JP4198375B2 - セレン化反応を利用する基板ボンディング法 - Google Patents

セレン化反応を利用する基板ボンディング法 Download PDF

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Publication number
JP4198375B2
JP4198375B2 JP2002093974A JP2002093974A JP4198375B2 JP 4198375 B2 JP4198375 B2 JP 4198375B2 JP 2002093974 A JP2002093974 A JP 2002093974A JP 2002093974 A JP2002093974 A JP 2002093974A JP 4198375 B2 JP4198375 B2 JP 4198375B2
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Japan
Prior art keywords
substrate
active
layer
base substrate
compound
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2002093974A
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English (en)
Japanese (ja)
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JP2003017375A (ja
JP2003017375A5 (https=
Inventor
ヘオン・リー
チュン・チン・ヤン
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HP Inc
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Hewlett Packard Co
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Publication of JP2003017375A publication Critical patent/JP2003017375A/ja
Publication of JP2003017375A5 publication Critical patent/JP2003017375A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1914—Preparing SOI wafers using bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/181—Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers

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  • Micromachines (AREA)
  • Recrystallisation Techniques (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Element Separation (AREA)
  • Photovoltaic Devices (AREA)
JP2002093974A 2001-03-30 2002-03-29 セレン化反応を利用する基板ボンディング法 Expired - Fee Related JP4198375B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/823550 2001-03-30
US09/823,550 US6537846B2 (en) 2001-03-30 2001-03-30 Substrate bonding using a selenidation reaction

Publications (3)

Publication Number Publication Date
JP2003017375A JP2003017375A (ja) 2003-01-17
JP2003017375A5 JP2003017375A5 (https=) 2005-04-07
JP4198375B2 true JP4198375B2 (ja) 2008-12-17

Family

ID=25239072

Family Applications (1)

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JP2002093974A Expired - Fee Related JP4198375B2 (ja) 2001-03-30 2002-03-29 セレン化反応を利用する基板ボンディング法

Country Status (5)

Country Link
US (1) US6537846B2 (https=)
EP (1) EP1246238B1 (https=)
JP (1) JP4198375B2 (https=)
CN (1) CN1286145C (https=)
DE (1) DE60220736T2 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6362075B1 (en) * 1999-06-30 2002-03-26 Harris Corporation Method for making a diffused back-side layer on a bonded-wafer with a thick bond oxide
JP2002305293A (ja) * 2001-04-06 2002-10-18 Canon Inc 半導体部材の製造方法及び半導体装置の製造方法
US6960490B2 (en) * 2002-03-14 2005-11-01 Epitactix Pty Ltd. Method and resulting structure for manufacturing semiconductor substrates
AU2002307578A1 (en) * 2002-04-30 2003-12-02 Agency For Science Technology And Research A method of wafer/substrate bonding
DE602004002888T2 (de) * 2003-05-13 2007-05-31 Becton Dickinson And Co. Vorrichtung und Verfahren zum Sanieren und Entsalzen von biologischen Proben
US7176106B2 (en) * 2003-06-13 2007-02-13 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging
US7407863B2 (en) 2003-10-07 2008-08-05 Board Of Trustees Of The University Of Illinois Adhesive bonding with low temperature grown amorphous or polycrystalline compound semiconductors
US7026189B2 (en) * 2004-02-11 2006-04-11 Hewlett-Packard Development Company, L.P. Wafer packaging and singulation method
US7422962B2 (en) * 2004-10-27 2008-09-09 Hewlett-Packard Development Company, L.P. Method of singulating electronic devices
FR2888402B1 (fr) * 2005-07-06 2007-12-21 Commissariat Energie Atomique Procede d'assemblage de substrats par depot d'une couche mince de collage d'oxyde ou de nitrure et structure ainsi assemblee
KR100829562B1 (ko) * 2006-08-25 2008-05-14 삼성전자주식회사 기판 접합 구조를 갖는 반도체 레이저 다이오드 및 그제조방법
US20100109115A1 (en) * 2008-11-03 2010-05-06 Ure Michael J Virtual IC wafers and bonding of constitutent IC films
US8748288B2 (en) 2010-02-05 2014-06-10 International Business Machines Corporation Bonded structure with enhanced adhesion strength
EP2654075B1 (de) 2010-03-31 2016-09-28 EV Group E. Thallner GmbH Verfahren zum permanenten Verbinden zweier Metalloberflächen
US9117948B1 (en) 2012-02-02 2015-08-25 The United States Of America As Represented By The Adminstrator Of National Aeronautics And Space Administration Selenium interlayer for high-efficiency multijunction solar cell
WO2017200705A1 (en) * 2016-05-20 2017-11-23 ARES Materials, Inc. Polymer substrate for flexible electronics microfabrication and methods of use
US10736212B2 (en) 2016-05-20 2020-08-04 Ares Materials Inc. Substrates for stretchable electronics and method of manufacture
EP3497714A1 (en) * 2016-08-09 2019-06-19 King Abdullah University Of Science And Technology A semiconductor device including monolithically integrated pmos and nmos transistors
CN107742606B (zh) * 2017-10-30 2024-04-02 桂林电子科技大学 一种键合晶圆的结构及其制备方法
CN110534644B (zh) * 2019-08-30 2021-01-15 华中科技大学 一种双向生长的超晶格相变单元的制备方法及相变存储器

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61182217A (ja) * 1985-02-08 1986-08-14 Toshiba Corp ウエハ接着方法
JPH0472608A (ja) * 1990-05-18 1992-03-06 Toshiba Corp 化合物半導体ウェハの製造方法および製造装置
JP2990036B2 (ja) 1995-02-13 1999-12-13 ティーディーケイ株式会社 光記録媒体およびその製造方法
JPH08316145A (ja) * 1995-05-12 1996-11-29 Fuji Electric Co Ltd 半導体薄膜の成膜方法
US5730852A (en) 1995-09-25 1998-03-24 Davis, Joseph & Negley Preparation of cuxinygazsen (X=0-2, Y=0-2, Z=0-2, N=0-3) precursor films by electrodeposition for fabricating high efficiency solar cells
JP2737748B2 (ja) * 1996-06-21 1998-04-08 日本電気株式会社 化合物半導体の接合方法
FR2751467B1 (fr) * 1996-07-17 1998-10-02 Commissariat Energie Atomique Procede d'assemblage de deux structures et dispositif obtenu par le procede. applications aux microlasers
JP3249408B2 (ja) 1996-10-25 2002-01-21 昭和シェル石油株式会社 薄膜太陽電池の薄膜光吸収層の製造方法及び製造装置
US6036772A (en) 1996-12-30 2000-03-14 Sony Corporation Method for making semiconductor device
US6258620B1 (en) * 1997-10-15 2001-07-10 University Of South Florida Method of manufacturing CIGS photovoltaic devices
US6323417B1 (en) * 1998-09-29 2001-11-27 Lockheed Martin Corporation Method of making I-III-VI semiconductor materials for use in photovoltaic cells
JP2000349266A (ja) * 1999-03-26 2000-12-15 Canon Inc 半導体部材の製造方法、半導体基体の利用方法、半導体部材の製造システム、半導体部材の生産管理方法及び堆積膜形成装置の利用方法
JP4465745B2 (ja) * 1999-07-23 2010-05-19 ソニー株式会社 半導体積層基板，半導体結晶基板および半導体素子ならびにそれらの製造方法

Also Published As

Publication number Publication date
US6537846B2 (en) 2003-03-25
DE60220736D1 (de) 2007-08-02
JP2003017375A (ja) 2003-01-17
CN1379436A (zh) 2002-11-13
EP1246238A3 (en) 2003-11-26
DE60220736T2 (de) 2008-03-13
CN1286145C (zh) 2006-11-22
EP1246238B1 (en) 2007-06-20
US20030017679A1 (en) 2003-01-23
EP1246238A2 (en) 2002-10-02

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