JP4286496B2 - 蒸着装置及び薄膜作製方法 - Google Patents

蒸着装置及び薄膜作製方法 Download PDF

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Publication number
JP4286496B2
JP4286496B2 JP2002196348A JP2002196348A JP4286496B2 JP 4286496 B2 JP4286496 B2 JP 4286496B2 JP 2002196348 A JP2002196348 A JP 2002196348A JP 2002196348 A JP2002196348 A JP 2002196348A JP 4286496 B2 JP4286496 B2 JP 4286496B2
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Prior art keywords
vapor deposition
substrate
source
sources
moving
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Expired - Lifetime
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JP2002196348A
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English (en)
Japanese (ja)
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JP2004035964A5 (enExample
JP2004035964A (ja
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幹夫 浅田
敬自 内田
悌二 高橋
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2002196348A priority Critical patent/JP4286496B2/ja
Priority to KR1020020070268A priority patent/KR100934073B1/ko
Publication of JP2004035964A publication Critical patent/JP2004035964A/ja
Publication of JP2004035964A5 publication Critical patent/JP2004035964A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
JP2002196348A 2002-07-04 2002-07-04 蒸着装置及び薄膜作製方法 Expired - Lifetime JP4286496B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002196348A JP4286496B2 (ja) 2002-07-04 2002-07-04 蒸着装置及び薄膜作製方法
KR1020020070268A KR100934073B1 (ko) 2002-07-04 2002-11-13 증착장치 및 박막제작방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002196348A JP4286496B2 (ja) 2002-07-04 2002-07-04 蒸着装置及び薄膜作製方法

Publications (3)

Publication Number Publication Date
JP2004035964A JP2004035964A (ja) 2004-02-05
JP2004035964A5 JP2004035964A5 (enExample) 2005-10-20
JP4286496B2 true JP4286496B2 (ja) 2009-07-01

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JP (1) JP4286496B2 (enExample)
KR (1) KR100934073B1 (enExample)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
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US20040040504A1 (en) 2002-08-01 2004-03-04 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
TWI277363B (en) 2002-08-30 2007-03-21 Semiconductor Energy Lab Fabrication system, light-emitting device and fabricating method of organic compound-containing layer
US7211461B2 (en) 2003-02-14 2007-05-01 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
JP4493926B2 (ja) 2003-04-25 2010-06-30 株式会社半導体エネルギー研究所 製造装置
JP4522777B2 (ja) * 2003-07-25 2010-08-11 株式会社半導体エネルギー研究所 発光装置の作製方法
US7211454B2 (en) 2003-07-25 2007-05-01 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of a light emitting device including moving the source of the vapor deposition parallel to the substrate
US8123862B2 (en) 2003-08-15 2012-02-28 Semiconductor Energy Laboratory Co., Ltd. Deposition apparatus and manufacturing apparatus
KR20060018746A (ko) * 2004-08-25 2006-03-02 삼성에스디아이 주식회사 유기물 증착 장치
JP4516499B2 (ja) * 2004-08-25 2010-08-04 三星モバイルディスプレイ株式會社 有機物蒸着装置
KR100646502B1 (ko) * 2004-12-13 2006-11-15 삼성에스디아이 주식회사 유기물 증착 장치
JP4384109B2 (ja) 2005-01-05 2009-12-16 三星モバイルディスプレイ株式會社 蒸着システム用蒸着源の駆動軸及びこれを具備した蒸着システム
KR101208995B1 (ko) * 2005-04-20 2012-12-06 주성엔지니어링(주) 증착용기를 구비하는 증착장치
KR100729096B1 (ko) 2006-03-29 2007-06-14 삼성에스디아이 주식회사 유기물 증발 증착방법 및 이를 위한 유기 증발 증착 장치
JP2007291506A (ja) 2006-03-31 2007-11-08 Canon Inc 成膜方法
JP2008274322A (ja) * 2007-04-26 2008-11-13 Sony Corp 蒸着装置
KR100977971B1 (ko) * 2007-06-27 2010-08-24 두산메카텍 주식회사 증착 장치
US7897971B2 (en) * 2007-07-26 2011-03-01 Semiconductor Energy Laboratory Co., Ltd. Display device
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JP2010020210A (ja) * 2008-07-14 2010-01-28 Seiko Epson Corp スクリーンの製造方法及び製造装置、並びにスクリーン
KR20100013808A (ko) * 2008-08-01 2010-02-10 삼성모바일디스플레이주식회사 유기물 증착 장치
JP5231917B2 (ja) * 2008-09-25 2013-07-10 株式会社日立ハイテクノロジーズ 成膜装置
KR101076227B1 (ko) * 2008-12-23 2011-10-26 주식회사 테스 진공증착장치
JP5795028B2 (ja) * 2009-05-22 2015-10-14 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置
JP5623786B2 (ja) * 2009-05-22 2014-11-12 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置
JP5620146B2 (ja) 2009-05-22 2014-11-05 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置
US8882921B2 (en) 2009-06-08 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US8696815B2 (en) 2009-09-01 2014-04-15 Samsung Display Co., Ltd. Thin film deposition apparatus
US8876975B2 (en) 2009-10-19 2014-11-04 Samsung Display Co., Ltd. Thin film deposition apparatus
KR200449417Y1 (ko) * 2009-12-31 2010-07-13 주식회사 나파스 휴대형 교통 안전표시구
KR101084184B1 (ko) 2010-01-11 2011-11-17 삼성모바일디스플레이주식회사 박막 증착 장치
KR101193186B1 (ko) 2010-02-01 2012-10-19 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
JP5476227B2 (ja) * 2010-06-29 2014-04-23 株式会社日立ハイテクノロジーズ 成膜装置及び成膜方法
KR101760897B1 (ko) 2011-01-12 2017-07-25 삼성디스플레이 주식회사 증착원 및 이를 구비하는 유기막 증착 장치
US9055654B2 (en) * 2011-12-22 2015-06-09 Semiconductor Energy Laboratory Co., Ltd. Film formation apparatus and film formation method
KR101975020B1 (ko) * 2012-04-24 2019-05-07 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR101462595B1 (ko) * 2012-11-22 2014-11-18 주식회사 에스에프에이 진공증착장치
KR102075525B1 (ko) 2013-03-20 2020-02-11 삼성디스플레이 주식회사 유기층 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR102107104B1 (ko) 2013-06-17 2020-05-07 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101530031B1 (ko) * 2013-11-26 2015-06-19 주식회사 에스에프에이 기판 증착장치 및 기판 증착방법
EP3187618A1 (en) * 2013-12-10 2017-07-05 Applied Materials, Inc. Evaporation source for organic material, deposition apparatus for depositing organic materials in a vacuum chamber having an evaporation source for organic material, and method for evaporating organic material
JP2017036512A (ja) * 2016-11-07 2017-02-16 株式会社半導体エネルギー研究所 成膜装置
WO2020230359A1 (ja) * 2019-05-13 2020-11-19 株式会社アルバック 蒸着ユニット及びこの蒸着ユニットを備える真空蒸着装置
US20220145443A1 (en) * 2019-05-13 2022-05-12 Ulvac, Inc. Vapor deposition unit and vacuum vapor deposition apparatus provided with vapor deposition unit
KR102355870B1 (ko) * 2020-07-30 2022-02-07 주식회사 선익시스템 증착 소스의 위치 조절이 가능한 증착 장치
CN117089811B (zh) * 2023-10-17 2024-01-30 焕澄(上海)新材料科技发展有限公司 一种制备光学镀膜的装置

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JP2004035964A (ja) 2004-02-05
KR100934073B1 (ko) 2009-12-24

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