JP4283504B2 - ウェーハ保持装置 - Google Patents

ウェーハ保持装置 Download PDF

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Publication number
JP4283504B2
JP4283504B2 JP2002206761A JP2002206761A JP4283504B2 JP 4283504 B2 JP4283504 B2 JP 4283504B2 JP 2002206761 A JP2002206761 A JP 2002206761A JP 2002206761 A JP2002206761 A JP 2002206761A JP 4283504 B2 JP4283504 B2 JP 4283504B2
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JP
Japan
Prior art keywords
ant
dovetail
silicon carbide
mortise
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002206761A
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English (en)
Japanese (ja)
Other versions
JP2003179124A (ja
JP2003179124A5 (enExample
Inventor
トーマス・ペイン
ジテンドラ・エス・ゴエラ
リー・イー・バーンズ
マイケル・エー・ピカリング
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Co
Original Assignee
Rohm and Haas Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Co filed Critical Rohm and Haas Co
Publication of JP2003179124A publication Critical patent/JP2003179124A/ja
Publication of JP2003179124A5 publication Critical patent/JP2003179124A5/ja
Application granted granted Critical
Publication of JP4283504B2 publication Critical patent/JP4283504B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S206/00—Special receptacle or package
    • Y10S206/832—Semiconductor wafer boat

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2002206761A 2001-07-16 2002-07-16 ウェーハ保持装置 Expired - Fee Related JP4283504B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US30576401P 2001-07-16 2001-07-16
US60/305764 2001-07-16

Publications (3)

Publication Number Publication Date
JP2003179124A JP2003179124A (ja) 2003-06-27
JP2003179124A5 JP2003179124A5 (enExample) 2008-11-13
JP4283504B2 true JP4283504B2 (ja) 2009-06-24

Family

ID=23182234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002206761A Expired - Fee Related JP4283504B2 (ja) 2001-07-16 2002-07-16 ウェーハ保持装置

Country Status (5)

Country Link
US (1) US6811040B2 (enExample)
EP (1) EP1289002A3 (enExample)
JP (1) JP4283504B2 (enExample)
KR (1) KR100880410B1 (enExample)
TW (1) TWI226078B (enExample)

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US6825123B2 (en) * 2003-04-15 2004-11-30 Saint-Goban Ceramics & Plastics, Inc. Method for treating semiconductor processing components and components formed thereby
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US20050145584A1 (en) * 2004-01-06 2005-07-07 Buckley Richard F. Wafer boat with interference fit wafer supports
US7501370B2 (en) 2004-01-06 2009-03-10 Saint-Gobain Ceramics & Plastics, Inc. High purity silicon carbide wafer boats
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US20060027171A1 (en) * 2004-08-06 2006-02-09 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer boat for reducing wafer warpage
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US20060283770A1 (en) * 2005-06-03 2006-12-21 Applied Materials, Inc. Transportation fixture and package for substrate rack
TWI463587B (zh) * 2005-07-08 2014-12-01 Asyst Technologies 工件支撐結構及使用該結構之裝置
US7828158B2 (en) * 2005-07-14 2010-11-09 Displays Plus, Inc. Merchandise dispensing apparatus providing theft deterrence
TWI402929B (zh) * 2006-06-02 2013-07-21 羅門哈斯電子材料有限公司 具有圓角半徑接合器之裝置
JP5205737B2 (ja) 2006-10-13 2013-06-05 株式会社Ｓｕｍｃｏ シリコンウェーハの保持方法および保持治具
US20080220150A1 (en) * 2007-03-05 2008-09-11 Applied Materials, Inc. Microbatch deposition chamber with radiant heating
US8317449B2 (en) * 2007-03-05 2012-11-27 Applied Materials, Inc. Multiple substrate transfer robot
TWI361469B (en) * 2007-03-09 2012-04-01 Rohm & Haas Elect Mat Chemical vapor deposited silicon carbide articles
US20090004405A1 (en) * 2007-06-29 2009-01-01 Applied Materials, Inc. Thermal Batch Reactor with Removable Susceptors
US20090071918A1 (en) * 2007-09-18 2009-03-19 Panchapakesan Ramanarayanan Vertical semiconductor wafer carrier
US8058174B2 (en) * 2007-12-20 2011-11-15 Coorstek, Inc. Method for treating semiconductor processing components and components formed thereby
WO2009105635A2 (en) * 2008-02-21 2009-08-27 Saint-Gobain Ceramics & Plastics, Inc. Ceramic paddle
TWD140831S1 (zh) * 2008-03-28 2011-06-01 東京威力科創股份有限公司 半導體製造用保溫筒之基台
USD600222S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD600221S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
WO2011027823A1 (ja) * 2009-09-02 2011-03-10 本田技研工業株式会社 搬送ラック、金属リングの保持方法及び熱処理方法
WO2011049938A2 (en) * 2009-10-20 2011-04-28 Saint-Gobain Ceramics & Plastics, Inc. Microelectronic processing component having a corrosion-resistant layer, microelectronic workpiece processing apparatus incorporating same, and method of forming an article having the corrosion-resistant layer
USD655682S1 (en) * 2010-06-18 2012-03-13 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD655255S1 (en) * 2010-06-18 2012-03-06 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
KR101035552B1 (ko) * 2011-03-24 2011-05-23 (주)상아프론테크 솔라웨이퍼 카세트
USD714369S1 (en) 2011-11-23 2014-09-30 Coorstek, Inc. Wafer paddle
USD763807S1 (en) * 2014-05-22 2016-08-16 Hzo, Inc. Boat for a deposition apparatus
TWM447450U (zh) * 2012-08-24 2013-02-21 Wistron Corp 支撐結構、卡榫與具有其之支撐架
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
TWD166332S (zh) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 基板處理裝置用晶舟之部分
TWD163542S (zh) * 2013-03-22 2014-10-11 日立國際電氣股份有限公司 基板處理裝置用晶舟
KR101495901B1 (ko) * 2013-07-03 2015-02-26 주식회사 월덱스 세라믹소재의 보트 결합 구조 및 그 접합 방법
JP1537312S (enExample) * 2014-11-20 2015-11-09
JP1537630S (enExample) * 2014-11-20 2015-11-09
JP1537313S (enExample) * 2014-11-20 2015-11-09
JP6322159B2 (ja) * 2015-06-10 2018-05-09 クアーズテック株式会社 ウエハボート及びその製造方法
KR101772180B1 (ko) * 2016-02-02 2017-08-29 (주)앤피에스 기판 지지 장치 및 이를 포함하는 기판 처리 장치
JP1563649S (enExample) * 2016-02-12 2016-11-21
JP6770461B2 (ja) * 2017-02-21 2020-10-14 クアーズテック株式会社 縦型ウエハボート
JP7030604B2 (ja) * 2018-04-19 2022-03-07 三菱電機株式会社 ウエハボートおよびその製造方法
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
USD908102S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD908103S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
KR102552458B1 (ko) * 2019-07-31 2023-07-06 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 기판 지지구 및 반도체 장치의 제조 방법
CN110666992A (zh) * 2019-08-27 2020-01-10 北京灵禾科技发展有限公司 一种长晶舟及制备工艺
CN112687597B (zh) * 2020-12-25 2022-08-05 集美大学 一种高温基片退火架
JP7364275B1 (ja) 2022-06-07 2023-10-18 株式会社フェローテックホールディングス ウェハボート
JP1741512S (enExample) * 2022-09-14 2023-04-11
JP1741513S (enExample) * 2022-09-14 2023-04-11

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Also Published As

Publication number Publication date
TWI226078B (en) 2005-01-01
EP1289002A2 (en) 2003-03-05
KR100880410B1 (ko) 2009-01-23
KR20030007136A (ko) 2003-01-23
JP2003179124A (ja) 2003-06-27
US20030024888A1 (en) 2003-02-06
EP1289002A3 (en) 2007-01-24
US6811040B2 (en) 2004-11-02

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