KR20030028692A - 기판상에 금속층을 침착시키기 위한 도금조 및 방법 - Google Patents

기판상에 금속층을 침착시키기 위한 도금조 및 방법 Download PDF

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Publication number
KR20030028692A
KR20030028692A KR1020010079151A KR20010079151A KR20030028692A KR 20030028692 A KR20030028692 A KR 20030028692A KR 1020010079151 A KR1020010079151 A KR 1020010079151A KR 20010079151 A KR20010079151 A KR 20010079151A KR 20030028692 A KR20030028692 A KR 20030028692A
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KR
South Korea
Prior art keywords
alkyl
plating bath
copper
metal
aldehyde
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020010079151A
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English (en)
Korean (ko)
Inventor
코블리앤드류제이.
카펙커스마크제이.
레딩턴에릭
소넨버그웨이드
바스태드레온알.
버클리토마스
Original Assignee
쉬플리 캄파니, 엘.엘.씨.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쉬플리 캄파니, 엘.엘.씨. filed Critical 쉬플리 캄파니, 엘.엘.씨.
Publication of KR20030028692A publication Critical patent/KR20030028692A/ko
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020010079151A 2001-10-02 2001-12-14 기판상에 금속층을 침착시키기 위한 도금조 및 방법 Withdrawn KR20030028692A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/970,271 US6652731B2 (en) 2001-10-02 2001-10-02 Plating bath and method for depositing a metal layer on a substrate
US09/970,271 2001-10-02

Publications (1)

Publication Number Publication Date
KR20030028692A true KR20030028692A (ko) 2003-04-10

Family

ID=25516681

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020010079151A Withdrawn KR20030028692A (ko) 2001-10-02 2001-12-14 기판상에 금속층을 침착시키기 위한 도금조 및 방법

Country Status (6)

Country Link
US (2) US6652731B2 (https=)
EP (1) EP1300486B1 (https=)
JP (1) JP4267285B2 (https=)
KR (1) KR20030028692A (https=)
DE (1) DE60144232D1 (https=)
TW (1) TW587104B (https=)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100845189B1 (ko) * 2000-12-20 2008-07-10 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 전해적 구리 도금액 및 이의 제어법
JP4310086B2 (ja) * 2002-08-01 2009-08-05 株式会社日立製作所 エンジン用電子機器
KR100675628B1 (ko) * 2002-10-16 2007-02-01 엘지.필립스 엘시디 주식회사 절연막 식각장치 및 식각방법
DE10337669B4 (de) * 2003-08-08 2006-04-27 Atotech Deutschland Gmbh Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung
JP2006283169A (ja) * 2005-04-04 2006-10-19 Okuno Chem Ind Co Ltd 酸性電気銅めっき液、及び含硫黄有機化合物の電解消耗量の少ない電気銅めっき方法
GB0507887D0 (en) * 2005-04-20 2005-05-25 Rohm & Haas Elect Mat Immersion method
US7888419B2 (en) * 2005-09-02 2011-02-15 Naturalnano, Inc. Polymeric composite including nanoparticle filler
US20070148457A1 (en) * 2005-09-14 2007-06-28 Naturalnano, Inc. Radiation absorptive composites and methods for production
JP4759416B2 (ja) * 2006-03-20 2011-08-31 新光電気工業株式会社 非シアン無電解金めっき液及び無電解金めっき方法
ES2669050T3 (es) * 2006-03-31 2018-05-23 Atotech Deutschland Gmbh Depósito de cromo cristalino
US7575666B2 (en) * 2006-04-05 2009-08-18 James Watkowski Process for electrolytically plating copper
TWI347373B (en) * 2006-07-07 2011-08-21 Rohm & Haas Elect Mat Formaldehyde free electroless copper compositions
US8124678B2 (en) * 2006-11-27 2012-02-28 Naturalnano, Inc. Nanocomposite master batch composition and method of manufacture
DE102007002321B4 (de) * 2007-01-16 2018-07-05 Volkswagen Ag Schraubenfeder mit Korrosionsschutz
US8648132B2 (en) * 2007-02-07 2014-02-11 Naturalnano, Inc. Nanocomposite method of manufacture
US20090326133A1 (en) * 2007-05-23 2009-12-31 Naturalnano Research, Inc. Fire and flame retardant polymer composites
US7887693B2 (en) * 2007-06-22 2011-02-15 Maria Nikolova Acid copper electroplating bath composition
US7858146B2 (en) 2007-06-29 2010-12-28 Rohm And Haas Electronic Materials Llc Method of electrolessly depositing metal on the walls of through-holes
BRPI0817924B1 (pt) 2007-10-02 2019-02-12 Atotech Deutschland Gmbh Depósito de liga de cromo funcional cristalino eletrodepositado, banho de eletrodeposição para eletrodepositar um depósito de liga de cromo funcional cristalinonanogranular, e processo para eletrodepositar um depósito de liga de cromo cristalino funcional nanogranular em um substrato
US9045839B2 (en) * 2008-06-10 2015-06-02 General Electric Company Methods and systems for in-situ electroplating of electrodes
US20090301868A1 (en) * 2008-06-10 2009-12-10 General Electric Company Methods and systems for assembling electrolyzer stacks
US9657400B2 (en) * 2008-06-10 2017-05-23 General Electric Company Electrolyzer assembly method and system
US8277620B2 (en) * 2008-09-30 2012-10-02 General Electric Company Electrolyzer module forming method and system
US9080242B2 (en) * 2008-09-30 2015-07-14 General Electric Company Pressurized electrolysis stack with thermal expansion capability
US8268155B1 (en) 2009-10-05 2012-09-18 Novellus Systems, Inc. Copper electroplating solutions with halides
JP2012127003A (ja) 2010-12-15 2012-07-05 Rohm & Haas Electronic Materials Llc 銅層を均一にする電気めっき方法
EP2518187A1 (en) * 2011-04-26 2012-10-31 Atotech Deutschland GmbH Aqueous acidic bath for electrolytic deposition of copper
JP5851233B2 (ja) * 2011-12-22 2016-02-03 ローム・アンド・ハース電子材料株式会社 電解銅めっき液及び電解銅めっき方法
WO2017087907A1 (en) * 2015-11-20 2017-05-26 The Regents Of The University Of California Transition metal depositi0n and oxidation on symmetric metal oxide electrodes for storage application
CN105671622A (zh) * 2016-03-03 2016-06-15 佛山科学技术学院 一种电镀金装置
JP6621377B2 (ja) * 2016-06-07 2019-12-18 株式会社荏原製作所 めっき装置、めっき方法、及び記録媒体
US20180016689A1 (en) * 2016-07-18 2018-01-18 Rohm And Haas Electronic Materials Llc Indium electroplating compositions and methods for electroplating indium
US20180016690A1 (en) * 2016-07-18 2018-01-18 Rohm And Haas Electronic Materials Llc Indium electroplating compositions containing 2-imidazolidinethione compounds and methods for electroplating indium
US9809892B1 (en) * 2016-07-18 2017-11-07 Rohm And Haas Electronic Materials Llc Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium
US10428436B2 (en) * 2016-07-18 2019-10-01 Rohm And Haas Electronic Materials Llc Indium electroplating compositions containing amine compounds and methods of electroplating indium
CN114514340B (zh) 2019-07-26 2025-03-21 朗姆研究公司 先进封装应用的差别对比镀覆
US12305307B2 (en) 2020-01-10 2025-05-20 Lam Research Corporation TSV process window and fill performance enhancement by long pulsing and ramping
CN114774937B (zh) * 2022-06-27 2022-09-16 深圳市板明科技股份有限公司 一种线路板电镀用环保型无机酸性除油剂和除油方法
CN118547346B (zh) * 2024-06-13 2025-02-25 惠州市荣安达化工有限公司 一种用于电路板的电镀液及电镀工艺

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2733198A (en) * 1956-01-31 Acid copper plating bath
DE962489C (de) * 1954-02-10 1957-04-25 Dehydag Gmbh Sparbeizmittel zum Schutze von Metallen bei der Behandlung mit sauren Mitteln
BE534701A (https=) * 1954-03-22
DE1152863B (de) * 1957-03-16 1963-08-14 Riedel & Co Saure Baeder zur Herstellung von einebnenden Kupferueberzuegen
US3288690A (en) * 1962-04-16 1966-11-29 Udylite Corp Electrodeposition of copper from acidic baths
NL291575A (https=) * 1962-04-16
US3758386A (en) * 1966-11-02 1973-09-11 M & T Chemicals Inc Novel zinc plating process
US3616446A (en) * 1969-03-28 1971-10-26 Ppg Industries Inc Method of coating an electrode
US3682788A (en) * 1970-07-28 1972-08-08 M & T Chemicals Inc Copper electroplating
US3770598A (en) 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
US3725220A (en) * 1972-04-27 1973-04-03 Lea Ronal Inc Electrodeposition of copper from acidic baths
US4104138A (en) * 1977-06-07 1978-08-01 M&T Chemicals Inc. Brass plating
US4137133A (en) * 1977-12-15 1979-01-30 M&T Chemicals Inc. Acid zinc electroplating process and composition
US4168214A (en) * 1978-06-14 1979-09-18 American Chemical And Refining Company, Inc. Gold electroplating bath and method of making the same
JPS5672196A (en) 1979-11-19 1981-06-16 Shimizu Shoji Kk Bright plating bath for copper-tin alloy
US4417956A (en) 1980-07-17 1983-11-29 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4384930A (en) * 1981-08-21 1983-05-24 Mcgean-Rohco, Inc. Electroplating baths, additives therefor and methods for the electrodeposition of metals
US4469564A (en) 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
DE3339541C2 (de) 1983-11-02 1986-08-07 Degussa Ag, 6000 Frankfurt Alkalisch-cyanidisches Bad zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen
JPS61272394A (ja) 1985-05-28 1986-12-02 Nippon Kagaku Sangyo Kk 銅−錫合金電気めつき浴
DE4126502C1 (https=) 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
GB2264717A (en) * 1992-03-06 1993-09-08 Zinex Corp Cyanide-free copper plating bath
AU3792693A (en) * 1992-03-06 1993-10-05 Zinex Corporation Cyanide-free copper plating bath and process
JP3279245B2 (ja) 1998-02-19 2002-04-30 大阪府 タングステン合金の電気めっき方法
TW403685B (en) 1998-07-13 2000-09-01 Siemens Ag Device for laser processing of workpiece
TW577938B (en) 1998-11-05 2004-03-01 Uyemura C & Co Ltd Tin-copper alloy electroplating bath and plating process therewith
EP1091023A3 (en) * 1999-10-08 2003-05-14 Shipley Company LLC Alloy composition and plating method
JP2001181889A (ja) 1999-12-22 2001-07-03 Nippon Macdermid Kk 光沢錫−銅合金電気めっき浴
KR100845189B1 (ko) * 2000-12-20 2008-07-10 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 전해적 구리 도금액 및 이의 제어법
JP4481541B2 (ja) * 2000-12-20 2010-06-16 日本リーロナール有限会社 電解銅めっき液および電解銅めっき液の管理方法

Also Published As

Publication number Publication date
US20030085132A1 (en) 2003-05-08
DE60144232D1 (de) 2011-04-28
EP1300486B1 (en) 2011-03-16
JP4267285B2 (ja) 2009-05-27
US6652731B2 (en) 2003-11-25
US20040074778A1 (en) 2004-04-22
JP2003113490A (ja) 2003-04-18
TW587104B (en) 2004-05-11
EP1300486A1 (en) 2003-04-09

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PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20011214

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid