JP4295490B2 - 処理装置並びに処理装置用のチラー制御方法及びチラー制御装置 - Google Patents
処理装置並びに処理装置用のチラー制御方法及びチラー制御装置 Download PDFInfo
- Publication number
- JP4295490B2 JP4295490B2 JP2002332800A JP2002332800A JP4295490B2 JP 4295490 B2 JP4295490 B2 JP 4295490B2 JP 2002332800 A JP2002332800 A JP 2002332800A JP 2002332800 A JP2002332800 A JP 2002332800A JP 4295490 B2 JP4295490 B2 JP 4295490B2
- Authority
- JP
- Japan
- Prior art keywords
- flow rate
- chiller
- refrigerant
- idle state
- time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 77
- 239000003507 refrigerant Substances 0.000 claims description 122
- 239000000758 substrate Substances 0.000 claims description 42
- 239000007788 liquid Substances 0.000 claims description 31
- 239000002826 coolant Substances 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 4
- 230000005684 electric field Effects 0.000 claims 1
- 238000005530 etching Methods 0.000 description 36
- 238000011084 recovery Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 238000001020 plasma etching Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000000284 resting effect Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0077—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for tempering, e.g. with cooling or heating circuits for temperature control of elements
Landscapes
- Drying Of Semiconductors (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002332800A JP4295490B2 (ja) | 2002-11-15 | 2002-11-15 | 処理装置並びに処理装置用のチラー制御方法及びチラー制御装置 |
| US10/712,043 US6986261B2 (en) | 2002-11-15 | 2003-11-14 | Method and system for controlling chiller and semiconductor processing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002332800A JP4295490B2 (ja) | 2002-11-15 | 2002-11-15 | 処理装置並びに処理装置用のチラー制御方法及びチラー制御装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004169933A JP2004169933A (ja) | 2004-06-17 |
| JP2004169933A5 JP2004169933A5 (enExample) | 2005-09-22 |
| JP4295490B2 true JP4295490B2 (ja) | 2009-07-15 |
Family
ID=32697720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002332800A Expired - Lifetime JP4295490B2 (ja) | 2002-11-15 | 2002-11-15 | 処理装置並びに処理装置用のチラー制御方法及びチラー制御装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4295490B2 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4693034B2 (ja) * | 2005-01-28 | 2011-06-01 | 株式会社Kelk | プロセスチャンバ判別装置 |
| JP2006236095A (ja) * | 2005-02-25 | 2006-09-07 | Yokogawa Electric Corp | 流量制御装置 |
| JP4566052B2 (ja) * | 2005-04-07 | 2010-10-20 | Atsジャパン株式会社 | 恒温維持装置。 |
| JP5091413B2 (ja) | 2006-03-08 | 2012-12-05 | 東京エレクトロン株式会社 | 基板処理装置および基板処理装置の制御方法 |
| JP2008292026A (ja) | 2007-05-23 | 2008-12-04 | Ats Japan Corp | 恒温維持装置。 |
| US9338871B2 (en) | 2010-01-29 | 2016-05-10 | Applied Materials, Inc. | Feedforward temperature control for plasma processing apparatus |
| US8916793B2 (en) | 2010-06-08 | 2014-12-23 | Applied Materials, Inc. | Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow |
| US10274270B2 (en) | 2011-10-27 | 2019-04-30 | Applied Materials, Inc. | Dual zone common catch heat exchanger/chiller |
| JP6408903B2 (ja) * | 2014-12-25 | 2018-10-17 | 東京エレクトロン株式会社 | エッチング処理方法及びエッチング処理装置 |
| JP7027057B2 (ja) * | 2017-07-18 | 2022-03-01 | 株式会社アルバック | 基板搬送装置 |
| CN118776951B (zh) * | 2024-09-06 | 2024-11-22 | 常州博瑞电力自动化设备有限公司 | 一种构网型冷却系统流量延时测试方法 |
| CN119175598B (zh) * | 2024-11-26 | 2025-03-28 | 四川埃姆克伺服科技有限公司 | 一种立式电主轴冷却方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2512783B2 (ja) * | 1988-04-20 | 1996-07-03 | 株式会社日立製作所 | プラズマエッチング方法及び装置 |
| JP3050710B2 (ja) * | 1992-12-22 | 2000-06-12 | 東京エレクトロン株式会社 | サセプタ温度制御方法 |
| JPH09172001A (ja) * | 1995-12-15 | 1997-06-30 | Sony Corp | 半導体製造装置の温度制御方法および装置 |
| JPH11175142A (ja) * | 1997-12-10 | 1999-07-02 | Hitachi Ltd | 製造装置の運転支援システム |
| JP2000012412A (ja) * | 1998-06-18 | 2000-01-14 | Kokusai Electric Co Ltd | 半導体製造装置の性能監視方法および装置 |
| JP4256031B2 (ja) * | 1999-07-27 | 2009-04-22 | 東京エレクトロン株式会社 | 処理装置およびその温度制御方法 |
| JP4585702B2 (ja) * | 2001-02-14 | 2010-11-24 | キヤノン株式会社 | 露光装置 |
-
2002
- 2002-11-15 JP JP2002332800A patent/JP4295490B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004169933A (ja) | 2004-06-17 |
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