JP4267285B2 - 基体上に金属層を堆積させるためのメッキ浴および方法 - Google Patents

基体上に金属層を堆積させるためのメッキ浴および方法 Download PDF

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Publication number
JP4267285B2
JP4267285B2 JP2002289341A JP2002289341A JP4267285B2 JP 4267285 B2 JP4267285 B2 JP 4267285B2 JP 2002289341 A JP2002289341 A JP 2002289341A JP 2002289341 A JP2002289341 A JP 2002289341A JP 4267285 B2 JP4267285 B2 JP 4267285B2
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JP
Japan
Prior art keywords
copper
bath
plating bath
plating
metal
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Expired - Fee Related
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JP2002289341A
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English (en)
Japanese (ja)
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JP2003113490A5 (https=
JP2003113490A (ja
Inventor
アンドリュー・ジェイ・コブリー
マーク・ジェイ・カペッカス
エリック・レディントン
ウェイド・ソンネンバーグ
レオン・アール・バースタッド
トーマス・バックリー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials LLC
DuPont Electronic Materials International LLC
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Application filed by Rohm and Haas Electronic Materials LLC, DuPont Electronic Materials International LLC filed Critical Rohm and Haas Electronic Materials LLC
Publication of JP2003113490A publication Critical patent/JP2003113490A/ja
Publication of JP2003113490A5 publication Critical patent/JP2003113490A5/ja
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Publication of JP4267285B2 publication Critical patent/JP4267285B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2002289341A 2001-10-02 2002-10-02 基体上に金属層を堆積させるためのメッキ浴および方法 Expired - Fee Related JP4267285B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/970271 2001-10-02
US09/970,271 US6652731B2 (en) 2001-10-02 2001-10-02 Plating bath and method for depositing a metal layer on a substrate

Publications (3)

Publication Number Publication Date
JP2003113490A JP2003113490A (ja) 2003-04-18
JP2003113490A5 JP2003113490A5 (https=) 2006-07-13
JP4267285B2 true JP4267285B2 (ja) 2009-05-27

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ID=25516681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002289341A Expired - Fee Related JP4267285B2 (ja) 2001-10-02 2002-10-02 基体上に金属層を堆積させるためのメッキ浴および方法

Country Status (6)

Country Link
US (2) US6652731B2 (https=)
EP (1) EP1300486B1 (https=)
JP (1) JP4267285B2 (https=)
KR (1) KR20030028692A (https=)
DE (1) DE60144232D1 (https=)
TW (1) TW587104B (https=)

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US9045839B2 (en) * 2008-06-10 2015-06-02 General Electric Company Methods and systems for in-situ electroplating of electrodes
US20090301868A1 (en) * 2008-06-10 2009-12-10 General Electric Company Methods and systems for assembling electrolyzer stacks
US9657400B2 (en) * 2008-06-10 2017-05-23 General Electric Company Electrolyzer assembly method and system
US8277620B2 (en) * 2008-09-30 2012-10-02 General Electric Company Electrolyzer module forming method and system
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JP2012127003A (ja) 2010-12-15 2012-07-05 Rohm & Haas Electronic Materials Llc 銅層を均一にする電気めっき方法
EP2518187A1 (en) * 2011-04-26 2012-10-31 Atotech Deutschland GmbH Aqueous acidic bath for electrolytic deposition of copper
JP5851233B2 (ja) * 2011-12-22 2016-02-03 ローム・アンド・ハース電子材料株式会社 電解銅めっき液及び電解銅めっき方法
WO2017087907A1 (en) * 2015-11-20 2017-05-26 The Regents Of The University Of California Transition metal depositi0n and oxidation on symmetric metal oxide electrodes for storage application
CN105671622A (zh) * 2016-03-03 2016-06-15 佛山科学技术学院 一种电镀金装置
JP6621377B2 (ja) * 2016-06-07 2019-12-18 株式会社荏原製作所 めっき装置、めっき方法、及び記録媒体
US20180016689A1 (en) * 2016-07-18 2018-01-18 Rohm And Haas Electronic Materials Llc Indium electroplating compositions and methods for electroplating indium
US20180016690A1 (en) * 2016-07-18 2018-01-18 Rohm And Haas Electronic Materials Llc Indium electroplating compositions containing 2-imidazolidinethione compounds and methods for electroplating indium
US9809892B1 (en) * 2016-07-18 2017-11-07 Rohm And Haas Electronic Materials Llc Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium
US10428436B2 (en) * 2016-07-18 2019-10-01 Rohm And Haas Electronic Materials Llc Indium electroplating compositions containing amine compounds and methods of electroplating indium
CN114514340B (zh) 2019-07-26 2025-03-21 朗姆研究公司 先进封装应用的差别对比镀覆
US12305307B2 (en) 2020-01-10 2025-05-20 Lam Research Corporation TSV process window and fill performance enhancement by long pulsing and ramping
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Also Published As

Publication number Publication date
US20030085132A1 (en) 2003-05-08
DE60144232D1 (de) 2011-04-28
EP1300486B1 (en) 2011-03-16
US6652731B2 (en) 2003-11-25
US20040074778A1 (en) 2004-04-22
JP2003113490A (ja) 2003-04-18
TW587104B (en) 2004-05-11
KR20030028692A (ko) 2003-04-10
EP1300486A1 (en) 2003-04-09

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