TW200631887A - Peeling apparatus and peeling method - Google Patents

Peeling apparatus and peeling method

Info

Publication number
TW200631887A
TW200631887A TW095105333A TW95105333A TW200631887A TW 200631887 A TW200631887 A TW 200631887A TW 095105333 A TW095105333 A TW 095105333A TW 95105333 A TW95105333 A TW 95105333A TW 200631887 A TW200631887 A TW 200631887A
Authority
TW
Taiwan
Prior art keywords
peeling
film
tape
unit
attaches
Prior art date
Application number
TW095105333A
Other languages
English (en)
Chinese (zh)
Other versions
TWI359781B (enExample
Inventor
Takuya Hayasaka
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW200631887A publication Critical patent/TW200631887A/zh
Application granted granted Critical
Publication of TWI359781B publication Critical patent/TWI359781B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1174—Using roller for delamination [e.g., roller pairs operating at differing speeds or directions, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/195—Delaminating roller means
    • Y10T156/1956—Roller pair delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
TW095105333A 2005-02-28 2006-02-17 Peeling apparatus and peeling method TW200631887A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005052388A JP4323443B2 (ja) 2005-02-28 2005-02-28 剥離装置及び剥離方法

Publications (2)

Publication Number Publication Date
TW200631887A true TW200631887A (en) 2006-09-16
TWI359781B TWI359781B (enExample) 2012-03-11

Family

ID=36930973

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095105333A TW200631887A (en) 2005-02-28 2006-02-17 Peeling apparatus and peeling method

Country Status (3)

Country Link
US (1) US7503995B2 (enExample)
JP (1) JP4323443B2 (enExample)
TW (1) TW200631887A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107031901A (zh) * 2016-01-20 2017-08-11 亚威科股份有限公司 薄膜附着装置以及方法
TWI602703B (zh) * 2013-01-25 2017-10-21 旭硝子股份有限公司 Substrate stripping apparatus and stripping method, and electronic device manufacturing method
TWI701146B (zh) * 2016-06-07 2020-08-11 日商迪恩士先端貼合科技股份有限公司 由載體基板與樹脂層構成之工件的分離方法及分離裝置
CN114683443A (zh) * 2022-03-11 2022-07-01 安徽科技学院 一种pvc绝缘胶带回收处理装置及方法

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4326418B2 (ja) * 2004-07-16 2009-09-09 株式会社東京精密 フィルム剥離方法およびフィルム剥離装置
JP4992362B2 (ja) * 2006-09-22 2012-08-08 カシオ計算機株式会社 フィルム剥離方法およびその装置
TWI335899B (en) * 2006-11-03 2011-01-11 Kodak Graphic Comm Canada Co Methods and apparatus for peeling a flexible sheet from a substrate
AU2008226410A1 (en) * 2007-03-09 2008-09-18 Nexus Biosystems, Inc. Device and method for removing a peelable seal
JP5113621B2 (ja) * 2008-05-14 2013-01-09 リンテック株式会社 シート剥離装置及び剥離方法
WO2010035479A1 (ja) * 2008-09-26 2010-04-01 芝浦メカトロニクス株式会社 剥離装置及び剥離方法
JP5453035B2 (ja) * 2009-10-02 2014-03-26 リンテック株式会社 シート剥離装置及び剥離方法
WO2011121646A1 (ja) * 2010-03-30 2011-10-06 シャープ株式会社 カバーフィルム剥離装置及びカバーフィルム剥離方法
JP5593190B2 (ja) * 2010-10-08 2014-09-17 東芝機械株式会社 モールド剥離装置
JP5587271B2 (ja) * 2011-03-31 2014-09-10 富士フイルム株式会社 干渉防止部材分離装置、及び生化学分析装置
JP5687647B2 (ja) * 2012-03-14 2015-03-18 株式会社東芝 半導体装置の製造方法、半導体製造装置
JP5937404B2 (ja) * 2012-04-04 2016-06-22 日東電工株式会社 保護テープ剥離方法および保護テープ剥離装置
KR102006876B1 (ko) * 2012-09-04 2019-08-05 삼성디스플레이 주식회사 필름 박리장치 및 그것을 이용한 필름 박리방법
US10052884B2 (en) * 2014-10-28 2018-08-21 Ishida Co., Ltd. Label issuing apparatus
CN107206818B (zh) 2015-02-09 2020-04-24 株式会社石田 标签打印机
US10066396B1 (en) * 2016-10-17 2018-09-04 Firestone Building Products Co., LLC Roofing composite scoring tool and methods of use
JP7292889B2 (ja) 2019-02-01 2023-06-19 株式会社エム・シー・ケー 剥離装置及び剥離方法
CN110733716B (zh) * 2019-11-12 2022-01-28 珠海格力智能装备有限公司 显示面板的撕膜方法及装置、撕膜控制设备
US11390061B2 (en) * 2020-05-09 2022-07-19 Nps Co., Ltd. Curl removing apparatus for multi-layer film
US11889742B2 (en) * 2020-11-04 2024-01-30 Samsung Display Co., Ltd. Apparatus of manufacturing display device and method of manufacturing display device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2170147A (en) * 1937-01-21 1939-08-22 John D Lane Package of gummed bands or stickers
DE2324689A1 (de) * 1973-05-16 1974-12-05 Bayer Ag Gegen vergilbung stabilisierte antistatische polyamidmassen
JPH0691153B2 (ja) * 1987-11-28 1994-11-14 日東電工株式会社 保護フイルムの剥離方法
JP3465209B2 (ja) 1995-10-16 2003-11-10 日本電気エンジニアリング株式会社 薄板保護シートの剥離方法
US5972159A (en) * 1997-02-28 1999-10-26 Sony Corporation Optical recording disc recycling method
JP3321129B2 (ja) * 1999-11-17 2002-09-03 富士通株式会社 立体構造物転写方法及びその装置
IT1315144B1 (it) * 2000-11-09 2003-02-03 Gisulfo Baccini Separatore automatico e procedimento di ottenimento di circuiti permicroelettronica.
US6715524B2 (en) * 2002-06-07 2004-04-06 Taiwan Semiconductor Manufacturing Co., Ltd. DFR laminating and film removing system

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI602703B (zh) * 2013-01-25 2017-10-21 旭硝子股份有限公司 Substrate stripping apparatus and stripping method, and electronic device manufacturing method
CN107031901A (zh) * 2016-01-20 2017-08-11 亚威科股份有限公司 薄膜附着装置以及方法
TWI701146B (zh) * 2016-06-07 2020-08-11 日商迪恩士先端貼合科技股份有限公司 由載體基板與樹脂層構成之工件的分離方法及分離裝置
CN114683443A (zh) * 2022-03-11 2022-07-01 安徽科技学院 一种pvc绝缘胶带回收处理装置及方法
CN114683443B (zh) * 2022-03-11 2023-09-12 安徽科技学院 一种pvc绝缘胶带回收处理装置及方法

Also Published As

Publication number Publication date
JP4323443B2 (ja) 2009-09-02
JP2006232509A (ja) 2006-09-07
US20060191633A1 (en) 2006-08-31
US7503995B2 (en) 2009-03-17
TWI359781B (enExample) 2012-03-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees