JP4285364B2 - 立体回路モジュールとこれを用いた携帯端末機器および立体回路モジュールの製造方法 - Google Patents
立体回路モジュールとこれを用いた携帯端末機器および立体回路モジュールの製造方法 Download PDFInfo
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Description
図1は本発明の第1の実施の形態に係る立体回路モジュールの断面図、図2は外観斜視図である。
図10は、本発明の第2の実施の形態に係る立体回路モジュールおよびその製造方法を説明する断面図である。
110,280,360 支持部材
120,290,370,540,550,560 枠部
120A (枠部の)上面
120B (枠部の)下面
130,300 底部材
140,150,310,390,390A,390B,400,400A,400B 窪み部
160,170,540A,540B,550A,550B,560A,560B 被覆層
180,190,470,480 配線パターン
200,230,570A,570B,580A,580B,590A,590B 第1ランド
210,240 第2ランド
220,250 配線部
260,270,320,330A,330B,340A,340B,410A,410B,420A,420B 電子部品
260A,270A (突起状の)電極
380 仕切枠部
430,435 中間構造体
440,490,500 押圧機
440A,490A,500A 上型
440B,490B,500B 下型
450,460 被覆シート
600 積層立体回路モジュール
610 層間接続電極
Claims (9)
- 周囲の枠部と窪み部を有する支持部材と、
前記支持部材の前記枠部上を覆い前記窪み部を埋めるように配設された、前記支持部材よりも軟化温度が低く粘着性を有する樹脂材料からなる被覆層と、
前記被覆層上に設けられた、前記枠部上部の第1ランドと前記窪み部上部の第2ランドおよび前記第1ランドと前記第2ランド間を接続する配線部からなる配線パターンと、
片面に突起状の電極を有し、前記配線パターンの前記第2ランドと前記突起状の電極が接続された電子部品と
を備え、
前記電子部品は前記窪み部に押し込む際に前記配線パターンを前記窪み部に引き込むとともに前記被覆層に粘着されて前記窪み部に収容されていることを特徴とする立体回路モジュール。 - 前記支持部材の厚み方向の両面に前記枠部と前記窪み部を有することを特徴とする請求項1に記載の立体回路モジュール。
- 前記支持部材の前記枠部と仕切枠部によって前記窪み部が複数個に分割されていることを特徴とする請求項1に記載の立体回路モジュール。
- 前記樹脂材料が、前記支持部材よりも軟化温度が低い熱可塑性樹脂であることを特徴とする請求項1に記載の立体回路モジュール。
- 請求項1または請求項2に記載の立体回路モジュールが複数個積み重ねられ、当接する前記支持部材の前記枠部上の前記被覆層同士が互いに固着することにより前記配線パターンの前記第1ランド同士を接続して、積層されていることを特徴とする立体回路モジュール。
- 周囲の枠部と窪み部を有する支持部材を形成する工程と、
前記支持部材の前記枠部上を覆い前記窪み部を埋めるように、前記支持部材よりも軟化温度が低く粘着性を有する樹脂材料により被覆層を形成する工程と、
前記被覆層上に、前記枠部上部の第1ランドと前記窪み部上部の第2ランドおよび前記第1ランドと前記第2ランド間を接続する配線部からなる配線パターンを形成する工程と、前記被覆層上に、前記配線パターンの前記第2ランドと電子部品の片面に形成された突起状の電極を接続し、前記電子部品を搭載する工程と、
前記樹脂材料の軟化温度以上に加熱し所定の圧力で、前記被覆層上に搭載された前記電子部品を前記窪み部内の前記被覆層内に押し込む工程と
を具備することを特徴とする立体回路モジュールの製造方法。 - 周囲の枠部と窪み部を有する支持部材を形成する工程と、少なくとも前記支持部材の前記枠部上と前記窪み部上を覆う前記支持部材よりも軟化温度が低く粘着性を有する樹脂材料からなる被覆シート上に、前記枠部位置の第1ランドと前記窪み部位置の第2ランドおよび前記第1ランドと前記第2ランド間を接続する配線部からなる配線パターンを形成した後、前記第2ランドと電子部品の片面に形成された突起状の電極を接続し、前記電子部品を搭載する工程と、
前記電子部品が搭載された前記被覆シートを、前記配線パターンの前記第1ランドを前記枠部位置に、前記第2ランドおよび前記電子部品を前記窪み部位置に、それぞれ位置合わせしながら前記支持部材と重ね合わせる工程と、
前記樹脂材料の軟化温度以上に加熱し所定の圧力で、前記支持部材の前記窪み部位置に前記被覆シートと前記電子部品を一体に前記窪み部内に押し込む工程と
を具備することを特徴とする立体回路モジュールの製造方法。 - 請求項6または請求項7に記載の立体回路モジュールの製造方法であって、複数個の前記立体回路モジュールを、前記支持部材の前記枠部を介して重なるように複数個積み重ね、前記樹脂材料の軟化温度以上に加熱し所定の圧力で、前記立体回路モジュールの前記支持部材の前記枠部の前記被覆層同士を互いに固着させることにより前記配線パターンの前記第1ランド同士を接続させて、積層する工程を具備することを特徴とする立体回路モジュールの製造方法。
- 請求項1から請求項4までのいずれか1項に記載の立体回路モジュールを用いたことを特徴とする携帯端末機器。
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JP2004240466A JP4285364B2 (ja) | 2004-08-20 | 2004-08-20 | 立体回路モジュールとこれを用いた携帯端末機器および立体回路モジュールの製造方法 |
CN200510085118XA CN1738512B (zh) | 2004-08-20 | 2005-07-20 | 立体电路模块和用其的叠层立体电路模块及其制造方法 |
US11/196,269 US7759784B2 (en) | 2004-08-20 | 2005-08-04 | 3D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modules |
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JP2004240466A JP4285364B2 (ja) | 2004-08-20 | 2004-08-20 | 立体回路モジュールとこれを用いた携帯端末機器および立体回路モジュールの製造方法 |
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JP4285364B2 true JP4285364B2 (ja) | 2009-06-24 |
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JP5181626B2 (ja) * | 2007-11-05 | 2013-04-10 | 株式会社安川電機 | 多層プリント基板およびインバータ装置 |
JP5172385B2 (ja) * | 2008-02-25 | 2013-03-27 | 株式会社ワコム | 表示機能付き入力装置及び携帯型電子機器 |
US7939369B2 (en) * | 2009-05-14 | 2011-05-10 | International Business Machines Corporation | 3D integration structure and method using bonded metal planes |
US8847376B2 (en) | 2010-07-23 | 2014-09-30 | Tessera, Inc. | Microelectronic elements with post-assembly planarization |
WO2012077280A1 (ja) * | 2010-12-09 | 2012-06-14 | パナソニック株式会社 | 三次元集積回路の設計支援装置及び設計支援方法 |
US8962392B2 (en) * | 2012-03-13 | 2015-02-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Underfill curing method using carrier |
JP6358132B2 (ja) * | 2015-03-03 | 2018-07-18 | オムロン株式会社 | 立体回路構造体 |
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US5241456A (en) * | 1990-07-02 | 1993-08-31 | General Electric Company | Compact high density interconnect structure |
DE69329542T2 (de) * | 1992-06-05 | 2001-02-08 | Mitsui Chemicals Inc | Dreidimensionale leiterplatte, elektronische bauelementanordnung unter verwendung dieser leiterplatte und herstellungsverfahren zu dieser leiterplatte |
US5629835A (en) * | 1994-07-19 | 1997-05-13 | Olin Corporation | Metal ball grid array package with improved thermal conductivity |
JPH09107067A (ja) | 1995-10-09 | 1997-04-22 | Hitachi Ltd | 半導体装置 |
US5710695A (en) * | 1995-11-07 | 1998-01-20 | Vlsi Technology, Inc. | Leadframe ball grid array package |
KR0179921B1 (ko) * | 1996-05-17 | 1999-03-20 | 문정환 | 적측형 반도체 패키지 |
JPH11289023A (ja) * | 1998-04-02 | 1999-10-19 | Oki Electric Ind Co Ltd | 半導体装置及びその製造方法 |
US6294839B1 (en) * | 1999-08-30 | 2001-09-25 | Micron Technology, Inc. | Apparatus and methods of packaging and testing die |
JP2001250902A (ja) | 2000-03-08 | 2001-09-14 | Toshiba Corp | 半導体パッケージ及びその製造方法 |
JP4436582B2 (ja) | 2000-10-02 | 2010-03-24 | パナソニック株式会社 | カード型記録媒体及びその製造方法 |
TW473947B (en) * | 2001-02-20 | 2002-01-21 | Siliconware Precision Industries Co Ltd | Substrate structure of semiconductor packaging article |
JP2002299553A (ja) | 2001-03-29 | 2002-10-11 | Citizen Watch Co Ltd | モジュール及びその製造方法 |
-
2004
- 2004-08-20 JP JP2004240466A patent/JP4285364B2/ja not_active Expired - Fee Related
-
2005
- 2005-07-20 CN CN200510085118XA patent/CN1738512B/zh not_active Expired - Fee Related
- 2005-08-04 US US11/196,269 patent/US7759784B2/en not_active Expired - Fee Related
Also Published As
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CN1738512A (zh) | 2006-02-22 |
US7759784B2 (en) | 2010-07-20 |
JP2006060024A (ja) | 2006-03-02 |
US20060038274A1 (en) | 2006-02-23 |
CN1738512B (zh) | 2011-12-21 |
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