JP2010531391A - 蒸着装置 - Google Patents
蒸着装置 Download PDFInfo
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- JP2010531391A JP2010531391A JP2010514600A JP2010514600A JP2010531391A JP 2010531391 A JP2010531391 A JP 2010531391A JP 2010514600 A JP2010514600 A JP 2010514600A JP 2010514600 A JP2010514600 A JP 2010514600A JP 2010531391 A JP2010531391 A JP 2010531391A
- Authority
- JP
- Japan
- Prior art keywords
- moving plate
- vapor deposition
- deposition apparatus
- drive
- moving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Transmission Devices (AREA)
Abstract
【解決手段】本発明の蒸着装置は、フレーム上に往復移動可能に取り付けられた移動プレート、基板上に蒸着できるように蒸着材料を蒸発させ、前記移動プレートに前記移動プレートの移動方向と交差する方向に配設けられた複数の蒸発源、及び、前記移動プレートを往復駆動させるための駆動ユニットを含む。
【選択図】図1
Description
104 支持リブ
110 移動プレート
112 連結部材
114 支持部材
120 蒸発源
122 ゲスト蒸発源
124 ホスト蒸発源
130 ガイドユニット
132 ガイドレール
134 ガイド部材
135 ガイド溝
141 駆動モータ
142 動力伝達ユニット
143 ベベルギヤ
144 ベベルギヤ
144a 軸
145 駆動プーリ
146 従動プーリ
147 スチールベルト
210 移動プレート
241 駆動モータ
241a 駆動軸
245 駆動プーリ
246 従動プーリ
247 スチールベルト
Claims (10)
- フレーム上に往復移動可能に取り付けられた移動プレート、
基板上に蒸着できるように蒸着物質を蒸発させ、前記移動プレートに、前記移動プレートの移動方向と交差する方向に配設された複数の蒸発源、及び
前記移動プレートを往復移動させるための駆動ユニット、
を有することを特徴とする蒸着装置。 - 移動プレートの往復移動をガイドするガイドユニットを有する請求項1に記載の蒸着装置。
- ガイドユニットは、
フレームに設けられたガイドレール、及び
前記ガイドレールが挿入されるガイド溝が形成され、移動プレートに固定されるように設けられたガイド部材、
を有する請求項2に記載の蒸着装置。 - 駆動ユニットは、
駆動モータ、及び
移動プレートが移動可能となるように前記駆動モータの動力を前記移動プレートに伝達する動力伝達ユニット、
を有する請求項1及び3のいずれかに記載の蒸着装置。 - 動力伝達ユニットは、
フレームに回転可能に設けられ、駆動モータにより駆動される駆動プーリ、
前記駆動プーリから移動プレートの移動方向に離間して配置され、前記フレームに回転可能に設けられた従動プーリ、及び
前記駆動プーリと前記従動プーリとを駆動連結させ、一地点において前記移動プレートが固定されるように設けられたスチールベルト、
を有し、
前記駆動プーリ及び前記従動プーリが回転するに伴い、前記スチールベルトが回転して前記移動プレートが往復移動する請求項4に記載の蒸着装置。 - 動力伝達ユニットは、
駆動モータの動力を前記駆動プーリに伝達する1組のベベルギヤを有する請求項5に記載の蒸着装置。 - 駆動プーリは、駆動モータの駆動軸に結合される請求項6に記載の蒸着装置。
- 駆動プーリ、従動プーリ及びスチールベルトは、それぞれ複数個が移動プレートの移動方向と交差する方向に離間して配置される請求項5に記載の蒸着装置。
- 蒸発源は、
移動プレートの移動方向と交差する方向に互いに離間して配置された複数のホスト蒸発源、及び
ホスト蒸発源に対応する個数が前記ホスト蒸発源の各々から前記移動プレートの移動方向に離間して配置されたゲスト蒸発源、
を有する請求項1に記載の蒸着装置。 - 駆動モータ、
フレーム上に往復移動可能に取り付けられた移動プレート、
基板上に蒸着できるように蒸着物質を蒸発させ、前記移動プレートに設けられた少なくとも1つの蒸発源、及び
前記移動プレートが固定されるように設けられ、前記駆動モータの動力を伝達して前記移動プレートを前記フレーム上で往復移動させるスチールベルト、
を有する蒸着装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20070063711A KR100977971B1 (ko) | 2007-06-27 | 2007-06-27 | 증착 장치 |
PCT/KR2008/002919 WO2009002019A2 (en) | 2007-06-27 | 2008-05-26 | Evaporation apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2010531391A true JP2010531391A (ja) | 2010-09-24 |
Family
ID=40186136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010514600A Pending JP2010531391A (ja) | 2007-06-27 | 2008-05-26 | 蒸着装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2010531391A (ja) |
KR (1) | KR100977971B1 (ja) |
CN (1) | CN101743617B (ja) |
TW (1) | TWI443208B (ja) |
WO (1) | WO2009002019A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103540898A (zh) * | 2013-10-30 | 2014-01-29 | 京东方科技集团股份有限公司 | 一种真空蒸镀装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101876058B (zh) * | 2010-03-23 | 2012-07-11 | 东莞宏威数码机械有限公司 | 真空蒸镀装置 |
KR101609185B1 (ko) * | 2013-12-13 | 2016-04-05 | 주식회사 선익시스템 | 증발원 이송유닛, 증착 장치 및 증착 방법 |
CN105695939B (zh) * | 2016-04-26 | 2018-09-14 | 京东方科技集团股份有限公司 | 线性蒸发源、蒸镀装置及方法 |
CN111041441B (zh) * | 2019-12-28 | 2021-04-13 | 中国科学院长春光学精密机械与物理研究所 | 一种均匀镀膜方法、镀膜设备及计算机可读存储介质 |
CN116200709A (zh) * | 2022-12-30 | 2023-06-02 | 浙江昌丽木作家居有限公司 | 一种木材表面包覆铝合金装饰膜的设备及其工艺 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06220628A (ja) * | 1993-01-26 | 1994-08-09 | Clean Saafueisu Gijutsu Kk | スパッター装置 |
JPH0659464U (ja) * | 1993-01-29 | 1994-08-19 | 日新電機株式会社 | 成膜装置 |
JP2003257644A (ja) * | 2002-03-05 | 2003-09-12 | Sanyo Electric Co Ltd | 有機エレクトロルミネッセンス表示装置の製造方法 |
JP2003293122A (ja) * | 1999-12-27 | 2003-10-15 | Semiconductor Energy Lab Co Ltd | 表示装置の作製方法 |
JP2004063454A (ja) * | 2002-06-03 | 2004-02-26 | Semiconductor Energy Lab Co Ltd | 蒸着装置 |
JP2004176126A (ja) * | 2002-11-27 | 2004-06-24 | Ulvac Japan Ltd | 真空成膜装置及び真空成膜方法 |
JP2004353030A (ja) * | 2003-05-28 | 2004-12-16 | Tokki Corp | 蒸着装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4286496B2 (ja) * | 2002-07-04 | 2009-07-01 | 株式会社半導体エネルギー研究所 | 蒸着装置及び薄膜作製方法 |
US20040040504A1 (en) * | 2002-08-01 | 2004-03-04 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing apparatus |
-
2007
- 2007-06-27 KR KR20070063711A patent/KR100977971B1/ko not_active IP Right Cessation
-
2008
- 2008-05-26 CN CN2008800220536A patent/CN101743617B/zh not_active Expired - Fee Related
- 2008-05-26 WO PCT/KR2008/002919 patent/WO2009002019A2/en active Application Filing
- 2008-05-26 JP JP2010514600A patent/JP2010531391A/ja active Pending
- 2008-06-02 TW TW97120463A patent/TWI443208B/zh not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06220628A (ja) * | 1993-01-26 | 1994-08-09 | Clean Saafueisu Gijutsu Kk | スパッター装置 |
JPH0659464U (ja) * | 1993-01-29 | 1994-08-19 | 日新電機株式会社 | 成膜装置 |
JP2003293122A (ja) * | 1999-12-27 | 2003-10-15 | Semiconductor Energy Lab Co Ltd | 表示装置の作製方法 |
JP2003257644A (ja) * | 2002-03-05 | 2003-09-12 | Sanyo Electric Co Ltd | 有機エレクトロルミネッセンス表示装置の製造方法 |
JP2004063454A (ja) * | 2002-06-03 | 2004-02-26 | Semiconductor Energy Lab Co Ltd | 蒸着装置 |
JP2004176126A (ja) * | 2002-11-27 | 2004-06-24 | Ulvac Japan Ltd | 真空成膜装置及び真空成膜方法 |
JP2004353030A (ja) * | 2003-05-28 | 2004-12-16 | Tokki Corp | 蒸着装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103540898A (zh) * | 2013-10-30 | 2014-01-29 | 京东方科技集团股份有限公司 | 一种真空蒸镀装置 |
US10316401B2 (en) | 2013-10-30 | 2019-06-11 | Boe Technology Group Co., Ltd. | Vacuum evaporation device |
Also Published As
Publication number | Publication date |
---|---|
CN101743617A (zh) | 2010-06-16 |
TWI443208B (zh) | 2014-07-01 |
KR100977971B1 (ko) | 2010-08-24 |
WO2009002019A2 (en) | 2008-12-31 |
WO2009002019A3 (en) | 2009-02-19 |
KR20080114299A (ko) | 2008-12-31 |
CN101743617B (zh) | 2012-05-23 |
TW200916595A (en) | 2009-04-16 |
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