IT1315144B1 - Separatore automatico e procedimento di ottenimento di circuiti permicroelettronica. - Google Patents
Separatore automatico e procedimento di ottenimento di circuiti permicroelettronica.Info
- Publication number
- IT1315144B1 IT1315144B1 IT2000UD000206A ITUD20000206A IT1315144B1 IT 1315144 B1 IT1315144 B1 IT 1315144B1 IT 2000UD000206 A IT2000UD000206 A IT 2000UD000206A IT UD20000206 A ITUD20000206 A IT UD20000206A IT 1315144 B1 IT1315144 B1 IT 1315144B1
- Authority
- IT
- Italy
- Prior art keywords
- permicroelectronic
- circuits
- procedure
- obtaining
- automatic separator
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1906—Delaminating means responsive to feed or shape at delamination
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT2000UD000206A IT1315144B1 (it) | 2000-11-09 | 2000-11-09 | Separatore automatico e procedimento di ottenimento di circuiti permicroelettronica. |
EP01126390A EP1207728B1 (en) | 2000-11-09 | 2001-11-07 | Automatic seperator and method to obtain circuits for microelectronics |
DE60133528T DE60133528T2 (de) | 2000-11-09 | 2001-11-07 | Automatische Trennvorrichtung und Verfahren zur Erzeugung von Schaltungen für die Mikroelektronik |
US10/007,915 US6681829B2 (en) | 2000-11-09 | 2001-11-09 | Automatic separator and method to obtain circuits for microelectronics |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT2000UD000206A IT1315144B1 (it) | 2000-11-09 | 2000-11-09 | Separatore automatico e procedimento di ottenimento di circuiti permicroelettronica. |
Publications (2)
Publication Number | Publication Date |
---|---|
ITUD20000206A1 ITUD20000206A1 (it) | 2002-05-09 |
IT1315144B1 true IT1315144B1 (it) | 2003-02-03 |
Family
ID=11460428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT2000UD000206A IT1315144B1 (it) | 2000-11-09 | 2000-11-09 | Separatore automatico e procedimento di ottenimento di circuiti permicroelettronica. |
Country Status (4)
Country | Link |
---|---|
US (1) | US6681829B2 (it) |
EP (1) | EP1207728B1 (it) |
DE (1) | DE60133528T2 (it) |
IT (1) | IT1315144B1 (it) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2260075T3 (es) * | 1999-12-21 | 2006-11-01 | Pirelli Tyre S.P.A. | Procedimiento y aparato para desmontar automaticamente el tapizado de soporte de una banda elastomera. |
NL1016431C2 (nl) * | 2000-10-18 | 2002-04-22 | Univ Nijmegen | Werkwijze voor het scheiden van een film en een substraat. |
JP2002329965A (ja) * | 2001-05-07 | 2002-11-15 | New Create Kk | 薄膜積層体の製造方法および製造装置 |
EP1314554A1 (fr) * | 2001-11-23 | 2003-05-28 | Kba-Giori S.A. | Dispositif de décollage d'éléments de sécurité |
US20050224176A1 (en) * | 2004-04-06 | 2005-10-13 | Murphy Clifford J | Apparatus and method for preparing shims to be applied to brake pads |
JP4323443B2 (ja) * | 2005-02-28 | 2009-09-02 | リンテック株式会社 | 剥離装置及び剥離方法 |
JP5631681B2 (ja) * | 2010-09-30 | 2014-11-26 | ラピスセミコンダクタ株式会社 | テープ剥離装置、テープ巻取り部、およびテープ巻取り部からのテープ取り外し方法 |
DE102020119886A1 (de) | 2020-07-28 | 2022-02-03 | AUDI HUNGARIA Zrt. | Ablösevorrichtung für Isolierschichtelement sowie Spenderanlage mit Ablösevorrichtung |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03218802A (ja) * | 1990-01-23 | 1991-09-26 | Fujitsu Ltd | フィルム剥離装置 |
JPH03232659A (ja) * | 1990-02-09 | 1991-10-16 | Japan Steel Works Ltd:The | 両面粘着シートの保護フィルム除去方法及び装置 |
GB9208533D0 (en) * | 1992-04-21 | 1992-06-03 | Esselte Dymo Nv | Tape cutting apparatus |
US5532724A (en) * | 1992-08-31 | 1996-07-02 | Toppan Printing Co., Ltd. | Image transfer device |
JPH06171823A (ja) * | 1992-12-09 | 1994-06-21 | Canon Inc | ドライフィルムレジスト用保護フィルム除去装置 |
JP3132214B2 (ja) * | 1993-01-14 | 2001-02-05 | 株式会社村田製作所 | セラミック多層回路部品の製造方法およびセラミックグリーンシートの取扱装置 |
JP2751056B2 (ja) * | 1993-02-27 | 1998-05-18 | 太陽誘電株式会社 | セラミックグリーンシートのキャリアフィルム剥離方法及びその装置 |
JPH08244019A (ja) * | 1995-03-13 | 1996-09-24 | Taiyo Yuden Co Ltd | セラミックグリーンシートの積層方法 |
JP3465209B2 (ja) * | 1995-10-16 | 2003-11-10 | 日本電気エンジニアリング株式会社 | 薄板保護シートの剥離方法 |
JPH09169461A (ja) * | 1995-12-22 | 1997-06-30 | Nec Eng Ltd | 偏光板保護シート剥離機構 |
JPH11208986A (ja) * | 1998-01-20 | 1999-08-03 | Nec Eng Ltd | 保護シート剥離装置 |
-
2000
- 2000-11-09 IT IT2000UD000206A patent/IT1315144B1/it active
-
2001
- 2001-11-07 DE DE60133528T patent/DE60133528T2/de not_active Expired - Lifetime
- 2001-11-07 EP EP01126390A patent/EP1207728B1/en not_active Expired - Lifetime
- 2001-11-09 US US10/007,915 patent/US6681829B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE60133528D1 (de) | 2008-05-21 |
EP1207728B1 (en) | 2008-04-09 |
US6681829B2 (en) | 2004-01-27 |
DE60133528T2 (de) | 2009-06-25 |
ITUD20000206A1 (it) | 2002-05-09 |
US20020053394A1 (en) | 2002-05-09 |
EP1207728A1 (en) | 2002-05-22 |
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