JP4323443B2 JP 4323443 B2 JP4323443 B2 JP 4323443B2 JP 2005052388 A JP2005052388 A JP 2005052388A JP 2005052388 A JP2005052388 A JP 2005052388A JP 4323443 B2 JP4323443 B2 JP 4323443B2
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JP
Japan
Prior art keywords
peeling
film
tape
end side
peeled
Prior art date
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Expired - Fee Related
Application number
JP2005052388A
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English (en)
Japanese (ja)
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JP2006232509A (ja
Inventor
拓哉 早坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2005052388A priority Critical patent/JP4323443B2/ja
Priority to TW095105333A priority patent/TW200631887A/zh
Priority to US11/362,231 priority patent/US7503995B2/en
Publication of JP2006232509A publication Critical patent/JP2006232509A/ja
Application granted granted Critical
Publication of JP4323443B2 publication Critical patent/JP4323443B2/ja
Anticipated expiration legal-status Critical
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1174—Using roller for delamination [e.g., roller pairs operating at differing speeds or directions, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/195—Delaminating roller means
    • Y10T156/1956—Roller pair delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
JP2005052388A 2005-02-28 2005-02-28 剥離装置及び剥離方法 Expired - Fee Related JP4323443B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005052388A JP4323443B2 (ja) 2005-02-28 2005-02-28 剥離装置及び剥離方法
TW095105333A TW200631887A (en) 2005-02-28 2006-02-17 Peeling apparatus and peeling method
US11/362,231 US7503995B2 (en) 2005-02-28 2006-02-27 Peeling apparatus and peeling method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005052388A JP4323443B2 (ja) 2005-02-28 2005-02-28 剥離装置及び剥離方法

Publications (2)

Publication Number Publication Date
JP2006232509A JP2006232509A (ja) 2006-09-07
JP4323443B2 true JP4323443B2 (ja) 2009-09-02

Family

ID=36930973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005052388A Expired - Fee Related JP4323443B2 (ja) 2005-02-28 2005-02-28 剥離装置及び剥離方法

Country Status (3)

Country Link
US (1) US7503995B2 (enExample)
JP (1) JP4323443B2 (enExample)
TW (1) TW200631887A (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4326418B2 (ja) * 2004-07-16 2009-09-09 株式会社東京精密 フィルム剥離方法およびフィルム剥離装置
JP4992362B2 (ja) * 2006-09-22 2012-08-08 カシオ計算機株式会社 フィルム剥離方法およびその装置
TWI335899B (en) * 2006-11-03 2011-01-11 Kodak Graphic Comm Canada Co Methods and apparatus for peeling a flexible sheet from a substrate
AU2008226410A1 (en) * 2007-03-09 2008-09-18 Nexus Biosystems, Inc. Device and method for removing a peelable seal
JP5113621B2 (ja) * 2008-05-14 2013-01-09 リンテック株式会社 シート剥離装置及び剥離方法
WO2010035479A1 (ja) * 2008-09-26 2010-04-01 芝浦メカトロニクス株式会社 剥離装置及び剥離方法
JP5453035B2 (ja) * 2009-10-02 2014-03-26 リンテック株式会社 シート剥離装置及び剥離方法
WO2011121646A1 (ja) * 2010-03-30 2011-10-06 シャープ株式会社 カバーフィルム剥離装置及びカバーフィルム剥離方法
JP5593190B2 (ja) * 2010-10-08 2014-09-17 東芝機械株式会社 モールド剥離装置
JP5587271B2 (ja) * 2011-03-31 2014-09-10 富士フイルム株式会社 干渉防止部材分離装置、及び生化学分析装置
JP5687647B2 (ja) * 2012-03-14 2015-03-18 株式会社東芝 半導体装置の製造方法、半導体製造装置
JP5937404B2 (ja) * 2012-04-04 2016-06-22 日東電工株式会社 保護テープ剥離方法および保護テープ剥離装置
KR102006876B1 (ko) * 2012-09-04 2019-08-05 삼성디스플레이 주식회사 필름 박리장치 및 그것을 이용한 필름 박리방법
JP6003675B2 (ja) * 2013-01-25 2016-10-05 旭硝子株式会社 基板の剥離装置及び剥離方法並びに電子デバイスの製造方法
US10052884B2 (en) * 2014-10-28 2018-08-21 Ishida Co., Ltd. Label issuing apparatus
CN107206818B (zh) 2015-02-09 2020-04-24 株式会社石田 标签打印机
KR101764710B1 (ko) * 2016-01-20 2017-08-16 주식회사 아바코 필름 부착 장치 및 방법
JP6670683B2 (ja) * 2016-06-07 2020-03-25 株式会社Ｓｃｒｅｅｎラミナテック キャリア基板と樹脂層からなるワークの分離方法および分離装置
US10066396B1 (en) * 2016-10-17 2018-09-04 Firestone Building Products Co., LLC Roofing composite scoring tool and methods of use
JP7292889B2 (ja) 2019-02-01 2023-06-19 株式会社エム・シー・ケー 剥離装置及び剥離方法
CN110733716B (zh) * 2019-11-12 2022-01-28 珠海格力智能装备有限公司 显示面板的撕膜方法及装置、撕膜控制设备
US11390061B2 (en) * 2020-05-09 2022-07-19 Nps Co., Ltd. Curl removing apparatus for multi-layer film
US11889742B2 (en) * 2020-11-04 2024-01-30 Samsung Display Co., Ltd. Apparatus of manufacturing display device and method of manufacturing display device
CN114683443B (zh) * 2022-03-11 2023-09-12 安徽科技学院 一种pvc绝缘胶带回收处理装置及方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2170147A (en) * 1937-01-21 1939-08-22 John D Lane Package of gummed bands or stickers
DE2324689A1 (de) * 1973-05-16 1974-12-05 Bayer Ag Gegen vergilbung stabilisierte antistatische polyamidmassen
JPH0691153B2 (ja) * 1987-11-28 1994-11-14 日東電工株式会社 保護フイルムの剥離方法
JP3465209B2 (ja) 1995-10-16 2003-11-10 日本電気エンジニアリング株式会社 薄板保護シートの剥離方法
US5972159A (en) * 1997-02-28 1999-10-26 Sony Corporation Optical recording disc recycling method
JP3321129B2 (ja) * 1999-11-17 2002-09-03 富士通株式会社 立体構造物転写方法及びその装置
IT1315144B1 (it) * 2000-11-09 2003-02-03 Gisulfo Baccini Separatore automatico e procedimento di ottenimento di circuiti permicroelettronica.
US6715524B2 (en) * 2002-06-07 2004-04-06 Taiwan Semiconductor Manufacturing Co., Ltd. DFR laminating and film removing system

Also Published As

Publication number Publication date
TW200631887A (en) 2006-09-16
JP2006232509A (ja) 2006-09-07
US20060191633A1 (en) 2006-08-31
US7503995B2 (en) 2009-03-17
TWI359781B (enExample) 2012-03-11

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